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市場調查報告書
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1279793

2022-2029年全球電源模組封裝市場規模研究與預測，按組件（基片、基座、晶片連接和基片連接、封裝和互連）和區域分析。

Global Power Module Packaging Market Size study & Forecast, by Component (Substrate, Baseplate, Die Attach and Substrate Attach, Encapsulations, and Interconnections) and Regional Analysis, 2022-2029
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 | 商品交期: 2-3個工作天內

價格

電力電子模組，也被稱為功率模組，作為一個物理容器，用於存儲幾個功率元件，最常見的是功率半導體裝置。

功率模組包裝市場正在擴大，因為在預測期內，消費電子領域的需求不斷上升，工業領域的需求也在不斷增加

根據2021年印度品牌資產基金會的數據，在2015-2021年期間，消費電子產品的產量正在從290億美元上升到670億美元。它包括IT硬體和組件、智慧手機、半導體和設計等等。而政府對可再生能源的關注度不斷提高，技術進步和創新為市場創造了有利可圖的機會。此外，根據國際可再生能源機構的數據，2018年全球可再生能源的發電量為2351吉瓦。與前一年相比，它顯示了7.9%的增長。風能和太陽能的容量分別為564吉瓦和486吉瓦。然而，在2022-2029年的預測期內，新技術的採用緩慢，創新脫軌，阻礙了市場的增長。

全球功率模組包裝市場研究的主要地區包括亞太地區、北美、歐洲、拉丁美洲和世界其他地區。由於工業化程度的提高和城市化的發展，亞太地區在收入方面占主導地位。而亞太地區在預測期內預計將以最高的複合年增長率增長，這是因為政府對採用可再生能源的規定不斷增加，市場參與者的滲透和增長活動等因素。

該研究的目的是定義近年來不同市場區隔和國家的市場規模，並預測未來幾年的價值。該報告旨在涵蓋參與研究的國家/地區的該行業的定性和定量方面。

該報告還提供了關於關鍵方面的詳細資訊，如驅動因素和挑戰，這將確定市場的未來增長。此外，它還涵蓋了微觀市場的潛在機會，供利益相關者投資，並詳細分析了競爭格局和主要參與者的產品。 .

目錄

第一章：執行摘要

  • 市場簡介
  • 2019-2029年全球及細分市場的估計和預測
    • 2019-2029年電源模組封裝市場，按地區分類
    • 2019-2029年電源模組封裝市場，按組件分類
  • 主要趨勢
  • 估算方法
  • 研究假設

第二章：全球電源模組封裝市場的定義和範圍

  • 本研究的目的
  • 市場定義和範圍
    • 研究的範圍
    • 行業演變
  • 研究涵蓋的年份
  • 貨幣兌換率

第三章：全球電源模組封裝市場動態

  • 功率模組封裝市場影響分析（2019-2029年）
    • 市場驅動力
      • 消費電子領域的需求不斷增長
      • 工業領域的需求不斷增長
    • 市場挑戰
      • 新技術的採用緩慢，使創新脫軌
    • 市場機會
      • 政府對可再生能源的關注度不斷提高
      • 技術進步和創新

第四章：全球功率模組封裝市場行業分析

  • 波特的5力模型
    • 供應商的議價能力
    • 買方的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭性的競爭
  • 波特五力模型的未來方法（2019-2029年）
  • PEST分析
    • 政治因素
    • 經濟
    • 社會
    • 技術
  • 最佳投資機會
  • 最佳策略
  • 行業專家展望
  • 分析師建議和結論

第五章：風險評估：COVID-19的影響

  • 評估COVID-19對行業的整體影響
  • COVID-19前和COVID-19後的市場情況

第六章：全球電源模組封裝市場，按組件分類

  • 市場簡介
  • 全球電源模組封裝市場，按組件分類，性能-潛力分析
  • 2019-2029年全球電源模組封裝市場按組件估計和預測的情況
  • 功率模組封裝市場，細項分析
    • 基板
    • 基板
    • 晶片連接和基片連接
    • 封裝
    • 互連

