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1239438

嵌入式芯片封裝技術市場：按平台、按行業：2021-2031 年全球機會分析和行業預測

Embedded Die Packaging Technology Market By Platform, By Industry Vertical : Global Opportunity Analysis and Industry Forecast, 2021-2031
出版日期: | 出版商: Allied Market Research | 英文 236 Pages | 商品交期: 2-3個工作天內

價格

2021年嵌入式芯片封裝技術市場規模為6918萬美元，2022-2031年復合年增長率為18.3%，預計2031年將達到37069萬美元

嵌入式芯片封裝是一種增強型技術，設計用於直接用於印刷電路板 (PCB) 層壓基板，有助於減小大型系統的尺寸、節能和效率。.

研究範圍討論了主要參與者進入嵌入式芯片封裝技術市場的潛在機會。 此外，它還提供了對市場的深入分析，概述了當前趨勢、主要驅動因素、主要投資領域等。 我們還通過波特五力分析了解行業的競爭情況以及每個利益相關者在價值鏈中的作用。 它還具有主要市場參與者為在市場上站穩腳跟而採取的策略。

內容

第一章介紹

第 2 章執行摘要

第 3 章市場概述

  • 市場定義和範圍
  • 主要發現
    • 主要影響因素
    • 主要投資機會
  • 波特的五力分析
  • 市場動態
    • 司機
      • 對微電子設備中電路小型化的需求正在增加
      • 相對於其他包裝技術的優勢
      • 對消費電子產品和 5G 網絡技術的需求不斷擴大
    • 約束因素
      • 初始成本高
    • 機會
      • IoT（物聯網）趨勢增加
  • 分析 COVID-19 對市場的影響

第 4 章嵌入式芯片封裝技術市場：按平台分類

  • 概覽
    • 市場規模和預測
  • IC 封裝基板嵌入式芯片
    • 主要市場趨勢、增長動力和機遇
    • 市場規模和預測：按地區
    • 市場份額分析：國家/地區分析
  • 剛性基板嵌入式芯片
    • 主要市場趨勢、增長動力和機遇
    • 市場規模和預測：按地區
    • 市場份額分析：國家/地區分析
  • 柔性基板嵌入式芯片
    • 主要市場趨勢、增長動力和機遇
    • 市場規模和預測：按地區
    • 市場份額分析：國家/地區分析

第 5 章嵌入式芯片封裝技術市場：按行業分類

  • 概覽
    • 市場規模和預測
  • 消費類電子產品
    • 主要市場趨勢、增長動力和機遇
    • 市場規模和預測：按地區
    • 市場份額分析：國家/地區分析
  • IT/通信領域
    • 主要市場趨勢、增長動力和機遇
    • 市場規模和預測：按地區
    • 市場份額分析：國家/地區分析
  • 汽車
    • 主要市場趨勢、增長動力和機遇
    • 市場規模和預測：按地區
    • 市場份額分析：國家/地區分析
  • 醫療保健
    • 主要市場趨勢、增長動力和機遇
    • 市場規模和預測：按地區
    • 市場份額分析：國家/地區分析
  • 其他
    • 主要市場趨勢、增長動力和機遇
    • 市場規模和預測：按地區
    • 市場份額分析：國家/地區分析

第 6 章嵌入式芯片封裝技術市場：按地區

  • 概覽
    • 市場規模和預測：按地區
  • 北美
    • 主要趨勢和機遇
    • 市場規模和預測：按平台
    • 市場規模和預測：按行業
    • 市場規模/預測：按國家/地區分類
      • 美國
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 加拿大
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 墨西哥
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
  • 歐洲
    • 主要趨勢和機遇
    • 市場規模和預測：按平台
    • 市場規模和預測：按行業
    • 市場規模/預測：按國家/地區分類
      • 英國
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 德國
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 法國
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 其他歐洲
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
  • 亞太地區
    • 主要趨勢和機遇
    • 市場規模和預測：按平台
    • 市場規模和預測：按行業
    • 市場規模/預測：按國家/地區分類
      • 中國
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 日本
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 台灣
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 印度
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 韓國
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 其他亞太地區
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
  • 拉美
    • 主要趨勢和機遇
    • 市場規模和預測：按平台
    • 市場規模和預測：按行業
    • 市場規模/預測：按國家/地區分類
      • 拉丁美洲
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 中東
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業
      • 非洲
      • 主要市場趨勢、增長動力和機遇
      • 市場規模和預測：按平台
      • 市場規模和預測：按行業

