倒裝芯片技術市場——增長、趨勢、COVID-19 的影響、預測 (2023-2028)

在預測期內，倒裝芯片技術市場預計將以 5.91% 的複合年增長率增長。

作為一個技術驅動的市場，製造商主要關注凸塊工藝中的創新和新技術，導致對製造所需原材料的需求增加。

主要亮點

• 這就是該行業在原材料供應商中蓬勃發展的原因。 與其他封裝方法相比，可靠性、尺寸、靈活性、性能和成本等關鍵優勢正在推動倒裝芯片市場的增長。 此外，倒裝芯片原材料、設備和服務的供應也有望在預測期內推動市場發展。
• 此外，與競爭方法相比的許多優勢，例如更小的尺寸、更高的性能和更大的 I/O 靈活性，也有助於市場增長。 預計在移動無線、消費應用、網絡、服務器和數據中心等高性能應用中，對倒裝芯片的需求將會增加。 倒裝芯片是超越摩爾方法的 3D 集成和高級 SoC（片上系統）的關鍵推動因素之一。
• MMIC（單片微波 IC）的強勁增長正在擴大 MMIC 作為在微波頻率（300 MHz 至 300 GHz）下運行的設備的市場。 這些設備通常執行諸如微波混合、功率放大、低噪聲放大和高頻開關等功能。
• 扇出型晶圓級封裝和嵌入式芯片是倒裝芯片市場中發展最快的新興技術之一。 此外，一些知名供應商正在增加對這些技術的投資，從而擴大其影響範圍。
• 例如，2021 年 3 月，Samsung Electronics與 Marvell 合作，共同開發了一種新的片上系統，可提供增強的 5G 網絡性能。 新推出的芯片用於Samsung 的 Massive MIMO，預計到 2021 年第二季度將出現在一級運營商中。 同樣，MediaTek於2020年11月簽署了約8500萬美元的收購協議，收購IntelEnpirion的電源管理芯片資產。
• COVID-19 嚴重影響了市場的增長。 這是因為消費者的購買行為已經從家電、汽車等奢侈品轉向食品等必需品。 它還影響了供應鏈，減緩了市場增長。

主要市場趨勢

軍事需求和國防工業推動市場增長

• 現代軍事和國防環境需要經過驗證、可靠且可擴展的技術。 傳感器是這些技術的關鍵部分，因為它們為涉及復雜控制、測量、監視和執行的國防生態系統提供解決方案。
• 根據軍事要求，組件必須冷卻至 50K，因此開發了基於銦微型泵的技術。 軍事系統中的傳感器數量持續增長，推動了軍事計算平台對倒裝芯片技術的需求。
• Radar 說包裝和組裝是成功實施的關鍵。 隨著雷達應用的增加，成本變得非常重要。 成本和封裝是汽車毫米波雷達和無人機的關鍵問題。 單芯片雷達和多通道 T/R 模塊正在變得可行。
• 例如，已開發出用於 76-84 GHz 汽車雷達的 SiGe 發射/接收相控陣芯片。 該芯片使用受控塌陷芯片連接 (C4) 凸塊工藝倒裝到低成本印刷電路板上，在發送和接收鏈之間提供 50 dB 的隔離度。 這項工作代表了毫米波段高性能 FMCW 雷達同步發射和接收操作的最先進複雜性。
• 由於軍事應用對複雜性、高性能、引腳數、功耗和成本的要求越來越高，由於 GPS 的部署，封裝行業正轉向軍事和國防應用的倒裝芯片和晶圓級封裝和雷達應用。我們正在轉向更高性能的封裝，例如扇出封裝。 在這種類型的應用中使用倒裝芯片技術已被證明是許多應用中高密度電子產品的可靠封裝技術。
• Qorvo 是創新 RF 解決方案的領先供應商，最近贏得了一份為期三年的額外合同，以推進其銅柱 GaN 倒裝芯片技術的開發。 該國防部 (DoD) 計劃建立了一家高產國內鑄造廠，以成熟覆銅組裝工藝。 該工藝可以為空間受限的相控陣雷達系統和其他國防電子設備實現垂直芯片堆疊。

