CMP Equipment and Consumables: Market Analysis and Forecasts
|出版日期||內容資訊||英文 215 PAGES
|CMP技術，產品及市場相關分析 CMP Equipment and Consumables: Market Analysis and Forecasts|
|出版日期: 2020年12月01日||內容資訊: 英文 215 PAGES||
Chemical mechanical planarization (CMP) is a very important process in semiconductor manufacturing. The combination of mechanical abrasion and chemical etching enable polishing and flattening of wafers before the photolithography stage. This helps in avoiding the depth of field issues during illumination.
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.