第七章競爭格局

  • 介紹
  • 關鍵成功策略
  • 10 家主要公司的產品映射
  • 比賽儀表板
  • 競爭熱圖
  • 定位頂級公司，2021 年

第八章公司簡介

  • Amkor Technology Inc.
  • ASE GROUP
  • AT&S Group
  • Fujikura
  • General Electric
  • Infenion Technologies AG
  • Microsemi
  • SCHWEIZER ELECTRONIC AG
  • Taiwan Semiconductor Manufacturing Company Limited
  • TDK Corporation
Product Code: A01936

The embedded die packaging technology market was valued at $69.18 million in 2021 and is estimated to reach $370.69 million by 2031, exhibiting a CAGR of 18.3% from 2022 to 2031. Embedded die packaging is an enhanced technology designed to be used directly onto a printed circuit board (PCB) laminated substrate and facilitates size reduction, power saving, & improves the overall efficiency of the system on a large scale.

The scope of the report discusses the potential opportunities for the key players to enter the embedded die packaging technology market. Furthermore, it provides an in-depth analysis of the market, outlining current trends, key driving factors, and key areas of investment. The report includes Porter's five forces analysis to understand the competitive scenario of the industry and role of each stakeholder in the value chain. Moreover, it features the strategies adopted by key market players to maintain their foothold in the market.

The embedded die packaging technology market is segmented on the basis of platform, industry vertical, and region. By platform, the market is divided into embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board. On the basis of industry vertical, the market is segmented into consumer electronics, IT and telecommunication, automotive, healthcare, and others. By region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

The growth of global embedded die packaging technology is majorly driven by the surge in demand for consumer electronics and 5G network technology coupled with the impending need for circuit miniaturization in microelectronic devices. Moreover, the advantages over other packaging technologies are expected to drive market growth. However, high initial cost acts as prime restraint of the global embedded die packaging technology market. On the contrary, the rise in trends related to Internet of Things (IoT) solution is anticipated to provide lucrative opportunities for the embedded die packaging technology industry during the forecast period.

The key players operating in the embedded die packaging technology market are: Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer. These key players adopt several strategies such as new product launch, acquisition, partnership, collaboration and joint venture to increase their market share in the global embedded die packaging technology market during the forecast period.

Key Benefits For Stakeholders

  • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the embedded die packaging technology market analysis from 2021 to 2031 to identify the prevailing embedded die packaging technology market opportunities.
  • The market research is offered along with information related to key drivers, restraints, and opportunities.
  • Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
  • In-depth analysis of the embedded die packaging technology market segmentation assists to determine the prevailing market opportunities.
  • Major countries in each region are mapped according to their revenue contribution to the global market.
  • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
  • The report includes the analysis of the regional as well as global embedded die packaging technology market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Platform

  • Embedded Die in IC Package Substrate
  • Embedded Die in Rigid Board
  • Embedded Die in Flexible Board

By Industry Vertical

  • Consumer Electronics
  • IT and Telecommunication
  • Automotive
  • Healthcare
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • Taiwan
    • India
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Key Market Players

  • Amkor Technology Inc.
  • ASE GROUP
  • Fujikura
  • General Electric
  • Microsemi
  • SCHWEIZER ELECTRONIC AG
  • Taiwan Semiconductor Manufacturing Company Limited
  • AT&S Group
  • Infenion Technologies AG
  • TDK Corporation

TABLE OF CONTENTS

CHAPTER 1: INTRODUCTION

  • 1.1. Report description
  • 1.2. Key market segments
  • 1.3. Key benefits to the stakeholders
  • 1.4. Research Methodology
    • 1.4.1. Primary research
    • 1.4.2. Secondary research
    • 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

