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市場調查報告書
CMP技術,產品及市場相關分析CMP Equipment and Consumables: Market Analysis and Forecasts |
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出版商 | Information Network | 商品編碼 | 4965 | ||||
出版日期 | 內容資訊 | 英文 215 PAGES 商品交期: 2-3個工作天內 |
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CMP技術,產品及市場相關分析 CMP Equipment and Consumables: Market Analysis and Forecasts | ||
出版日期: 2020年12月01日 | 內容資訊: 英文 215 PAGES |
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本報告提供CMP平坦化技術概要,用途,消費品,CMP設備的業者簡介,用戶的課題及市場相關預測等,概述如下。
Chemical mechanical planarization (CMP) is a very important process in semiconductor manufacturing. The combination of mechanical abrasion and chemical etching enable polishing and flattening of wafers before the photolithography stage. This helps in avoiding the depth of field issues during illumination.
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.