Global Epoxy Encapsulation Material Market is valued at approximately XX in 2021 and is anticipated to grow with a healthy growth rate of more than xx% over the forecast period 2022-2028.Epoxy encapsulation material is an epoxy resin that is used to encapsulate various electric and electronic components such as semiconductors, printed circuit boards, copper-clad laminates, and others. These encapsulation materials are intended to insulate and protect a variety of components from harsh weather conditions and challenging environments such as external temperature change, physical shock, vibration, moisture, and general contaminants.With major economies moving toward digitalization, there is a rapid increase in development in the field of information technology (IT) infrastructure. To keep up with this progress, the introduction of new innovative electronic products is picking up, creating demand for epoxy encapsulation materials in the global market.Furthermore, sales of mobile technologies such as smartphones, tablets, laptops, and others are increasing globally, owing to increased demand for advanced communication technologies and the introduction of new products with innovative features.According to the India Brand Equity Foundation, approximately 173 million units of smartphones are expected to be sold across India in 2021, representing a 14 percent increase over sales in 2020. Because epoxy encapsulation materials are widely used for encapsulating semiconductors used in these mobile technologies, rising smartphone sales are expected to boost global demand over the forecast period.The primary factors impeding the globalepoxy encapsulation materialsare the high risk of complications and irritation in the lungs, throat, and nose caused by inhaling epoxy fumes, resulting in inflammation and asthma.
The key regions considered for the global Epoxy Encapsulation Material marketstudy includeAsia Pacific, North America, Europe, Latin America, and Rest of the World.Between 2022 and 2028, Asia Pacific is expected to grow rapidly in the global epoxy encapsulation materials market. The growing trend of industrial automation and rapid urbanization in Asia Pacific is driving up the demand for efficient power transmission and distribution infrastructure. Governments in several countries are focusing on a variety of initiatives to upgrade power infrastructure.North America is projected to account for a significant share ofthe global epoxy encapsulation materials market Due to the growing trend of electrification, rising laws regarding carbon emissions, and rising fuel prices, there is a considerable increase in customer predisposition toward the adoption of electric vehicles across North America..
Major market players included in this report are:
Sumitomo Bakelite
Hysol Huawei Electronics
Hexion
Shin-Etsu Chemical
Hitachi Chemical
Chang Chun Group
Eternal Materials
Tianjin Kaihua Insulating Material
Jiangsu Zhongpeng New Material
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
ByType:
Normal Epoxy Encapsulation Material
Green Epoxy Encapsulation Material
By Grade:
Standard Grade
High Thermal Conductivity Grade
Low Stress Grade
Conditioning Wax Grade
By Application:
Semiconductor Encapsulation
Electronic Components
Printed Circuit Boards
Prepags
Copper Clad Laminates
Other
By End-Use:
Electronics & Electrical Component
Automotive Component
Telecommunication Component
Others
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World
Furthermore, years considered for the study are as follows:
Historical year - 2018, 2019, 2020
Base year - 2021
Forecast period - 2022 to 2028
Target Audience of the Global Epoxy Encapsulation Material Market in Market Study:
Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors
Table of Contents
Chapter 1. Executive Summary
- 1.1. Market Snapshot
- 1.2. Global & Segmental Market Estimates & Forecasts, 2020-2028 (USD Million)
- 1.2.1. Epoxy Encapsulation Market, by Region, 2020-2028 (USD Million)
- 1.2.2. Epoxy Encapsulation Material Market, by Type,2020-2028 (USD Million)
- 1.2.3. Epoxy Encapsulation Material Market, by Grade,2020-2028 (USD Million)
- 1.2.4. Epoxy Encapsulation Material Market, by Application,2020-2028 (USD Million)
- 1.2.5. Epoxy Encapsulation Material Market, by End-Use ,2020-2028 (USD Million)
- 1.3. Key Trends
- 1.4. Estimation Methodology
- 1.5. Research Assumption
Chapter 2. Global Epoxy Encapsulation Material Market Definition and Scope
- 2.1. Objective of the Study
- 2.2. Market Definition & Scope
- 2.2.1. Scope of the Study
- 2.2.2. Industry Evolution
- 2.3. Years Considered for the Study
- 2.4. Currency Conversion Rates
Chapter 3. Global Epoxy Encapsulation Material MarketDynamics
- 3.1. Epoxy Encapsulation Material MarketImpact Analysis (2020-2028)
- 3.1.1. Market Drivers
- 3.1.1.1. Rapid expansion of the consumer electronics sector
- 3.1.1.2. Growing usage of semiconductors across diverse applications