  • 2.1. CXO Perspective

CHAPTER 3: MARKET OVERVIEW

  • 3.1. Market definition and scope
  • 3.2. Key findings
    • 3.2.1. Top impacting factors
    • 3.2.2. Top investment pockets
  • 3.3. Porter's five forces analysis
    • 3.3.1. Moderate bargaining power of suppliers
    • 3.3.2. Moderate bargaining power of buyers
    • 3.3.3. Moderate threat of substitutes
    • 3.3.4. Moderate threat of new entrants
    • 3.3.5. Moderate intensity of rivalry
  • 3.4. Market dynamics
    • 3.4.1. Drivers
      • 3.4.1.1. Impending need for circuit miniaturization in microelectronic devices
      • 3.4.1.2. Advantages over other packaging technologies
      • 3.4.1.3. Increase in demand for consumer electronics and 5G network technology
    • 3.4.2. Restraints
      • 3.4.2.1. High initial cost
    • 3.4.3. Opportunities
      • 3.4.3.1. Rise in trend of Internet of Things (IoT)
  • 3.5. COVID-19 Impact Analysis on the market

CHAPTER 4: EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM

  • 4.1. Overview
    • 4.1.1. Market size and forecast
  • 4.2. Embedded Die in IC Package Substrate
    • 4.2.1. Key market trends, growth factors and opportunities
    • 4.2.2. Market size and forecast, by region
    • 4.2.3. Market share analysis by country
  • 4.3. Embedded Die in Rigid Board
    • 4.3.1. Key market trends, growth factors and opportunities
    • 4.3.2. Market size and forecast, by region
    • 4.3.3. Market share analysis by country
  • 4.4. Embedded Die in Flexible Board
    • 4.4.1. Key market trends, growth factors and opportunities
    • 4.4.2. Market size and forecast, by region
    • 4.4.3. Market share analysis by country

CHAPTER 5: EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL

  • 5.1. Overview
    • 5.1.1. Market size and forecast
  • 5.2. Consumer Electronics
    • 5.2.1. Key market trends, growth factors and opportunities
    • 5.2.2. Market size and forecast, by region
    • 5.2.3. Market share analysis by country
  • 5.3. IT and Telecommunication
    • 5.3.1. Key market trends, growth factors and opportunities
    • 5.3.2. Market size and forecast, by region
    • 5.3.3. Market share analysis by country
  • 5.4. Automotive
    • 5.4.1. Key market trends, growth factors and opportunities
    • 5.4.2. Market size and forecast, by region
    • 5.4.3. Market share analysis by country
  • 5.5. Healthcare
    • 5.5.1. Key market trends, growth factors and opportunities
    • 5.5.2. Market size and forecast, by region
    • 5.5.3. Market share analysis by country
  • 5.6. Others
    • 5.6.1. Key market trends, growth factors and opportunities
    • 5.6.2. Market size and forecast, by region
    • 5.6.3. Market share analysis by country

