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市場調查報告書
商品編碼
1333453

3D TSV 裝置的全球市場

3D TSV Devices

出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 338 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

到 2030 年,全球 3D TSV 裝置市場將達到 277 億美元

在不斷變化的後COVID-19商業環境中,3D TSV設備的全球市場預計2022年為59億美元,到2030年將修正為277億美元,2022-2030年分析期間成長21.3美元. 預計年複合成長率%。記憶體是本報告分析的細分市場之一,預計複合年成長率為 20.7%,到分析期結束時將達到 80 億美元。鑑於疫情后的持續復甦,MEMS 細分市場未來八年的年複合成長率已調整為 22.5%。

美國市場估計為9.543億美元,中國預計複合年成長率為25.1%

到 2022 年,美國3D TSV 裝置市場預計將達到 9.543 億美元。中國作為世界第二大經濟體,預計在2022年至2030年的分析期間將以25.1%的年複合成長率成長,到2030年市場規模將達到84億美元。其他值得注意的地域市場包括日本和加拿大,預計 2022 年至 2030 年將分別成長 16.2% 和 17.8%。在歐洲,德國的年複合成長率預計約為 16.2%。

受訪企業示例

  • IBM Corporation
  • Dai Nippon Printing Co., Ltd.
  • Amkor Technology, Inc.
  • ASM Pacific Technology Ltd.
  • Globalfoundries, Inc.
  • Himax Technologies, Inc.
  • ASE Technology Holding Co., Ltd.
  • FRT GmbH
  • GS Nanotech
  • GalaxyCore Inc.
  • Gpixel, Inc.
  • Heliotis AG
  • Hill Technical Sales Corporation
  • CORIAL
  • Guangdong OPPO Mobile Telecommunications Corp., Ltd.

目錄

第1章 調查方法

第2章 執行摘要

  • 市場概況
  • 主要企業
  • 市場趨勢和促進因素
  • 產品概述
  • 全球市場預測

第3章 市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲國家
  • 亞太地區
  • 世界其他地區

第4章 競爭

簡介目錄
Product Code: MCP-7927

What`s New for 2023?

»Special coverage on Russia-Ukraine war; global inflation; easing of "zero-Covid" policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.

»Global competitiveness and key competitor percentage market shares

» Market presence across multiple geographies - Strong/Active/Niche/Trivial

»Online interactive peer-to-peer collaborative bespoke updates

»Access to our digital archives and MarketGlass Research Platform

»Complimentary updates for one year

Looking Ahead to 2023

The global economy is at a critical crossroads with a number of interlocking challenges and crises running in parallel. The uncertainty around how Russia`s war on Ukraine will play out this year and the war`s role in creating global instability means that the trouble on the inflation front is not over yet. Food and fuel inflation will remain a persistent economic problem. Higher retail inflation will impact consumer confidence and spending. As governments combat inflation by raising interest rates, new job creation will slowdown and impact economic activity and growth. Lower capital expenditure is in the offing as companies go slow on investments, held back by inflation worries and weaker demand. With slower growth and high inflation, developed markets seem primed to enter into a recession. Fears of new COVID outbreaks and China's already uncertain post-pandemic path poses a real risk of the world experiencing more acute supply chain pain and manufacturing disruptions this year. Volatile financial markets, growing trade tensions, stricter regulatory environment and pressure to mainstream climate change into economic decisions will compound the complexity of challenges faced. Year 2023 is expected to be tough year for most markets, investors and consumers. Nevertheless, there is always opportunity for businesses and their leaders who can chart a path forward with resilience and adaptability.

Global 3D TSV Devices Market to Reach $27.7 Billion by 2030

In the changed post COVID-19 business landscape, the global market for 3D TSV Devices estimated at US$5.9 Billion in the year 2022, is projected to reach a revised size of US$27.7 Billion by 2030, growing at a CAGR of 21.3% over the analysis period 2022-2030. Memory, one of the segments analyzed in the report, is projected to record a 20.7% CAGR and reach US$8 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Mems segment is readjusted to a revised 22.5% CAGR for the next 8-year period.

The U.S. Market is Estimated at $954.3 Million, While China is Forecast to Grow at 25.1% CAGR

The 3D TSV Devices market in the U.S. is estimated at US$954.3 Million in the year 2022. China, the world`s second largest economy, is forecast to reach a projected market size of US$8.4 Billion by the year 2030 trailing a CAGR of 25.1% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 16.2% and 17.8% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 16.2% CAGR.