中國占有重要的市場份額

• 中國包裝行業有望在預測期內實現潛在增長。 對 IC 組件的強勁需求正在推動提供更高密度和 I/O 連接的先進封裝解決方案的部署。
• 中國政府的“中國製造 2025”計劃旨在到 2030 年使半導體行業產值達到 3050 億美元，滿足 80% 的國內需求。 隨著技術戰爭的爆發，中國大力發展其芯片產業。 中美之間的貿易戰，以及中國公司被美國技術切斷的威脅（像HUAWEI這樣的大公司）正在推動中國半導體行業向前發展。
• 倒裝芯片市場包括植球和組裝，但中國公司在提高植球能力方面非常先進，尤其是 12 英寸銅柱。 超過 90% 的先進封裝廠商具有 300mm 晶圓的凸塊能力。 2019 年，中國電子公司江蘇長電科技 (JCET) 開始在晶圓上量產凸塊。 公司新添置12吋晶圓凸塊線並轉入量產。 量產已經運往長電科技在中國的客戶，並且還有幾家設備製造商已經批准了這條生產線的出貨。
• 由於長期停工，COVID-19 大流行影響了中國的所有製造業和地點，從而影響了倒裝芯片技術市場。 此外，中國測試和封裝公司不斷獲得高端封裝技術（倒裝芯片、凸塊等）和更先進的（扇入、扇出、2.5D 中介層、SiP 等）加工能力。
• 由於技術發展和併購，預計今年長電科技、天海通和通通微電子等中國服務提供商的收入表現將實現兩位數增長，高於行業平均水平。

競爭格局

由於汽車、工業和消費電子行業的終端用戶數量不斷增加，倒裝芯片技術市場呈現碎片化。 預計該市場在預測期內將穩步增長。 市場現有企業正試圖通過採用 5G 通信、高性能數據中心和小型電子產品等新技術來保持競爭力。 市場的最新發展包括：

• 2021 年 11 月 - 領先的半導體封裝和測試服務提供商 Amkor Technology Inc.（納斯達克股票代碼：AMKR）計劃在越南北寧建立一座最先進的智能工廠。 新工廠的一期工程將專注於為全球領先的半導體和電子製造商提供先進的系統級封裝 (SiP) 組裝和測試解決方案。

其他好處

• Excel 格式的市場預測 (ME) 表
• 三個月的分析師支持

內容

第一章介紹

• 研究假設和市場定義
• 調查範圍

第二章研究方法論

第 3 章執行摘要

第 4 章市場洞察

• 市場概覽
• 產業吸引力 - 波特五力分析
  • 供應商的議價能力
  • 買家的議價能力
  • 新進入者的威脅
  • 替代品的威脅
  • 競爭公司之間的敵對關係
• 工業價值鏈分析

第 5 章市場動態

• 市場驅動力
  • 對可穿戴設備的需求不斷擴大
  • MMIC（單片微波 IC）應用的強勁增長
• 市場挑戰
  • 與技術相關的成本上升

第 6 章技術快照

第 7 章市場細分

• 通過晶圓凸塊工藝
  • 銅柱
  • 錫鉛共晶焊料
  • 無鉛焊料
  • 金釘碰撞
• 按包裝技術
  • BGA (2.1D/2.5D/3D)
  • 客戶服務提供商
• 按產品（僅限定性分析）
  • 內存
  • 發光二極管
  • CMOS 圖像傳感器
  • SoC
  • GPU
  • 中央處理器
• 最終用戶
  • 軍事/國防
  • 醫療/保健
  • 工業領域
  • 汽車
  • 消費類電子產品
  • 通訊領域
• 區域信息
  • 中國
  • 台灣
  • 美國
  • 韓國
  • 馬來西亞
  • 新加坡
  • 日本

第八章競爭格局

• 公司簡介
  • Amkor Technology Inc.
  • UTAC Holdings Ltd
  • Taiwan Semiconductor Manufacturing Company Limited
  • Chipbond Technology Corporation
  • TF AMD Microlectronics Sdn Bhd
  • Jiangsu Changjiang Electronics Technology Co. Ltd
  • Powertech Technology Inc.
  • ASE Industrial Holding Ltd（Siliconware Precision Industries Co. Ltd）

第九章投資分析

第十章市場前景

The flip chip technology market is expected to register a CAGR of 5.91% over the forecast period. Being a technologically driven market, manufacturers are mainly focusing on innovations and on new technologies for the bumping process, which, in turn, is increasing the demand for raw materials required for manufacturing.