CHAPTER 6: EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY REGION

  • 6.1. Overview
    • 6.1.1. Market size and forecast By Region
  • 6.2. North America
    • 6.2.1. Key trends and opportunities
    • 6.2.2. Market size and forecast, by Platform
    • 6.2.3. Market size and forecast, by Industry Vertical
    • 6.2.4. Market size and forecast, by country
      • 6.2.4.1. U.S.
      • 6.2.4.1.1. Key market trends, growth factors and opportunities
      • 6.2.4.1.2. Market size and forecast, by Platform
      • 6.2.4.1.3. Market size and forecast, by Industry Vertical
      • 6.2.4.2. Canada
      • 6.2.4.2.1. Key market trends, growth factors and opportunities
      • 6.2.4.2.2. Market size and forecast, by Platform
      • 6.2.4.2.3. Market size and forecast, by Industry Vertical
      • 6.2.4.3. Mexico
      • 6.2.4.3.1. Key market trends, growth factors and opportunities
      • 6.2.4.3.2. Market size and forecast, by Platform
      • 6.2.4.3.3. Market size and forecast, by Industry Vertical
  • 6.3. Europe
    • 6.3.1. Key trends and opportunities
    • 6.3.2. Market size and forecast, by Platform
    • 6.3.3. Market size and forecast, by Industry Vertical
    • 6.3.4. Market size and forecast, by country
      • 6.3.4.1. UK
      • 6.3.4.1.1. Key market trends, growth factors and opportunities
      • 6.3.4.1.2. Market size and forecast, by Platform
      • 6.3.4.1.3. Market size and forecast, by Industry Vertical
      • 6.3.4.2. Germany
      • 6.3.4.2.1. Key market trends, growth factors and opportunities
      • 6.3.4.2.2. Market size and forecast, by Platform
      • 6.3.4.2.3. Market size and forecast, by Industry Vertical
      • 6.3.4.3. France
      • 6.3.4.3.1. Key market trends, growth factors and opportunities
      • 6.3.4.3.2. Market size and forecast, by Platform
      • 6.3.4.3.3. Market size and forecast, by Industry Vertical
      • 6.3.4.4. Rest of Europe
      • 6.3.4.4.1. Key market trends, growth factors and opportunities
      • 6.3.4.4.2. Market size and forecast, by Platform
      • 6.3.4.4.3. Market size and forecast, by Industry Vertical
  • 6.4. Asia-Pacific
    • 6.4.1. Key trends and opportunities
    • 6.4.2. Market size and forecast, by Platform
    • 6.4.3. Market size and forecast, by Industry Vertical
    • 6.4.4. Market size and forecast, by country
      • 6.4.4.1. China
      • 6.4.4.1.1. Key market trends, growth factors and opportunities
      • 6.4.4.1.2. Market size and forecast, by Platform
      • 6.4.4.1.3. Market size and forecast, by Industry Vertical
      • 6.4.4.2. Japan
      • 6.4.4.2.1. Key market trends, growth factors and opportunities
      • 6.4.4.2.2. Market size and forecast, by Platform
      • 6.4.4.2.3. Market size and forecast, by Industry Vertical
      • 6.4.4.3. Taiwan
      • 6.4.4.3.1. Key market trends, growth factors and opportunities
      • 6.4.4.3.2. Market size and forecast, by Platform
      • 6.4.4.3.3. Market size and forecast, by Industry Vertical
      • 6.4.4.4. India
      • 6.4.4.4.1. Key market trends, growth factors and opportunities
      • 6.4.4.4.2. Market size and forecast, by Platform
      • 6.4.4.4.3. Market size and forecast, by Industry Vertical
      • 6.4.4.5. South Korea
      • 6.4.4.5.1. Key market trends, growth factors and opportunities
      • 6.4.4.5.2. Market size and forecast, by Platform
      • 6.4.4.5.3. Market size and forecast, by Industry Vertical
      • 6.4.4.6. Rest of Asia-Pacific
      • 6.4.4.6.1. Key market trends, growth factors and opportunities
      • 6.4.4.6.2. Market size and forecast, by Platform
      • 6.4.4.6.3. Market size and forecast, by Industry Vertical
  • 6.5. LAMEA
    • 6.5.1. Key trends and opportunities
    • 6.5.2. Market size and forecast, by Platform
    • 6.5.3. Market size and forecast, by Industry Vertical
    • 6.5.4. Market size and forecast, by country
      • 6.5.4.1. Latin America
      • 6.5.4.1.1. Key market trends, growth factors and opportunities
      • 6.5.4.1.2. Market size and forecast, by Platform
      • 6.5.4.1.3. Market size and forecast, by Industry Vertical
      • 6.5.4.2. Middle East
      • 6.5.4.2.1. Key market trends, growth factors and opportunities
      • 6.5.4.2.2. Market size and forecast, by Platform
      • 6.5.4.2.3. Market size and forecast, by Industry Vertical
      • 6.5.4.3. Africa
      • 6.5.4.3.1. Key market trends, growth factors and opportunities
      • 6.5.4.3.2. Market size and forecast, by Platform
      • 6.5.4.3.3. Market size and forecast, by Industry Vertical

CHAPTER 7: COMPETITIVE LANDSCAPE

  • 7.1. Introduction
  • 7.2. Top winning strategies
  • 7.3. Product Mapping of Top 10 Player
  • 7.4. Competitive Dashboard
  • 7.5. Competitive Heatmap
  • 7.6. Top player positioning, 2021