Select Competitors (Total 68 Featured) -

  • IBM Corporation
  • Dai Nippon Printing Co., Ltd.
  • Amkor Technology, Inc.
  • ASM Pacific Technology Ltd.
  • Globalfoundries, Inc.
  • Himax Technologies, Inc.
  • ASE Technology Holding Co., Ltd.
  • FRT GmbH
  • GS Nanotech
  • GalaxyCore Inc.
  • Gpixel, Inc.
  • Heliotis AG
  • Hill Technical Sales Corporation
  • CORIAL
  • Guangdong OPPO Mobile Telecommunications Corp., Ltd.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • 3D TSV Devices - Global Key Competitors Percentage Market Share in 2022 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
    • Impact of COVID-19 Pandemic and Looming Global Recession: 2020 Marked as a Year of Disruption & Transformation
    • World Economic Growth Projections (Real GDP, Annual % Change) for 2020 through 2022
    • Impact of COVID-19 on the Semiconductor Industry Exposes the Risk of Value Chain Modularity
    • Among the Hammered Companies in the Supply Chain is the "Semiconductor Industry"
    • Measuring the Impact of COVID-19 on the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020
    • Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020
    • Semiconductor Trends for Specific End-Use Categories
    • COVID-19 Pandemic Storm Warrants New Strategies to Help Semiconductor Leaders Secure New Lease of Life
    • Falling Consumer Confidence Impacts Sales of Automotive and Consumer Electronics
    • Industrial Activity Remain Subdued in 2020
    • Global PMI Index Points for the Years 2018, 2019 & 2020
    • A Prelude to 3D TVS
    • Comparison of 3D TSV with Other 3D IC Integration Technologies: A Snapshot
    • Global Market Prospects & Outlook
    • Regional Analysis
    • Global Market for 3D TSV Devices: Percentage Breakdown of Sales for Developed and Developing Regions (2021 & 2027)
    • Global Market for 3D TSV Devices - Geographic Regions Ranked by % CAGR (Sales) for 2020-2027: China, Asia-Pacific, Rest of World, USA, Canada, Europe, and Japan
    • Competitive Scenario
    • Foundries Stay Ahead in 3D TSV Device Manufacturing
    • IDMs Include 3D TSV Technology in their Wafer Processing Units
    • OSAT Companies Vie for Place in 3D TSV Landscape
    • Advantages & Limitations for Foundries, IDMs, and OSATs Operating in 3D TSV Landscape: A Snapshot
    • Recent Market Activity
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • 3D TSV Devices Market Strongly Influenced by Trends in Consumer Electronics Sector
    • Post Pandemic Recovery in CE Sector to Augment Prospects
    • Worldwide Shipments of Smartphones, Tablets, and Laptops (in Million Units) for the Years 2019, 2021 and 2023
    • Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022
    • A Review of Key CE Products Driving Adoption of 3D TSV Technology
    • Smartphones
    • Smartphone Penetration Rate as Share of Total Population: 2016-2021
    • Tablet PCs
    • Uptrend in 3D IC Technology Augments Business Case
    • Fast Evolving 3D IC Technology to Spur Demand
    • Digital Transformation Drive to Steer Future Growth of 3D TSV Market
    • Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
    • IoT Ecosystem to Rev Up Opportunities for 3D TSV Devices
    • Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
    • Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
    • Global IoT Market (In US$ Billion) by Industry for the Years 2018 and 2022
    • World IoT Semiconductors Market by Function (2018 & 2022): Percentage Breakdown of Value Sales for Communications, Processing, and Sensing
    • AI Hardware: Potential New Growth Avenue
    • Global AI Semiconductor Market (In US$ Billion) for Years 2020, 2023 & 2025
    • Automobile Electronification Trends Widen the Addressable Market
    • Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
    • World Automobile Production in Million Units: 2008-2022
    • Anticipated Post COVID Recovery to Revive Opportunities in Aerospace Sector
    • Commercial Airline Revenue Growth (in %) for 2010-2020
    • Global Airlines Performance by Region: 2020 Vs 2019
    • Sustained High Growth in ICT Sector Augurs Well
    • World Internet Penetration Rate (in %) by Geographic Region: June 2021
    • Global IP Traffic Volume in Exabytes for the Years 2019 and 2022
    • Breakdown of Global IP Traffic by Application Type (in %): 2019 & 2022
    • Global Wireless Communication Market (2018 & 2020): Percentage Breakdown of Traffic Volume by Mobile Device Type
    • Ongoing Proliferation of Cloud-Based Applications to Encourage Adoption of 3D TSV Devices
    • Global Public Cloud Computing Market (in US$ Billion) by Segment for the Years 2019 and 2022
    • Key Benefits Driving Adoption of Cloud Services of Large, Medium and Small Businesses
    • Growing Performance Requirements of Modern Data Centers to Extend Opportunities for 3D TSV Devices
    • Data Center Traffic Trends: A Complementary Review
    • Global Data Center IP Traffic Breakdown (in %) by Cloud and Traditional Data Centers for the Years 2017, 2019 and 2021
    • 3D TSV Gaining Traction in DRAM Memory Sector
    • A Review of Next-Generation TSV-based DRAM Memory Solutions
    • Mobile DRAM - LPDDR3 Vs. Wide IO
    • Growing Market for MEMS to Fuel Market Expansion
    • Wearable Devices to Extend High-Quality Opportunities
    • 3D TSV Devices Sense large Opportunities in CMOS Image Sensors Vertical
    • Global CMOS Image Sensor (CIS) Package Solutions Market (2021): Percentage Share Breakdown of Volume Shipments by Technology
    • Use of CMOS Image Sensor (CIS) by Sector & Device/Equipment
    • Imaging & Optoelectronics: An Important End-Use Segment for 3D TSV
    • 3D TSV Sees Growth in Advanced LED Packaging
    • 3D WLCSP: A Mature 3D TSV Segment
    • DRIE Bosch Process Gaining Prominence in TSV Implementation
    • System-Level Exploration and 3D Floorplanning Technique Enhance Performance of 3D IC Devices
    • Demand for Innovative Databases and Wireless Routing Augment Market Demand
    • Issues
  • PRODUCT OVERVIEW
    • An Insight into Through-Silicon Via (TSV)
    • An Introduction to Through-silicon via (TSV) Devices
    • Benefits of 3D TSV Devices
    • Historical Timeline
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for 3D TSV Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 2: World Historic Review for 3D TSV Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 3: World 15-Year Perspective for 3D TSV Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2023 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 5: World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 6: World 15-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2023 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 8: World Historic Review for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 9: World 15-Year Perspective for MEMS by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2023 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for CMOS Image Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 11: World Historic Review for CMOS Image Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 12: World 15-Year Perspective for CMOS Image Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2023 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 14: World Historic Review for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 15: World 15-Year Perspective for Imaging & Optoelectronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2023 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Advanced LED Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 17: World Historic Review for Advanced LED Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 18: World 15-Year Perspective for Advanced LED Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2023 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for Other Products by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 20: World Historic Review for Other Products by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 21: World 15-Year Perspective for Other Products by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2023 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 23: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 24: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2023 & 2030
