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倒裝芯片技術市場：趨勢、機遇、競爭分析 [2023-2028]
市場調查報告書
商品編碼
1277661

倒裝芯片技術市場：趨勢、機遇、競爭分析 [2023-2028]

Flip Chip Technology Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

倒裝芯片技術市場趨勢和預測

到 2028 年，全球倒裝芯片技術市場預計將達到 441 億美元，2023 年至 2028 年復合年增長率為 5.8%。 該市場的主要驅動力是電動汽車需求的增長、小型化趨勢的增強以及這些技術在消費電子、汽車和電信行業的滲透率不斷提高。 倒裝芯片技術市場的未來前景廣闊，在電子、工業、汽車和運輸、醫療保健、IT 和電信、航空航天和國防工業等領域都蘊藏著商機。

倒裝芯片技術公司名單

市場上的公司根據其提供的產品質量進行競爭。 該市場的主要參與者專注於擴大製造設施、研發投資、基礎設施開發以及利用整個價值鏈的整合機會。 這些策略使倒裝芯片技術公司能夠滿足不斷增長的需求、保持競爭力、開發創新產品和技術、降低製造成本並擴大客戶群。

倒裝芯片技術市場洞察

  • 由於在收發器、嵌入式處理器、電源管理、基帶、ASIC 和 SOC 等應用中越來越多地使用銅柱作為互連，Lucintel 將在預測期內看到銅柱的增長最快。我們預計會出現增長率。
  • 由於預計芯片封裝、芯片電氣連接、封裝與電路板的互連以及封裝設計設備對倒裝芯片的需求增加，電子行業將在預測期內呈現最高增長。
  • 由於大公司的持續研發以及印度和中國製造基地的存在，預計亞太地區在預測期內將實現最高增長。

本報告回答了 11 個關鍵問題：

  • Q.1.您的細分市場中最有前途和高增長的機會是什麼？
  • Q.2.您認為哪些領域會以更快的速度增長？為什麼？
  • Q.3.您認為哪些地區的增長速度會更快？為什麼？
  • Q.4.影響市場動態的關鍵因素有哪些？ 這個市場的主要挑戰和商業風險是什麼？
  • Q.5.這個市場的業務風險和競爭威脅是什麼？
  • Q.6.這個市場有哪些新趨勢？為什麼？
  • Q.7.這個市場中的客戶需求有哪些變化？
  • Q.8.市場有哪些新發展？ 哪些公司正在引領這些發展？
  • Q.9.這個市場的主要參與者是誰？ 主要參與者採取哪些戰略舉措來發展業務？
  • Q.10.這個市場上的競爭產品有哪些？因材料或產品替代而失去市場份額的威脅是什麼？
  • Q.11.過去五年發生了哪些類型的併購，對行業產生了哪些影響？

內容

第 1 章執行摘要

第 2 章全球倒裝芯片技術市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 推動行業發展的因素和挑戰

第三章2017-2028年市場趨勢及預測分析

  • 宏觀經濟趨勢（2017-2022 年）和預測（2023-2028 年）
  • 倒裝芯片技術全球市場趨勢（2017-2022）和預測（2023-2028）
  • 按封裝技術劃分的全球倒裝芯片技術市場
    • 3D IC
    • 5D IC
    • 二維集成電路
  • 全球倒裝芯片技術市場：按凸塊技術劃分
    • 銅柱
    • 焊料凸點
    • 錫鉛共晶焊料
    • 無鉛焊料
    • 金凸塊
    • 其他
  • 按最終用途行業劃分的全球倒裝芯片技術市場
    • 電子產品
    • 行業
    • 汽車和運輸設備
    • 醫療保健
    • IT/通信
    • 航空航天與國防
    • 其他

第四章2017-2028年區域市場趨勢及預測分析

  • 全球倒裝芯片技術市場：按地區劃分
  • 北美倒裝芯片技術市場
  • 歐洲倒裝芯片技術市場
  • 亞太倒裝芯片技術市場
  • 其他地區倒裝芯片技術市場

第五章競爭分析

  • 產品組合分析
  • 運營整合
  • 波特五力分析

第 6 章增長機會和戰略分析

  • 增長機會分析
    • 倒裝芯片技術封裝技術的全球市場增長機會
    • 倒裝芯片技術全球市場增長機會：通過凸塊技術
    • 倒裝芯片技術最終用途行業的全球市場增長機會
    • 倒裝芯片技術全球市場增長機會：按地區
  • 全球倒裝芯片技術市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 擴大倒裝芯片技術全球市場的產能
    • 全球倒裝芯片技術市場的併購和合資企業
    • 身份驗證和許可

第 7 章主要公司簡介

  • IBM
  • Intel
  • Fujitsu
  • 3M
  • Samsung Electronics
簡介目錄

Flip Chip Technology Market Trends and Forecast

The future of the flip chip technology market looks promising with opportunities in the electronic, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace & defense industries. The global flip chip technology market is expected to reach an estimated $44.1 billion by 2028 with a CAGR of 5.8% from 2023 to 2028. The major drivers for this market are growing demand for electric vehicles, increasing trend of miniaturization, and rising penetration of these technology in consumer electronics, automotive, and telecommunication industries.

A more than 150-page report is developed to help in your business decisions.

