半導體組裝和檢測服務市場：按服務、封裝解決方案、應用、區域-規模、份額、展望、機會分析，2023-2030 年

預計2023年全球半導體封裝與測試服務市場規模為334.2億美元，預計2030年將達到488.1億美元，預測期（2023-2030）的複合年增長率為5.6%。

半導體、微電路和微晶片的製造需要在製造/加工區域內保持極其精確的條件。 半導體製造和加工通常使用吸濕元件，這些元件對高濕度高度敏感。 在半導體和積體電路的製造過程中，組裝區域的濕度過高會對鍵結過程產生不利影響並導致故障。 在蝕刻電路線之前，它們會被一種稱為光致抗蝕劑的光敏聚合物化合物覆蓋。 光致抗蝕劑具有吸濕性，會吸收水分，透過切割或橋接微小電路線而導致電路故障。

市場動態

由於技術進步，對消費性電子產品的需求不斷增長，正在推動全球半導體組裝和測試服務市場的成長。 手機和平板設備的快速發展是半導體組裝和測試服務（SATS）的潛在市場之一。 預計移動性的增加和數位內容的增加將在預測期內推動全球半導體組裝和檢查服務市場的成長。 下一代汽車對採用電子元件、提高車輛安全性的系統和管理系統的汽車電子產品的需求不斷增長，正在推動全球半導體組裝和檢查服務市場的成長。 導航、混合動力電動驅動器和 LED 領域越來越多地採用最新技術，為該市場創造了需求。

本研究的主要特點

• 本報告詳細分析了以 2022 年為基準年的全球半導體組裝和檢測服務市場規模以及預測期內（2023-2030 年）的複合年增長率。
• 它揭示了各個細分市場的潛在收入機會，並為該市場提供了一系列有吸引力的投資建議。
• 它還提供了有關市場驅動因素、限制因素、機會、新產品發布和批准、區域前景、主要市場參與者採取的競爭策略等的重要見解。
• 根據公司概況、績效、產品組合、地理分佈、市值、主要發展、策略和未來計劃等參數，對全球半導體組裝和檢測服務市場的主要參與者進行分析。
• 本調查涵蓋的公司包括 ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc.（Psi Technologies Inc.）, STATS chipPAC Ltd.（JCET）, Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd.
• 該報告的見解使公司行銷人員和高階主管能夠就未來的產品發布、產品升級、市場擴張和行銷策略做出明智的決策。
• 本研究報告針對該產業的各個利害關係人，包括投資者、供應商、託管服務提供者、第三方服務提供者、經銷商、新進業者和加值經銷商。
• 利害關係人可以透過用於分析全球半導體組裝和檢測服務市場的各種策略矩陣來促進決策。

目錄

第一章研究目的與前提

• 研究目的
• 先決條件
• 縮寫

第二章市場概述

• 報告摘要
  • 市場定義和範圍
• 執行摘要
• 連貫的機會地圖 (COM)

第三章市場動態、法規與趨勢分析

• 市場動態
  • 促進因素
• 消費性電子產品對行動性和連結性的需求不斷增長
• SATS 提供者提供內部測試和封裝功能之外的其他功能。
  • 抑制因素
• 匯率波動
• 高階包裝解決方案的高資本投資
  • 市場機會
• 投資先進包裝解決方案
• 監管場景
• 產業趨勢
• 併購
• 新系統的啟動/批准
• COVID-19 大流行的影響

第 4 章全球半導體組裝與偵測服務市場：依服務劃分，2018-2030 年

• 組裝與包裝服務
• 測試服務

第 5 章全球半導體組裝與偵測服務市場：依封裝解法劃分，2018-2030 年

• 銅線/金線接合
• 銅夾
• 倒裝晶片
• 晶圓級封裝
• TSV

第 6 章全球半導體組裝與偵測服務市場：依應用劃分，2018-2030

• 通訊
• 運算與網絡
• 消費性電子產品
• 工業
• 汽車電子

第 7 章全球半導體組裝與偵測服務市場：按地區劃分，2018-2030 年

• 北美
  • 2018-2030 年市場規模與預測
  • 按服務劃分的市場規模和預測以及同比增長率：2018-2030 年
  • 包裝解決方案的市場規模與預測，年成長率：2018-2030 年
  • 2018-2030 年市場規模與預測、年成長率（按應用劃分）
  • 市場佔有率分析：按國家/地區劃分，2023 年和 2030 年 (%)
• 歐洲
• 亞太地區
• 拉丁美洲
• 中東/非洲