CHAPTER 8: COMPANY PROFILES

  • 8.1. Amkor Technology Inc.
    • 8.1.1. Company overview
    • 8.1.2. Key Executives
    • 8.1.3. Company snapshot
    • 8.1.4. Operating business segments
    • 8.1.5. Product portfolio
    • 8.1.6. Business performance
    • 8.1.7. Key strategic moves and developments
  • 8.2. ASE GROUP
    • 8.2.1. Company overview
    • 8.2.2. Key Executives
    • 8.2.3. Company snapshot
    • 8.2.4. Operating business segments
    • 8.2.5. Product portfolio
    • 8.2.6. Business performance
    • 8.2.7. Key strategic moves and developments
  • 8.3. AT&S Group
    • 8.3.1. Company overview
    • 8.3.2. Key Executives
    • 8.3.3. Company snapshot
    • 8.3.4. Operating business segments
    • 8.3.5. Product portfolio
    • 8.3.6. Business performance
    • 8.3.7. Key strategic moves and developments
  • 8.4. Fujikura
    • 8.4.1. Company overview
    • 8.4.2. Key Executives
    • 8.4.3. Company snapshot
    • 8.4.4. Operating business segments
    • 8.4.5. Product portfolio
    • 8.4.6. Business performance
    • 8.4.7. Key strategic moves and developments
  • 8.5. General Electric
    • 8.5.1. Company overview
    • 8.5.2. Key Executives
    • 8.5.3. Company snapshot
    • 8.5.4. Operating business segments
    • 8.5.5. Product portfolio
    • 8.5.6. Business performance
  • 8.6. Infenion Technologies AG
    • 8.6.1. Company overview
    • 8.6.2. Key Executives
    • 8.6.3. Company snapshot
    • 8.6.4. Operating business segments
    • 8.6.5. Product portfolio
    • 8.6.6. Business performance
    • 8.6.7. Key strategic moves and developments
  • 8.7. Microsemi
    • 8.7.1. Company overview
    • 8.7.2. Key Executives
    • 8.7.3. Company snapshot
    • 8.7.4. Operating business segments
    • 8.7.5. Product portfolio
    • 8.7.6. Business performance
  • 8.8. SCHWEIZER ELECTRONIC AG
    • 8.8.1. Company overview
    • 8.8.2. Key Executives
    • 8.8.3. Company snapshot
    • 8.8.4. Operating business segments
    • 8.8.5. Product portfolio
    • 8.8.6. Business performance
    • 8.8.7. Key strategic moves and developments
  • 8.9. Taiwan Semiconductor Manufacturing Company Limited
    • 8.9.1. Company overview
    • 8.9.2. Key Executives
    • 8.9.3. Company snapshot
    • 8.9.4. Operating business segments
    • 8.9.5. Product portfolio
    • 8.9.6. Business performance
    • 8.9.7. Key strategic moves and developments
  • 8.10. TDK Corporation
    • 8.10.1. Company overview
    • 8.10.2. Key Executives
    • 8.10.3. Company snapshot
    • 8.10.4. Operating business segments
    • 8.10.5. Product portfolio
    • 8.10.6. Business performance
    • 8.10.7. Key strategic moves and developments