Key Highlights

• This leads to rapid growth in this industry among raw material suppliers. Its primary advantages over other packaging methods, namely, reliability, size, flexibility, performance, and cost, are the factors driving the growth of the flip-chip market. The availability of flip-chip raw materials, equipment, and services is further expected to drive the market lucratively during the forecast period.
• Moreover, the growth of the market is attributed to its numerous advantages, such as smaller size, higher- performance, and enhanced I/O flexibility over its competitive methodologies. The demand for flip-chip is expected to rise in mobile and wireless, consumer applications, and other high-performance applications such as networks, servers, and data centers. In terms of 3D integration and more than the Moore approach, the flip-chip is one of the key driving factors and helps enable sophisticated SoC (system on chip).
• Due to the strong growth in MMIC (monolithic microwave IC), the market is growing, as MMICs are devices that operate at microwave frequencies (300 MHz to 300 GHz). These devices typically perform functions such as microwave mixing, power amplification, low-noise amplification, and high-frequency switching.
• Fan-out wafer-level packaging and embedded die are some of the fastest emerging technologies for the flip-chip market. Also, some of the prominent vendors are increasing their investment in these technologies, thereby expanding their scope.
• For instance, in March 2021, Samsung Electronics partnered with Marvell to jointly develop a novel system-on-a-chip to offer enhanced 5G network performance. The newly launched chip finds usage in Samsung's massive MIMO and is anticipated to see its presence among Tier One operators by Q2 2021. Similarly, Mediatek, Inc., in November 2020, inked an acquisition deal of approximately USD 85 million to purchase the power management chip assets of Intel Enpirion.
• COVID-19 has severely affected the market growth. This is due to the shifting of consumer purchasing behavior towards essential goods such as groceries from luxury goods such as consumer electronics and vehicles. The supply chain was also affected, thus slowing down the market growth.

Key Market Trends

The Military and Defense Industry to Drive the Market Growth

• Modern military and defense environments require proven, reliable, and scalable technologies. Sensors are a critical part of the technologies, as these provide solutions to the whole defense ecosystem, including complex controls, measurements, monitoring, and execution.
• For military requirements, the need to cool components down to 50 K has led to the development of a technology based on indium micropumps. The sensor content of military systems continues to grow, thereby driving requirements for flip chip technology in military computing platforms.
• For any radar, packaging and assembly are the keys to a successful implementation. As radar applications proliferate, cost becomes critical. For millimeter-wave automotive and UAV, cost and packaging are being addressed. Single-chip radars and multi-channel T/R modules are becoming feasible.
• For example, a SiGe transmit-receive phased-array chip for automotive radar applications at 76 to 84 GHz has been developed. The chip uses a controlled collapse chip connection (C4) bumping process and is flip-chipped onto a low-cost printed circuit board, achieving 50 dB isolation between the transmit and receive chains. This work represents state-of-the-art complexity for a high-performance FMCW radar at millimeter-wave frequencies, with simultaneous transmit and receive operation.
• Due to the increasing complexities and higher performance, pin count, power, and cost requirements of military applications, the packaging industry is moving toward high-performance packages, such as flip-chip or wafer-level fan-out packaging, for military and defense by deploying GPS and radar applications. The use of flip-chip technology for this type of application has proven itself, in many applications, to be a reliable packaging technology to achieve high-density electronics.
• Recently, Qorvo, a leading provider of innovative RF solutions, was awarded a three-year contract further to advance the development of copper-pillar-on-GaN flip-chip technology. This Department of Defense (DoD) program will create a high-yield domestic foundry to mature the copper flip assembly process, which enables vertical die stacking in space-constrained phased array radar systems and other defense electronics.