第7章：全球電源模組封裝市場，區域分析

  • 功率模組封裝市場，區域市場簡介
  • 北美洲
    • 美國
      • 2019-2029年組件分類估計和預測
    • 加拿大
  • 歐洲電源模組封裝市場簡介
    • 英國
    • 德國
    • 法國
    • 西班牙
    • 義大利
    • 歐洲其他地區
  • 亞太地區電源模組封裝市場概況
    • 中國
    • 印度
    • 日本
    • 澳大利亞
    • 韓國
    • 亞太其他地區
  • 拉丁美洲電源模組封裝市場概況
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地區
  • 世界其他地區

第八章：競爭情報

  • 頂級市場戰略
  • 公司簡介
    • Fuji Electric Co. Ltd
      • 關鍵資訊
      • 概況
      • 財務（取決於數據的可用性）
      • 產品摘要
      • 近期發展情況
    • Infineon Technologies AG
    • Mitsubishi Electric Corporation (Powerex Inc.)
    • Semikron
    • Amkor Technology Inc.
    • Hitachi Ltd
    • STMicroelectronics NV

第九章：研究過程

  • 研究過程
    • 資料探勘
    • 分析
    • 市場評估
    • 驗證
    • 出版
  • 研究屬性
  • 研究假設

The global Power Module Packaging Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2029. A power electronic module, also known as a power module, serves as a physical container for storing several power components, most commonly power semiconductor devices.

The Power Module Packaging market is expanding because of factors such as the rising demand for the consumer electronics segment and growing demand from the industrial segment in the forecast period

According to Indian Brand Equity Foundation in 2021, the production of consumer electronics is rising from USD 29 billion to USD 67 billion during 2015-2021. It includes IT hardware & components, smartphones, semiconductor and design, and so on. Whereas rising government focus on renewable energy and technological advancement and innovations create lucrative opportunities for the market. Furthermore, Global renewable energy generating capacity was 2,351 GW in 2018, according to the International Renewable Energy Agency. When compared to the previous year, it showed an increase of 7.9%. The capacity of wind and solar energy were 564 GW and 486 GW, respectively. However, slow adoption of new technologies derailing innovations hampers the market growth throughout the forecast period of 2022-2029.

The key regions considered for the Global Power Module Packaging Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. Asia Pacific dominated the market in terms of revenue, owing to the increasing industrialization and growing urbanization. Whereas the Asia Pacific is expected to grow with the highest CAGR during the forecast period, owing to factors such as increasing government regulations towards adoption of renewable energies, penetration of market players and growth activities.

Major market players included in this report are:

  • Fuji Electric Co. Ltd
  • Infineon Technologies AG
  • Mitsubishi Electric Corporation (Powerex Inc.)
  • Semikron
  • Amkor Technology Inc.
  • Hitachi Ltd
  • STMicroelectronics NV

Recent Developments in the Market:

  • In February 2019, Infineon Technologies Ag expanded its CoolSiCTM power module portfolio for UPS and energy storage applications. The CoolSiC 2B power modules, according to Infineon, allow engineers to reduce total system costs by increasing power density. When compared to silicon variants, the product has 80% lower switching losses, allowing inverter efficiency levels to exceed 99%.

Global Power Module Packaging Market Report Scope:

  • Historical Data: 2019-2020-2021
  • Base Year for Estimation: 2021
  • Forecast period: 2022-2029
  • Report Coverage: Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
  • Segments Covered: Component, Region
  • Regional Scope: North America; Europe; Asia Pacific; Latin America; Rest of the World
  • Customization Scope: Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below.

By Component:

  • Substrate,
  • Baseplate,
  • Die Attach and Substrate Attach,
  • Encapsulations,
  • Interconnections

By Region:

  • North America
  • U.S.
  • Canada
  • Europe
  • UK
  • Germany
  • France
  • Spain
  • Italy
  • ROE
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • RoAPAC
  • Latin America
  • Brazil
  • Mexico
  • RoLA
  • Rest of the World

Table of Contents

Chapter 1. Executive Summary

  • 1.1. Market Snapshot
  • 1.2. Global & Segmental Market Estimates & Forecasts, 2019-2029 (USD Billion)
    • 1.2.1. Power Module Packaging Market, by Region, 2019-2029 (USD Billion)
    • 1.2.2. Power Module Packaging Market, by Component, 2019-2029 (USD Billion)
  • 1.3. Key Trends
  • 1.4. Estimation Methodology
  • 1.5. Research Assumption