LIST OF TABLES

  • TABLE 01. GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 02. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR EMBEDDED DIE IN IC PACKAGE SUBSTRATE, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 03. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR EMBEDDED DIE IN RIGID BOARD, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 04. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR EMBEDDED DIE IN FLEXIBLE BOARD, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 05. GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 06. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 07. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR IT AND TELECOMMUNICATION, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 08. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR AUTOMOTIVE, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 09. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR HEALTHCARE, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 10. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR OTHERS, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 11. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 12. NORTH AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 13. NORTH AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 14. NORTH AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
  • TABLE 15. U.S. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 16. U.S. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 17. CANADA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 18. CANADA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 19. MEXICO EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 20. MEXICO EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 21. EUROPE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 22. EUROPE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 23. EUROPE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
  • TABLE 24. UK EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 25. UK EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 26. GERMANY EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 27. GERMANY EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 28. FRANCE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 29. FRANCE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 30. REST OF EUROPE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 31. REST OF EUROPE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 32. ASIA-PACIFIC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 33. ASIA-PACIFIC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 34. ASIA-PACIFIC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
  • TABLE 35. CHINA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 36. CHINA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 37. JAPAN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 38. JAPAN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 39. TAIWAN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 40. TAIWAN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 41. INDIA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 42. INDIA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 43. SOUTH KOREA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 44. SOUTH KOREA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 45. REST OF ASIA-PACIFIC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 46. REST OF ASIA-PACIFIC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 47. LAMEA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 48. LAMEA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 49. LAMEA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
  • TABLE 50. LATIN AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 51. LATIN AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 52. MIDDLE EAST EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 53. MIDDLE EAST EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 54. AFRICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021-2031 (REVENUE, $MILLION)
  • TABLE 55. AFRICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
  • TABLE 56. AMKOR TECHNOLOGY INC.: KEY EXECUTIVES
  • TABLE 57. AMKOR TECHNOLOGY INC.: COMPANY SNAPSHOT
  • TABLE 58. AMKOR TECHNOLOGY INC.: SERVICE SEGMENTS
  • TABLE 59. AMKOR TECHNOLOGY INC.: PRODUCT PORTFOLIO
  • TABLE 60. AMKOR TECHNOLOGY INC.: KEY STRATERGIES
  • TABLE 61. ASE GROUP: KEY EXECUTIVES
  • TABLE 62. ASE GROUP: COMPANY SNAPSHOT
  • TABLE 63. ASE GROUP: SERVICE SEGMENTS
  • TABLE 64. ASE GROUP: PRODUCT PORTFOLIO
  • TABLE 65. ASE GROUP: KEY STRATERGIES
  • TABLE 66. AT&S GROUP: KEY EXECUTIVES
  • TABLE 67. AT&S GROUP: COMPANY SNAPSHOT
  • TABLE 68. AT&S GROUP: SERVICE SEGMENTS
  • TABLE 69. AT&S GROUP: PRODUCT PORTFOLIO
  • TABLE 70. AT&S GROUP: KEY STRATERGIES
  • TABLE 71. FUJIKURA: KEY EXECUTIVES
  • TABLE 72. FUJIKURA: COMPANY SNAPSHOT
  • TABLE 73. FUJIKURA: SERVICE SEGMENTS
  • TABLE 74. FUJIKURA: PRODUCT PORTFOLIO
  • TABLE 75. FUJIKURA: KEY STRATERGIES
  • TABLE 76. GENERAL ELECTRIC: KEY EXECUTIVES
  • TABLE 77. GENERAL ELECTRIC: COMPANY SNAPSHOT
  • TABLE 78. GENERAL ELECTRIC: SERVICE SEGMENTS
  • TABLE 79. GENERAL ELECTRIC: PRODUCT PORTFOLIO
  • TABLE 80. INFENION TECHNOLOGIES AG: KEY EXECUTIVES
  • TABLE 81. INFENION TECHNOLOGIES AG: COMPANY SNAPSHOT
  • TABLE 82. INFENION TECHNOLOGIES AG: SERVICE SEGMENTS
  • TABLE 83. INFENION TECHNOLOGIES AG: PRODUCT PORTFOLIO
  • TABLE 84. INFENION TECHNOLOGIES AG: KEY STRATERGIES
  • TABLE 85. MICROSEMI: KEY EXECUTIVES
  • TABLE 86. MICROSEMI: COMPANY SNAPSHOT
  • TABLE 87. MICROSEMI: SERVICE SEGMENTS
  • TABLE 88. MICROSEMI: PRODUCT PORTFOLIO
  • TABLE 89. SCHWEIZER ELECTRONIC AG: KEY EXECUTIVES
  • TABLE 90. SCHWEIZER ELECTRONIC AG: COMPANY SNAPSHOT
  • TABLE 91. SCHWEIZER ELECTRONIC AG: SERVICE SEGMENTS
  • TABLE 92. SCHWEIZER ELECTRONIC AG: PRODUCT PORTFOLIO
  • TABLE 93. SCHWEIZER ELECTRONIC AG: KEY STRATERGIES
  • TABLE 94. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: KEY EXECUTIVES
  • TABLE 95. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT
  • TABLE 96. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: SERVICE SEGMENTS
  • TABLE 97. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT PORTFOLIO
  • TABLE 98. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: KEY STRATERGIES
  • TABLE 99. TDK CORPORATION: KEY EXECUTIVES
  • TABLE 100. TDK CORPORATION: COMPANY SNAPSHOT
  • TABLE 101. TDK CORPORATION: PRODUCT SEGMENTS
  • TABLE 102. TDK CORPORATION: PRODUCT PORTFOLIO
  • TABLE 103. TDK CORPORATION: KEY STRATERGIES

