市場調查報告書
商品編碼
1134983
IC Socket 全球市場研究與預測:按產品(雙列直插封裝、球柵陣列、四方扁平封裝、小外形封裝、S 小外形 IC 封裝)、按應用、按地區分析,2022-2029Global Microcontroller Socket Market Size study & Forecast, by Product (Dual In-line Package, Ball Grid Array, Quad Flat Package, Small Outline Package, Small Outline IC Package ), by Application, and Regional Analysis, 2022-2029 |
在預測期內,汽車、工業和電信行業越來越多地使用微控制器,推動了 IC 插座市場。
配備微控制器的電子設備可以通過多種方式進行操作。此外,易於管理電氣設備。此外,智能手機的普及也推動了市場的增長。微控制器的使用非常廣泛,因為該控制器增強了智能手機的功能。
據 Statista 稱,全球智能手機普及率正在上升,這推動了預測期內市場的增長。 2018年,全球67.06%的人口使用智能手機,2020年將上升至78.05%。與此同時,聯網汽車行業的收入正在增加,這推動了預測期內市場的增長。例如,根據 Statista 的數據,2022 年的市場預計將從 2020 年的 2.71 萬億美元增長到 2.95 萬億美元。此外,智能電錶的普及在預測期內為市場創造了有利可圖的增長機會。然而,提供類似產品的主要市場參與者的數量可能會影響預測期內的市場增長。
全球 IC 插座市場研究考慮的主要地區是亞太地區、北美、歐洲、拉丁美洲和世界其他地區。由於該行業在無線通信和智能能源方面的持續進步,預計北美 IC 插座市場在預測期內將穩步擴大。由於中國和日本等國家的需求增加,預計亞太地區 IC 插座市場將在預測期內顯著擴大。微電子行業對各種應用中的插座的需求不斷增長,這有助於增長。
本報告中包含的主要市場參與者是:
該研究的目的是確定近年來各個細分市場和國家/地區的市場規模,並預測它們在未來幾年的價值。該報告旨在捕捉被調查國家工業的定性和定量方面。
它還提供了關鍵方面的詳細信息,例如定義市場未來增長的驅動因素和挑戰。此外,它還結合了利益相關者投資的微觀市場潛在機會,以及對主要參與者的競爭格局和產品供應的深入分析。市場的詳細細分和子細分如下所述。
按產品
雙列直插式封裝 (DIP)
球柵陣列 (BGA)
四方扁平封裝 (QFP)
小外形封裝 (SOP)
小外形 IC 封裝 (SOIC)
按應用程序
汽車
消費類電子產品
工業設備
醫療器械
軍事/國防
按地區
北美
美國
加拿大
歐洲
英國
德國
法國
西班牙
意大利
其他歐洲
亞太地區
中國
印度
日本
澳大利亞
韓國
其他亞太地區
拉丁美洲
巴西
墨西哥
世界其他地區
Global Microcontroller Socket Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX% over the forecast period 2022-2029. Microcontroller sockets, often referred to as IC sockets, serve as stand-ins for IC chips in devices having integrated circuits. The growing use of microcontrollers in the automotive, industrial, and communications industries has fueled the market's expansion over the anticipated period. Electronic devices with microcontrollers installed can be operated in a variety of ways. The management of electrical gadgets is made easier by technology. Along with this, rising use of smartphones is also driving the growth of the market over the forecasted period. As the application of microcontrollers is immense, as this controller improves the functionality of smartphones.
According to Statista, the global smartphone penetration rate is increasing which is driving the growth of the market over the forecasted period. In 2018, the percentage of people using smartphones globally was 67.06% which has increased to 78.05% in 2020. Along with this, the revenue of the connected car industry is increasing which is driving the growth of the market over the forecasted period. For instance, according to Statista, in 2022 the market would lift up to USD 2.95 trillion from USD 2.71 trillion in 2020. Moreover, the adoption of smart meters is creating lucrative growth opportunities for the market over the forecasted period. However, number of key market players offering similar products may affect the market growth during the forecast period.
The key regions considered for the Global Microcontroller Socket Market study include Asia Pacific, North America, Europe, Latin America, and Rest of the World. The market for microcontroller sockets in North America is anticipated to expand steadily over the course of the forecast period as a result of the industry's continued advancement in wireless communications and smart energy. The Asia Pacific microcontroller socket market is anticipated to expand significantly over the course of the projected period as a result of the rising demand in nations like China and Japan. The microelectronics industry's expanding need for sockets in a variety of applications has contributed to the growth.
Major market players included in this report are:
Samtec, Inc.
CNC Tech LLC
Molex Inc.
Foxconn Technology Group
Sensata Technologies B.V.
Plastronics Socket Company Inc.
Tyco Electronics Ltd.
Chupond Precision Co. Ltd.
Win Way Technology Co. Ltd.
3M Company
Recent Developments in the Market:
Global Microcontroller Socket Market Report Scope:
Historical Data: 2019-2020-2021
Base Year for Estimation: 2021
Forecast period: 2022-2029
Report Coverage: Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered: Product, Application, Region
Regional Scope: North America; Europe; Asia Pacific; Latin America; Rest of the World
Customization Scope: Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.
The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Product:
Dual In-line Package (DIP)
Ball Grid Array (BGA)
Quad Flat Package (QFP)
Small Outline Package (SOP)
Small Outline IC Package (SOIC)
By Application:
Automotive
Consumer Electronics
Industrial
Medical Device
Military & Defense
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World
List of tables and figures and dummy in nature, final lists may vary in the final deliverable
List of figures
List of tables and figures and dummy in nature, final lists may vary in the final deliverable