Chapter 2. Global Power Module Packaging Market Definition and Scope

  • 2.1. Objective of the Study
  • 2.2. Market Definition & Scope
    • 2.2.1. Scope of the Study
    • 2.2.2. Industry Evolution
  • 2.3. Years Considered for the Study
  • 2.4. Currency Conversion Rates

Chapter 3. Global Power Module Packaging Market Dynamics

  • 3.1. Power Module Packaging Market Impact Analysis (2019-2029)
    • 3.1.1. Market Drivers
      • 3.1.1.1. Rising demand for consumer electronics segment
      • 3.1.1.2. Growing demand from the industrial segment
    • 3.1.2. Market Challenges
      • 3.1.2.1. Slow Adoption of New Technologies Derailing Innovation
    • 3.1.3. Market Opportunities
      • 3.1.3.1. Rising government focus towards renewable energy
      • 3.1.3.2. Technological advancement and innovations

Chapter 4. Global Power Module Packaging Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
  • 4.2. Futuristic Approach to Porter's 5 Force Model (2019-2029)
  • 4.3. PEST Analysis
    • 4.3.1. Political
    • 4.3.2. Economical
    • 4.3.3. Social
    • 4.3.4. Technological
  • 4.4. Top investment opportunity
  • 4.5. Top winning strategies
  • 4.6. Industry Experts Prospective
  • 4.7. Analyst Recommendation & Conclusion

Chapter 5. Risk Assessment: COVID-19 Impact

  • 5.1. Assessment of the overall impact of COVID-19 on the industry
  • 5.2. Pre COVID-19 and post COVID-19 Market scenario

Chapter 6. Global Power Module Packaging Market, by Component

  • 6.1. Market Snapshot
  • 6.2. Global Power Module Packaging Market by Component, Performance - Potential Analysis
  • 6.3. Global Power Module Packaging Market Estimates & Forecasts by Component, 2019-2029 (USD Billion)
  • 6.4. Power Module Packaging Market, Sub Segment Analysis
    • 6.4.1. Substrate
    • 6.4.2. Baseplate
    • 6.4.3. Die Attach and Substrate Attach
    • 6.4.4. Encapsulations
    • 6.4.5. Interconnections

Chapter 7. Global Power Module Packaging Market, Regional Analysis

  • 7.1. Power Module Packaging Market, Regional Market Snapshot
  • 7.2. North America Power Module Packaging Market
    • 7.2.1. U.S. Power Module Packaging Market
      • 7.2.1.1. Component breakdown estimates & forecasts, 2019-2029
    • 7.2.2. Canada Power Module Packaging Market
  • 7.3. Europe Power Module Packaging Market Snapshot
    • 7.3.1. U.K. Power Module Packaging Market
    • 7.3.2. Germany Power Module Packaging Market
    • 7.3.3. France Power Module Packaging Market
    • 7.3.4. Spain Power Module Packaging Market
    • 7.3.5. Italy Power Module Packaging Market
    • 7.3.6. Rest of Europe Power Module Packaging Market
  • 7.4. Asia-Pacific Power Module Packaging Market Snapshot
    • 7.4.1. China Power Module Packaging Market
    • 7.4.2. India Power Module Packaging Market
    • 7.4.3. Japan Power Module Packaging Market
    • 7.4.4. Australia Power Module Packaging Market
    • 7.4.5. South Korea Power Module Packaging Market
    • 7.4.6. Rest of Asia Pacific Power Module Packaging Market
  • 7.5. Latin America Power Module Packaging Market Snapshot
    • 7.5.1. Brazil Power Module Packaging Market
    • 7.5.2. Mexico Power Module Packaging Market
    • 7.5.3. Rest of Latin America Power Module Packaging Market
  • 7.6. Rest of The World Power Module Packaging Market

Chapter 8. Competitive Intelligence

  • 8.1. Top Market Strategies
  • 8.2. Company Profiles
    • 8.2.1. Fuji Electric Co. Ltd
      • 8.2.1.1. Key Information
      • 8.2.1.2. Overview
      • 8.2.1.3. Financial (Subject to Data Availability)
      • 8.2.1.4. Product Summary
      • 8.2.1.5. Recent Developments
    • 8.2.2. Infineon Technologies AG
    • 8.2.3. Mitsubishi Electric Corporation (Powerex Inc.)
    • 8.2.4. Semikron
    • 8.2.5. Amkor Technology Inc.
    • 8.2.6. Hitachi Ltd
    • 8.2.7. STMicroelectronics NV