LIST OF FIGURES

  • FIGURE 01. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031
  • FIGURE 02. SEGMENTATION OF EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031
  • FIGURE 03. TOP INVESTMENT POCKETS IN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET (2022-2031)
  • FIGURE 04. MODERATE BARGAINING POWER OF SUPPLIERS
  • FIGURE 05. MODERATE BARGAINING POWER OF BUYERS
  • FIGURE 06. MODERATE THREAT OF SUBSTITUTES
  • FIGURE 07. MODERATE THREAT OF NEW ENTRANTS
  • FIGURE 08. MODERATE INTENSITY OF RIVALRY
  • FIGURE 09. DRIVERS, RESTRAINTS AND OPPORTUNITIES: GLOBALEMBEDDED DIE PACKAGING TECHNOLOGY MARKET
  • FIGURE 10. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM, 2021(%)
  • FIGURE 11. COMPARATIVE SHARE ANALYSIS OF EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR EMBEDDED DIE IN IC PACKAGE SUBSTRATE, BY COUNTRY 2021-2031(%)
  • FIGURE 12. COMPARATIVE SHARE ANALYSIS OF EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR EMBEDDED DIE IN RIGID BOARD, BY COUNTRY 2021-2031(%)
  • FIGURE 13. COMPARATIVE SHARE ANALYSIS OF EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR EMBEDDED DIE IN FLEXIBLE BOARD, BY COUNTRY 2021-2031(%)
  • FIGURE 14. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2021(%)
  • FIGURE 15. COMPARATIVE SHARE ANALYSIS OF EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY 2021-2031(%)
  • FIGURE 16. COMPARATIVE SHARE ANALYSIS OF EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR IT AND TELECOMMUNICATION, BY COUNTRY 2021-2031(%)
  • FIGURE 17. COMPARATIVE SHARE ANALYSIS OF EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR AUTOMOTIVE, BY COUNTRY 2021-2031(%)
  • FIGURE 18. COMPARATIVE SHARE ANALYSIS OF EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR HEALTHCARE, BY COUNTRY 2021-2031(%)
  • FIGURE 19. COMPARATIVE SHARE ANALYSIS OF EMBEDDED DIE PACKAGING TECHNOLOGY MARKET FOR OTHERS, BY COUNTRY 2021-2031(%)
  • FIGURE 20. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET BY REGION, 2021
  • FIGURE 21. U.S. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 22. CANADA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 23. MEXICO EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 24. UK EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 25. GERMANY EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 26. FRANCE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 27. REST OF EUROPE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 28. CHINA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 29. JAPAN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 30. TAIWAN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 31. INDIA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 32. SOUTH KOREA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 33. REST OF ASIA-PACIFIC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 34. LATIN AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 35. MIDDLE EAST EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 36. AFRICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2021-2031 ($MILLION)
