市場調查報告書
商品編碼
1379113
熱管理技術市場:2023-2028 年全球產業趨勢、佔有率、規模、成長、機會與預測Thermal Management Technologies Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028 |
2022年全球熱管理技術市場規模達127億美元。展望未來, IMARC Group預計到2028年市場規模將達到200億美元,2022-2028年複合年成長率(CAGR)為7.9%。
熱管理技術是用於監控和管理電子設備和電路產生的過多熱量的系統。它涉及在電子設備內使用各種基板來有效散熱。一些常用的熱管理材料包括黏性和非黏性材料,例如熱墊、間隙填充物、相變材料 (PCM) 和油。它們在安裝和校準過程中用於消費性電子產品、伺服器和資料中心的各種傳導、對流、進階和混合冷卻系統。它們有助於防止故障並延長設備的使用壽命,並在汽車、國防、航空航太和電信等各個行業中廣泛使用。
全球電子電氣產業的顯著成長是創造積極市場前景的關鍵因素之一。隨著消費性電子產品製造技術的進步,對具有更高功率密度的小型化設備的需求不斷增加。這反過來又積極影響了對熱管理技術的需求,以最大限度地減少這些設備產生的高熱通量。與此一致,熱管理技術在各種汽車以及電動和混合動力汽車中的廣泛採用也促進了市場的成長。此外,技術進步,例如噴射衝擊機制、冷板、熱蒸汽室和冷卻晶片的發展,也是其他成長誘導因素。這些創新解決方案用作主動冷卻劑,並嵌入微流體和多相傳熱技術,以提高電腦和其他耗電設備的熱阻和性能。其他因素,包括不斷成長的支出能力以及廣泛的研發(R&D)活動預計將推動市場成長。
The global thermal management technologies market size reached US$ 12.7 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 20.0 Billion by 2028, exhibiting a growth rate (CAGR) of 7.9% during 2022-2028.
Thermal management technologies are the systems used for monitoring and managing the excessive heat generated from electronic devices and circuitry. It involves the use of various substrate within the electronic devices for efficient dissipation of heat. Some of the commonly used thermal management materials include adhesive and non-adhesive materials, such as thermal cushions, gap fillers, phase change materials (PCMs) and oil. They are utilized in various conduction, convection, advanced and hybrid cooling systems of consumer electronics, servers and data centers during installation and calibration. They aid in preventing failures and enhancing the operational life of the equipment and find extensive applications across various industries, such as automotive, defense, aerospace and telecommunication.
Significant growth in the electronic and electrical industries across the globe is one of the key factors creating a positive outlook for the market. With improvements in the manufacturing technologies of consumer electronics, there is an increasing demand for miniaturized devices with enhanced power densities. This, in turn, has positively impacted the demand for thermal management technologies for minimizing the high heat flux generated by these devices. In line with this, the widespread adoption of thermal management technologies in various automobiles and electric and hybrid vehicles is also contributing to the growth of the market. Additionally, technological advancements, such as the development of jet impingement mechanisms, cold plates, heat vapor chambers and cool chips, are acting as other growth-inducing factors. These innovative solutions are used as active cooling agents and are embedded with micro fluids and multi-phase heat transfer technologies to improve thermal resistance and performance of computers and other power-intensive devices. Other factors, including rising expenditure capacities, along with extensive research and development (R&D) activities are anticipated to drive the market toward growth.
IMARC Group provides an analysis of the key trends in each sub-segment of the global thermal management technologies market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on product and application.
Hardware
Software
Interface
Substrates
Computers
Consumer Electronics
Telecommunication
Automotive
Renewable Energy
Others
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being Advanced Cooling Technologies Inc., Autoneum Holding AG, Gentherm Inc., Heatex Inc. (Madison Industries), Henkel AG & Co. KGaA, Honeywell International Inc., Laird Thermal Systems Inc., Momentive Performance Materials Inc., Parker-Hannifin Corp. and Thermal Management Technologies.