China Occupies the Significant Market Share

• The packaging industry in China is expected to register potential growth during the forecast period. There is a strong demand for IC components, which has expanded the deployment of advanced packaging solutions that offer higher levels of integration and higher numbers of I/O connections.
• The Chinese government's initiative of "Made in China 2025" aims to make its semiconductor industry reach USD 305 billion in output by 2030 and meet 80% of domestic demand. China is ramping up its chip industry amid a brewing tech war. United States-China trade war and the threat that Chinese firms could be cut off from American technology(as major firms like Huawei) are boosting China's push for its semiconductor industry.
• The flip-chip market includes bumping and assembly, and there is enormous ramping of bumping capacity by Chinese players, particularly in the 12" Cu pillar. More than 90% of advanced packaging players have 300 mm wafer bumping capability. In 2019, Chinese electronics company Jiangsu Changjiang Electronics Technology (JCET) started high-volume wafer bumping. The company has moved into volume production with its new 12-inch wafer bumping line. Production volumes are already being shipped to China-based JCET customers, with several additional device manufacturers qualifying the line for shipments.
• Due to the COVID-19 pandemic, all the manufacturing industries and bases are affected in China due to the long-lasting shutdown in the country, thereby affecting the flip-chip technology market. Moreover, the Chinese testing and packaging companies continue to gain processing capacity for high-end packaging technologies (e.g., flip-chip and bumping) and more advanced (e.g., fan-in, fan-out, 2.5D interposer, and SiP).
• Owing to the progress in both technology development and merger and acquisitions, Chinese service providers, such as JCET, TSHT, and TFME, are projected to rise above the industry's average in their revenue performances this year with double-digit growth rates.

Competitive Landscape

The flip chip technology market is fragmented due to the growing number of end users in automotive, industrial, and consumer electronics. The market is expected to grow at a fair steady rate over the forecast period. The existing players in the market are striving to maintain a competitive edge by catering to newer technologies, such as 5G telecommunication, high-performance data centers, compact electronic devices, etc. Some of the recent developments in the market are -

• November 2021 - Amkor Technology Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, planned to build a state-of-the-art smart factory in Bac Ninh, Vietnam. The first phase of the new factory would focus on providing advanced system in package (SiP) assembly and test solutions to the leading global semiconductor and electronic manufacturing companies.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power of Suppliers
  • 4.2.2 Bargaining Power of Buyers
  • 4.2.3 Threat of New Entrants
  • 4.2.4 Threat of Substitute Products
  • 4.2.5 Intensity of Competitive Rivalry
• 4.3 Industry Value Chain Analysis

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Increasing Demand for Wearable Devices
  • 5.1.2 Strong Growth in MMIC (Monolithic Microwave IC) Applications
• 5.2 Market Challenge
  • 5.2.1 Higher Costs Associated with the Technology

6 TECHNOLOGY SNAPSHOT​

7 MARKET SEGMENTATION

• 7.1 By Wafer Bumping Process
  • 7.1.1 Copper Pillar
  • 7.1.2 Tin-Lead Eutectic Solder
  • 7.1.3 Lead Free Solder
  • 7.1.4 Gold Stud Bumping
• 7.2 By Packaging Technology
  • 7.2.1 BGA (2.1D/2.5D/3D)
  • 7.2.2 CSP
• 7.3 By Product (Only Qualitative Analysis)
  • 7.3.1 Memory
  • 7.3.2 Light Emitting Diode
  • 7.3.3 CMOS Image Sensor
  • 7.3.4 SoC
  • 7.3.5 GPU
  • 7.3.6 CPU
• 7.4 By End User
  • 7.4.1 Military and Defense
  • 7.4.2 Medical and Healthcare
  • 7.4.3 Industrial Sector
  • 7.4.4 Automotive
  • 7.4.5 Consumer Electronics
  • 7.4.6 Telecommunications
• 7.5 By Geography
  • 7.5.1 China
  • 7.5.2 Taiwan
  • 7.5.3 United States
  • 7.5.4 South Korea
  • 7.5.5 Malaysia
  • 7.5.6 Singapore
  • 7.5.7 Japan

8 COMPETITIVE LANDSCAPE

• 8.1 Company Profiles*
  • 8.1.1 Amkor Technology Inc.
  • 8.1.2 UTAC Holdings Ltd
  • 8.1.3 Taiwan Semiconductor Manufacturing Company Limited
  • 8.1.4 Chipbond Technology Corporation
  • 8.1.5 TF AMD Microlectronics Sdn Bhd
  • 8.1.6 Jiangsu Changjiang Electronics Technology Co. Ltd
  • 8.1.7 Powertech Technology Inc.
  • 8.1.8 ASE Industrial Holding Ltd (Siliconware Precision Industries Co. Ltd)

9 INVESTMENT ANALYSIS

10 FUTURE OF THE MARKET