Flip Chip Technology Market by Segment

The study includes a forecast for the global flip chip technology market by packaging technology, bumping technology, end use industry, and region, as follows.

Flip Chip Technology Market by Packaging Technology [Value ($B) Shipment Analysis from 2017 to 2028]:

  • 3D IC
  • 5D IC
  • 2D IC

Flip Chip Technology Market by Bumping Technology [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Copper Pillar
  • Solder Bumping
  • Tin-Lead Eutectic Solder
  • Lead-Free Solder
  • Gold Bumping
  • Others

Flip Chip Technology Market by End Use Industry [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Electronics
  • Industrial
  • Automotive & Transport
  • Healthcare
  • IT & Telecommunication
  • Aerospace & Defense
  • Others

Flip Chip Technology Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Flip Chip Technology Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies flip chip technology companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the flip chip technology companies profiled in this report include.

  • IBM
  • Intel
  • Fujitsu
  • 3M
  • Samsung Electronics

Flip Chip Technology Market Insights

  • Lucintel forecasts that copper pillar is expected to witness highest growth over the forecast period due to increasing usage of copper pillar as an interconnector in transceiver, embedded processor, power management, baseband, ASIC, and SOC application.
  • Electronics is expected to witness highest growth over the forecast period due to the increasing demand for flip chips in devices for chip encapsulating, chips electrical link, package interconnection to circuit boards, and package design.
  • APAC is expected to witness highest growth over the forecast period due to the continuous research and development by major players and existence of manufacturing hubs in India and China.

Features of the Flip Chip Technology Market

  • Market Size Estimates: Flip chip technology market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: Flip chip technology market size by various segments, such as by packaging technology, bumping technology, end use industry, and region
  • Regional Analysis: Flip chip technology market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different by packaging technology, bumping technology, end use industry, and regions for the flip chip technology market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the flip chip technology market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the flip chip technology market size?

Answer: The global flip chip technology market is expected to reach an estimated $44.1 billion by 2028.

Q2. What is the growth forecast for flip chip technology market?

Answer: The global flip chip technology market is expected to grow with a CAGR of 5.8% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the flip chip technology market?

Answer: The major drivers for this market are growing demand for electric vehicles, increasing trend of miniaturization, and rising penetration of these technology in consumer electronics, automotive, and telecommunication industries.

Q4. What are the major segments for flip chip technology market?

Answer: The future of the flip chip technology market looks promising with opportunities in the electronics, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace & defense industries.

Q5. Who are the key flip chip technology companies?

Answer: Some of the key flip chip technology companies are as follows.

  • IBM
  • Intel
  • Fujitsu
  • 3M
  • Samsung Electronics

Q6. Which flip chip technology segment will be the largest in future?

Answer: Lucintel forecasts that copper pillar is expected to witness highest growth over the forecast period due to increasing usage of copper pillar as an interconnector in transceiver, embedded processor, power management, baseband, ASIC, and SOC application.

Q7. In flip chip technology market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to the continuous research and development by major players and existence of manufacturing hubs in India and China.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the flip chip technology market by packaging technology (3D IC, 5D IC, and 2D IC), bumping technology (copper pillar, solder bumping, tin-lead eutectic solder, lead-free solder, gold bumping, and others), end use industry (electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Flip Chip Technology Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global Flip Chip Technology Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global Flip Chip Technology Market by Packaging Technology
    • 3.3.1: 3D IC
    • 3.3.2: 5D IC
    • 3.3.3: 2D IC
  • 3.4: Global Flip Chip Technology Market by Bumping Technology
    • 3.4.1: Copper Pillar
    • 3.4.2: Solder Bumping
    • 3.4.3: Tin-Lead Eutectic Solder
    • 3.4.4: Lead-Free Solder
    • 3.4.5: Gold Bumping
    • 3.4.6: Others
  • 3.5: Global Flip Chip Technology Market by End Use Industry
    • 3.5.1: Electronics
    • 3.5.2: Industrial
    • 3.5.3: Automotive & Transport
    • 3.5.4: Healthcare
    • 3.5.5: IT & Telecommunication
    • 3.5.6: Aerospace & Defense
    • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Global Flip Chip Technology Market by Region
  • 4.2: North American Flip Chip Technology Market
    • 4.2.1: North American Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
    • 4.2.2: North American Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others
  • 4.3: European Flip Chip Technology Market
    • 4.3.1: European Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
    • 4.3.2: European Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others
  • 4.4: APAC Flip Chip Technology Market
    • 4.4.1: APAC Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
    • 4.4.2: APAC Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others
  • 4.5: ROW Flip Chip Technology Market
    • 4.5.1: ROW Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
    • 4.5.2: ROW Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Flip Chip Technology Market by Packaging Technology
    • 6.1.2: Growth Opportunities for the Global Flip Chip Technology Market by Bumping Technology
    • 6.1.3: Growth Opportunities for the Global Flip Chip Technology Market by End Use Industry
    • 6.1.4: Growth Opportunities for the Global Flip Chip Technology Market by Region
  • 6.2: Emerging Trends in the Global Flip Chip Technology Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Flip Chip Technology Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Flip Chip Technology Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: IBM
  • 7.2: Intel
  • 7.3: Fujitsu
  • 7.4: 3M

7:5: Samsung Electronics