  • FIGURE 37. TOP WINNING STRATEGIES, BY YEAR
  • FIGURE 38. TOP WINNING STRATEGIES, BY DEVELOPMENT
  • FIGURE 39. TOP WINNING STRATEGIES, BY COMPANY
  • FIGURE 40. PRODUCT MAPPING OF TOP 10 PLAYERS
  • FIGURE 41. COMPETITIVE DASHBOARD
  • FIGURE 42. COMPETITIVE HEATMAP: EMBEDDED DIE PACKAGING TECHNOLOGY MARKET
  • FIGURE 43. TOP PLAYER POSITIONING, 2021
  • FIGURE 44. ASE GROUP: NET REVENUE, 2019-2021 ($MILLION)
  • FIGURE 45. ASE GROUP: RESEARCH & DEVELOPMENT EXPENDITURE, 2019-2021
  • FIGURE 46. ASE GROUP: REVENUE SHARE BY SEGMENT, 2021 (%)
  • FIGURE 47. ASE GROUP: REVENUE SHARE BY REGION, 2021 (%)
  • FIGURE 48. AT&S GROUP: NET REVENUE, 2019-2021 ($MILLION)
  • FIGURE 49. AT&S GROUP: RESEARCH & DEVELOPMENT EXPENDITURE, 2019-2021
  • FIGURE 50. AT&S GROUP: REVENUE SHARE BY SEGMENT, 2021 (%)
  • FIGURE 51. AT&S GROUP: REVENUE SHARE BY REGION, 2021 (%)
  • FIGURE 52. FUJIKURA: NET REVENUE, 2019-2021 ($MILLION)
  • FIGURE 53. FUJIKURA: RESEARCH & DEVELOPMENT EXPENDITURE, 2019-2021
  • FIGURE 54. FUJIKURA: REVENUE SHARE BY SEGMENT, 2021 (%)
  • FIGURE 55. FUJIKURA: REVENUE SHARE BY REGION, 2021 (%)
  • FIGURE 56. GENERAL ELECTRIC: NET REVENUE, 2019-2021 ($MILLION)
  • FIGURE 57. GENERAL ELECTRIC: RESEARCH & DEVELOPMENT EXPENDITURE, 2019-2021
  • FIGURE 58. GENERAL ELECTRIC: REVENUE SHARE BY SEGMENT, 2021 (%)
  • FIGURE 59. GENERAL ELECTRIC: REVENUE SHARE BY REGION, 2021 (%)
  • FIGURE 60. INFENION TECHNOLOGIES AG: NET REVENUE, 2019-2021 ($MILLION)
  • FIGURE 61. INFENION TECHNOLOGIES AG: RESEARCH & DEVELOPMENT EXPENDITURE, 2019-2021
  • FIGURE 62. INFENION TECHNOLOGIES AG: REVENUE SHARE BY SEGMENT, 2021 (%)
  • FIGURE 63. INFENION TECHNOLOGIES AG: REVENUE SHARE BY REGION, 2021 (%)
  • FIGURE 64. MICROSEMI: NET REVENUE, 2020-2022 ($MILLION)
  • FIGURE 65. MICROSEMI: RESEARCH & DEVELOPMENT EXPENDITURE, 2020-2022
  • FIGURE 66. MICROSEMI: REVENUE SHARE BY REGION, 2022 (%)
  • FIGURE 67. MICROSEMI: REVENUE SHARE BY SEGMENT, 2022 (%)
  • FIGURE 68. SCHWEIZER ELECTRONIC AG: NET REVENUE, 2019-2021 ($MILLION)
  • FIGURE 69. SCHWEIZER ELECTRONIC AG: RESEARCH & DEVELOPMENT EXPENDITURE, 2019-2021
  • FIGURE 70. SCHWEIZER ELECTRONIC AG: REVENUE SHARE BY SEGMENT, 2021 (%)
  • FIGURE 71. SCHWEIZER ELECTRONIC AG: REVENUE SHARE BY REGION, 2021 (%)
  • FIGURE 72. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: NET REVENUE, 2019-2021 ($MILLION)
  • FIGURE 73. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: RESEARCH & DEVELOPMENT EXPENDITURE, 2019-2021
  • FIGURE 74. TDK CORPORATION: RESEARCH & DEVELOPMENT EXPENDITURE, 2019-2021 ($MILLION)
  • FIGURE 75. TDK CORPORATION: NET SALES, 2019-2021 ($MILLION)
  • FIGURE 76. TDK CORPORATION: REVENUE SHARE BY SEGMENT, 2021 (%)
  • FIGURE 77. TDK CORPORATION: REVENUE SHARE BY REGION, 2021 (%)