第八章競爭態勢

• 公司簡介
  • ASE Group
  • Powertech Technology Inc.
  • Global Foundries Inc.
  • Amkor Technology Inc.
  • CORWIL Technology Corp.
  • Integrated Microelectronics Inc.（Psi Technologies Inc.）
  • STATS chipPAC Ltd.（JCET）
  • Chipbond Technology Corporation
  • Silicon Precision Industries Company Ltd.

第 9 章

• 參考文獻
• 調查方法

The global semiconductor assembly and testing services market is estimated at US$ 33.42 Billion in 2023, and is projected to reach US$ 48.81 Billion by 2030, exhibiting a CAGR of 5.6% over the forecast period (2023-2030).

Manufacturing semiconductors, microcircuits, and microchips requires extremely precise conditions to be kept in the production/processing area. Hygroscopic components are typically employed in semiconductor manufacturing or processing, making them extremely vulnerable to high humidity levels. Excessive moisture in the assembly area during the manufacture of semiconductors and integrated circuits negatively impacts the bonding process and raises faults. Circuit lines are covered with photosensitive polymer compounds called photoresists before being etched. They absorb moisture due to their hygroscopic nature, which causes the minuscule circuit wires to be cut or bridged, resulting in circuit failure.

Market Dynamics

The ongoing demand for consumer electronics with the advancement of technology is driving growth of the global semiconductor assembly and testing services market. The high development of cell phones and tablets is one of the potential markets for semiconductor assembly and testing services (SATS). Increasing mobility and growing digital content are expected to drive growth of the global semiconductor assembly and testing services market's growth during the forecast period. Increasing demand for automotive electronics in the upcoming generation of cars built with electronic components, systems to enhance car safety, and management systems are driving growth of the global semiconductor assembly and testing services market. Rising adoption of latest technologies in navigation, hybrid electric drivers, and LEDs creates demand for this market.

Key features of the study:

• This report provides an in-depth analysis of the global semiconductor assembly and testing services market size (US$ Billion) and compound annual growth rate (CAGR %) for the forecast period (2023-2030), considering 2022 as the base year
• It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
• This study also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, regional outlook, and competitive strategies adopted by the leading market players
• It profiles leading players in the global semiconductor assembly and testing services market based on the following parameters - company overview, financial performance, product portfolio, geographical presence, market capital, key developments, strategies, and future plans
• Companies covered as a part of this study are ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc. (Psi Technologies Inc.), STATS chipPAC Ltd. (JCET), Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd.
• Insights from this report would allow marketers and management authorities of companies to make informed decisions regarding future product launches, product upgrades, market expansion, and marketing tactics
• The global semiconductor assembly and testing services market report caters to various stakeholders in this industry including investors, suppliers, managed service providers, third-party service providers, distributors, new entrants, and value-added resellers
• Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global semiconductor assembly and testing services market

Detailed Segmentation

• Global Semiconductor Assembly And Testing Services Market, By Service:
  • Assembly & Packaging Services
  • Testing Services
• Global Semiconductor Assembly And Testing Services Market, By Packaging Solutions:
  • Copper Wire and Gold Wire Bonding
  • Copper Clip
  • Flip Chip
  • Wafer Level Packaging
  • TSV
• Global Semiconductor Assembly And Testing Services Market, By Application:
  • Communication
  • Computing & Networking
  • Consumer Electronics
  • Industrial
  • Automotive Electronics
• Global Semiconductor Assembly And Testing Services Market, By Region:
  • North America
  • By Country
  • U.S.
  • Canada
  • Europe
  • By Country
  • Germany
  • U.K.
  • France
  • Italy
  • Spain
  • Russia
  • Rest of Europe
  • Asia Pacific
  • By Country
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • ASEAN
  • Rest of Asia Pacific
  • Latin America
  • By Country
  • Brazil
  • Mexico
  • Rest of Latin America
  • Middle East and Africa
  • By Country/Region:
  • GCC Countries
  • South Africa
  • Rest of Middle East and Africa
• Company Profiles
  • ASE Group
  • Powertech Technology Inc.
  • Global Foundries Inc.
  • Amkor Technology Inc.
  • CORWIL Technology Corp.
  • Integrated Microelectronics Inc. (Psi Technologies Inc.)
  • STATS chipPAC Ltd. (JCET)
  • Chipbond Technology Corporation
  • Silicon Precision Industries Company Ltd.