    • TABLE 25: World Recent Past, Current & Future Analysis for Information & Communication Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 26: World Historic Review for Information & Communication Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 27: World 15-Year Perspective for Information & Communication Technology by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2023 & 2030
    • TABLE 28: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 29: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 30: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2023 & 2030
    • TABLE 31: World Recent Past, Current & Future Analysis for Military, Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 32: World Historic Review for Military, Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 33: World 15-Year Perspective for Military, Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2023 & 2030
    • TABLE 34: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 35: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 36: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2023 & 2030
    • TABLE 37: World 3D TSV Devices Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
    • Demand for Performance-Rich Consumer Electronics Puts Focus on 3D TSV Devices
    • Demand for MEMS Technologies in Mobile & Automotive Sector to Create Opportunities for 3D TSV Devices
    • TABLE 38: USA Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 40: USA 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 41: USA Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 43: USA 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030
  • CANADA
    • TABLE 44: Canada Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 45: Canada Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 46: Canada 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 47: Canada Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 48: Canada Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 49: Canada 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030
  • JAPAN
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
    • Market Overview
    • Japanese Semiconductor Materials Market (2015, 2019 & 2020): Annual Sales in US$ Million
    • TABLE 50: Japan Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 51: Japan Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 52: Japan 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 53: Japan Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 54: Japan Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 55: Japan 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030
  • CHINA
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
    • Market Overview
    • Chinese Semiconductor Materials Market (2015, 2019 & 2020): Annual Sales in US$ Million
    • TABLE 56: China Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 57: China Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 58: China 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 59: China Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 60: China Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 61: China 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030
  • EUROPE
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
    • TABLE 62: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
    • TABLE 63: Europe Historic Review for 3D TSV Devices by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 64: Europe 15-Year Perspective for 3D TSV Devices by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2023 & 2030
    • TABLE 65: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 66: Europe Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 67: Europe 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 68: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 69: Europe Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 70: Europe 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030
  • FRANCE
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
    • TABLE 71: France Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 72: France Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 73: France 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 74: France Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 75: France Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 76: France 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030
  • GERMANY
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
    • TABLE 77: Germany Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 78: Germany Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 79: Germany 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 80: Germany Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 81: Germany Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 82: Germany 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030
  • ITALY
    • TABLE 83: Italy Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 84: Italy Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 85: Italy 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 86: Italy Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 87: Italy Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 88: Italy 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030
  • UNITED KINGDOM
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
    • TABLE 89: UK Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 90: UK Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 91: UK 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 92: UK Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 93: UK Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 94: UK 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030
  • REST OF EUROPE
    • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 96: Rest of Europe Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 97: Rest of Europe 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 98: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 99: Rest of Europe Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 100: Rest of Europe 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030
  • ASIA-PACIFIC
    • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
    • South Korea
    • South Korean Semiconductor Materials Market (2015-2020): Annual Sales in US$ Million
    • Taiwan
    • Taiwan Semiconductor Fabrication Materials Market (2015-2020): Annual Sales in US$ Million
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 103: Asia-Pacific 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 104: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 105: Asia-Pacific Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 106: Asia-Pacific 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030
  • REST OF WORLD
    • TABLE 107: Rest of World Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 108: Rest of World Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 109: Rest of World 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2023 & 2030
    • TABLE 110: Rest of World Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
    • TABLE 111: Rest of World Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2021 and % CAGR
    • TABLE 112: Rest of World 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2023 & 2030

IV. COMPETITION