- 3.1.2. Market Challenges
- 3.1.2.1. High risk of complications and irritation
- 3.1.3. Market Opportunities
- 3.1.3.1. Surgingtrend of industrial automation
Chapter 4. Global Epoxy Encapsulation Market Industry Analysis
- 4.1. Porter's 5 Force Model
- 4.1.1. Bargaining Power of Suppliers
- 4.1.2. Bargaining Power of Buyers
- 4.1.3. Threat of New Entrants
- 4.1.4. Threat of Substitutes
- 4.1.5. Competitive Rivalry
- 4.1.6. Futuristic Approach to Porter's 5 Force Model (2018-2028)
- 4.2. PEST Analysis
- 4.2.1. Political
- 4.2.2. Economical
- 4.2.3. Social
- 4.2.4. Technological
- 4.3. Investment Adoption Model
- 4.4. Analyst Recommendation & Conclusion
- 4.5. Top investment opportunity
- 4.6. Top winning strategies
Chapter 5. Risk Assessment: COVID-19 Impact
- 5.1.1. Assessment of the overall impact of COVID-19 on the industry
- 5.1.2. Pre COVID-19 and post COVID-19 market scenario
Chapter 6. Global Epoxy Encapsulation Market, by Type
- 6.1. Market Snapshot
- 6.2. Global Epoxy Encapsulation Material Marketby Type, Performance - Potential Analysis
- 6.3. Global Epoxy Encapsulation Material MarketEstimates & Forecasts by Type,2018-2028 (USD Million)
- 6.4. Epoxy Encapsulation Market, Sub-Segment Analysis
- 6.4.1. Normal Epoxy Encapsulation Material
- 6.4.2. Green Epoxy Encapsulation Material
Chapter 7. Global Epoxy Encapsulation Market, by Grade
- 7.1. Market Snapshot
- 7.2. Global Epoxy Encapsulation Material Marketby Grade, Performance - Potential Analysis
- 7.3. Global Epoxy Encapsulation Material MarketEstimates & Forecasts by Grade,2018-2028 (USD Million)
- 7.4. Epoxy Encapsulation Market, Sub-Segment Analysis
- 7.4.1. Standard Grade
- 7.4.2. High Thermal Conductivity Grade
- 7.4.3. Low Stress Grade
- 7.4.4. Conditioning Wax Grade
Chapter 8. Global Epoxy Encapsulation Market, by Application
- 8.1. Market Snapshot
- 8.2. Global Epoxy Encapsulation Material Marketby Application, Performance - Potential Analysis
- 8.3. Global Epoxy Encapsulation Material MarketEstimates & Forecasts by Application,2018-2028 (USD Million)
- 8.4. Epoxy Encapsulation Market, Sub Segment Analysis
- 8.4.1. Semiconductor Encapsulation
- 8.4.2. Electronic Components
- 8.4.3. Printed Circuit Boards
- 8.4.4. Prepags
- 8.4.5. Copper Clad Laminates
- 8.4.6. Other
Chapter 9. Global Epoxy Encapsulation Market, by End-Use
- 9.1. Market Snapshot
- 9.2. Global Epoxy Encapsulation Material Marketby End-Use, Performance - Potential Analysis
- 9.3. Global Epoxy Encapsulation Material MarketEstimates & Forecasts by End Use,2018-2028 (USD Million)
- 9.4. Epoxy Encapsulation Market, Sub Segment Analysis
- 9.4.1. Electronics & Electrical Component
- 9.4.2. Automotive Component
- 9.4.3. Telecommunication Component
- 9.4.4. Others
Chapter 10. Global Epoxy Encapsulation Market, Regional Analysis
- 10.1. Epoxy Encapsulation Market, Regional Market Snapshot
- 10.2. North America Epoxy Encapsulation Market
- 10.2.1. U.S.Epoxy Encapsulation Market
- 10.2.1.1. Type breakdown estimates & forecasts, 2018-2028
- 10.2.1.2. Grade breakdown estimates & forecasts, 2018-2028
- 10.2.1.3. Application breakdown estimates & forecasts, 2018-2028
- 10.2.1.4. End-Use breakdown estimates & forecasts, 2018-2028
- 10.2.2. CanadaEpoxy Encapsulation Market
- 10.3. Europe Epoxy Encapsulation Material MarketSnapshot
- 10.3.1. U.K. Epoxy Encapsulation Market
- 10.3.2. Germany Epoxy Encapsulation Market
- 10.3.3. France Epoxy Encapsulation Market
- 10.3.4. Spain Epoxy Encapsulation Market
- 10.3.5. Italy Epoxy Encapsulation Market
- 10.3.6. Rest of EuropeEpoxy Encapsulation Market
- 10.4. Asia-PacificEpoxy Encapsulation Material MarketSnapshot
- 10.4.1. China Epoxy Encapsulation Market
- 10.4.2. India Epoxy Encapsulation Market
- 10.4.3. JapanEpoxy Encapsulation Market
- 10.4.4. Australia Epoxy Encapsulation Market
- 10.4.5. South Korea Epoxy Encapsulation Market
- 10.4.6. Rest of Asia PacificEpoxy Encapsulation Market
- 10.5. Latin America Epoxy Encapsulation Material MarketSnapshot
- 10.5.1. Brazil Epoxy Encapsulation Market
- 10.5.2. Mexico Epoxy Encapsulation Market
- 10.6. Rest of The World Epoxy Encapsulation Market
Chapter 11. Competitive Intelligence
- 11.1. Top Market Strategies
- 11.2. Company Profiles
- 11.2.1. Sumitomo Bakelite
- 11.2.1.1. Key Information
- 11.2.1.2. Overview
- 11.2.1.3. Financial (Subject to Data Availability)
- 11.2.1.4. Grade Summary
- 11.2.1.5. Recent Developments
- 11.2.2. Hysol Huawei Electronics
- 11.2.3. Hexion
- 11.2.4. Shin-Etsu Chemical
- 11.2.5. Hitachi Chemical
- 11.2.6. Chang Chun Group
- 11.2.7. Eternal Materials
- 11.2.8. Tianjin Kaihua Insulating Material
- 11.2.9. Jiangsu Zhongpeng New Material
Chapter 12. Research Process
- 12.1. Research Process
- 12.1.1. Data Mining
- 12.1.2. Analysis
- 12.1.3. Market Estimation
- 12.1.4. Validation
- 12.1.5. Publishing
- 12.2. Research Attributes
- 12.3. Research Assumption