Table of Contents

1. Research Objectives and Assumptions

• Research Objectives
• Assumptions
• Abbreviations

2. Market Purview

• Report Description
  • Market Definition and Scope
• Executive Summary
  • Market Snippet, By Service
  • Market Snippet, By Packaging Solutions
  • Market Snippet, By Application
  • Market Snippet, By Region
• Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

• Market Dynamics
  • Drivers
• Increasing demand for mobility and connectivity in consumer electronic products
• Additional features offered by SATS providers over in-house testing and packaging capabilities
  • Restraints
• Constant fluctuations in exchange rates
• High capital investment for high-end packaging solutions
  • Market Opportunities
• Investments in advanced packaging solution
• Regulatory Scenario
• Industry Trend
• Merger and Acquisitions
• New system Launch/Approvals
• Impact of COVID-19 Pandemic

4. Global Semiconductor Assembly And Testing Services Market , By Service, 2018-2030 (US$ Billion)

• Introduction
  • Market Share Analysis, 2023 and 2030 (%)
  • Y-o-Y Growth Analysis, 2018 - 2030
  • Segment Trends
• Assembly & Packaging Services
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Testing Services
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)

5. Global Semiconductor Assembly And Testing Services Market, By Packaging Solutions, 2018-2030 (US$ Billion)

• Introduction
  • Market Share Analysis, 2023 and 2030 (%)
  • Y-o-Y Growth Analysis, 2018 - 2030
  • Segment Trends
• Copper Wire and Gold Wire Bonding
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Copper Clip
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Flip Chip
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Wafer Level Packaging
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• TSV
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)

6. Global Semiconductor Assembly And Testing Services Market, By Application, 2018-2030 (US$ Billion)

• Introduction
  • Market Share Analysis, 2023 and 2030 (%)
  • Y-o-Y Growth Analysis, 2018 - 2030
  • Segment Trends
• Communication
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Computing & Networking
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Consumer Electronics
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Industrial
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Automotive Electronics
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)

7. Global Semiconductor Assembly And Testing Services Market , By Region, 2018-2030 (US$ Billion)

• Introduction
  • Market Share Analysis, By Region, 2023 and 2030 (%)
• North America
  • Introduction
• Market size and Forecast,2018-2030 (US$ Billion)
  • Regional Trends
• Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
• Market Share Analysis, By Country, 2023 and 2030(%)
  • U.S.
  • Canada
• Europe
  • Introduction
• Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
  • Regional Trends
• Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
• Market Share Analysis, By Country, 2023 and 2030(%)
  • Germany
  • U.K.
  • France
  • Italy
  • Spain
  • Russia
  • Rest of Europe
• Asia Pacific
  • Introduction
• Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
  • Regional Trends
• Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
• Market Share Analysis, By Country, 2023 and 2030(%)
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • ASEAN
  • Rest Of Asia Pacific
• Latin America
  • Introduction
• Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
  • Regional Trends
• Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
• Market Share Analysis, By Country, 2023 and 2030(%)
  • Brazil
  • Mexico
  • Rest Of Latin America
• Middle East and Africa
  • Introduction
• Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
  • Regional Trends
• Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
• Market Share Analysis, By Country, 2023 and 2030 (%)
  • South Africa
  • GCC Countries
  • Rest of the Middle East and Africa

8. Competitive Landscape

• Company Profiles
  • ASE Group
• Company Overview
• Product Portfolio
• Financial Performance
• Key Strategies
• Recent Developments/Updates
  • Powertech Technology Inc.
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • Global Foundries Inc.
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • Amkor Technology Inc.
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • CORWIL Technology Corp.
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • Integrated Microelectronics Inc. (Psi Technologies Inc.)
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • STATS chipPAC Ltd. (JCET)
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • Chipbond Technology Corporation
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • Silicon Precision Industries Company Ltd.
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
• Analyst Views

9. Section

• References
• Research Methodology
• About us and Sales Contact