Chapter 9. Research Process

  • 9.1. Research Process
    • 9.1.1. Data Mining
    • 9.1.2. Analysis
    • 9.1.3. Market Estimation
    • 9.1.4. Validation
    • 9.1.5. Publishing
  • 9.2. Research Attributes
  • 9.3. Research Assumption

LIST OF TABLES

  • TABLE 1. Global Power Module Packaging Market, report scope
  • TABLE 2. Global Power Module Packaging Market estimates & forecasts by Region 2019-2029 (USD Billion)
  • TABLE 3. Global Power Module Packaging Market estimates & forecasts by Component 2019-2029 (USD Billion)
  • TABLE 4. Global Power Module Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 5. Global Power Module Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 6. Global Power Module Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 7. Global Power Module Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 8. Global Power Module Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 9. Global Power Module Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 10. Global Power Module Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 11. Global Power Module Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 12. Global Power Module Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 13. Global Power Module Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 14. U.S. Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 15. U.S. Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 16. U.S. Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 17. Canada Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 18. Canada Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 19. Canada Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 20. UK Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 21. UK Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 22. UK Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 23. Germany Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 24. Germany Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 25. Germany Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 26. France Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 27. France Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 28. France Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 29. Italy Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 30. Italy Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 31. Italy Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 32. Spain Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 33. Spain Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 34. Spain Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 35. RoE Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 36. RoE Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 37. RoE Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 38. China Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 39. China Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 40. China Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 41. India Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 42. India Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 43. India Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 44. Japan Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 45. Japan Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 46. Japan Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 47. South Korea Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 48. South Korea Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 49. South Korea Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 50. Australia Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 51. Australia Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 52. Australia Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 53. RoAPAC Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 54. RoAPAC Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 55. RoAPAC Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 56. Brazil Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 57. Brazil Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 58. Brazil Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 59. Mexico Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 60. Mexico Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 61. Mexico Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 62. RoLA Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 63. RoLA Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 64. RoLA Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 65. Row Power Module Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
  • TABLE 66. Row Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 67. Row Power Module Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
  • TABLE 68. List of secondary sources, used in the study of global Power Module Packaging Market
  • TABLE 69. List of primary sources, used in the study of global Power Module Packaging Market
  • TABLE 70. Years considered for the study
  • TABLE 71. Exchange rates considered

List of tables and figures and dummy in nature, final lists may vary in the final deliverable

LIST OF FIGURES

List of figures

  • FIG 1. Global Power Module Packaging Market, research methodology
  • FIG 2. Global Power Module Packaging Market, Market estimation techniques
  • FIG 3. Global Market size estimates & forecast methods
  • FIG 4. Global Power Module Packaging Market, key trends 2021
  • FIG 5. Global Power Module Packaging Market, growth prospects 2022-2029
  • FIG 6. Global Power Module Packaging Market, porters 5 force model
  • FIG 7. Global Power Module Packaging Market, pest analysis
  • FIG 8. Global Power Module Packaging Market, value chain analysis
  • FIG 9. Global Power Module Packaging Market by segment, 2019 & 2029 (USD Billion)
  • FIG 10. Global Power Module Packaging Market by segment, 2019 & 2029 (USD Billion)
  • FIG 11. Global Power Module Packaging Market by segment, 2019 & 2029 (USD Billion)
  • FIG 12. Global Power Module Packaging Market by segment, 2019 & 2029 (USD Billion)
  • FIG 13. Global Power Module Packaging Market by segment, 2019 & 2029 (USD Billion)
  • FIG 14. Global Power Module Packaging Market, regional snapshot 2019 & 2029
  • FIG 15. North America Power Module Packaging Market 2019 & 2029 (USD Billion)
  • FIG 16. Europe Power Module Packaging Market 2019 & 2029 (USD Billion)
  • FIG 17. Asia Pacific Power Module Packaging Market 2019 & 2029 (USD Billion)
  • FIG 18. Latin America Power Module Packaging Market 2019 & 2029 (USD Billion)
  • FIG 19. Global Power Module Packaging Market, company Market share analysis (2021)

List of tables and figures and dummy in nature, final lists may vary in the final deliverable