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市場調查報告書
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1457076

半導體後端設備市場：2024年至2029年預測

Semiconductor Back-End Equipment Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 135 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

半導體後端設備市場預計複合年成長率為8.11%，市場規模從2022年的861.93億美元增加到2029年的1487.56億美元。

該市場預計將擴大，不僅由於筆記型電腦、數位相機和智慧型手機等電子產品的功能進步，而且由於對小型設備的需求不斷增加。隨著 IC 設計變得更加複雜並且需要將更多的半導體產品推向市場來製造 IC，對半導體的需求正在穩步成長。半導體用於 IC 開發，以降低成本、加快批量生產並提高成品的營運價值。

半導體生產有前端製程和後端製程。後處理是半導體製造中在晶圓上定義電路之後發生的步驟。過程中有幾個步驟可以確保半導體晶片的功能、可靠性、性能和耐用性。每個步驟都需要一組特定的工具來實現極其精細的分析和功能。因此，公司透過提供半導體鑄造廠和製造設施所需的產品和服務來滿足對此類設備的需求。全球半導體需求的不斷成長正在推動整個工業部門的生產規模，從而帶動半導體後端設備市場。

對半導體的高需求

由於最終用戶應用的擴大，全球對半導體的需求正在增加。為了滿足產品開發和製造需求，年輕的新興企業依賴 ODM（原始設計製造商）和 OSAT（外包半導體組裝和測試）服務供應商。世界各國政府都將重點放在半導體的國內生產上，以減少對外國供應商的依賴。各國政府歡迎知名製造商的直接投資計劃，並提供優惠的法規。

例如，2022 年 2 月，印度宣布 Vedanta 與富士康、ISMC 以及新加坡 IGSS Ventures 等公司建立合作關係，總價值達 200 億美元。這些公司希望在該國設立顯示器工廠和半導體生產設施。 2022年9月，半導體園區及相關設施將在喀拉拉邦建成。對半導體和工業裝置的需求不斷成長預計將推動半導體後端設備市場的成長。

增加水質檢測設備的使用

晶圓測試是在稱為晶圓探測器的測試工具的幫助下完成的。晶圓探針台是一種自動測試設備，用於在半導體製造和生產中對晶圓進行電氣測試。使用光學和電子束測試技術測試晶圓的不規則性和缺陷，以防止日後出現可靠性問題。然後進行晶圓測試和切割，以檢查電路操作和訊號響應，然後將晶圓切成單獨的晶片。隨著市場上的公司開拓新的晶圓測試系統，晶圓測試的需求將增加，帶動半導體後端設備市場。

製造業需求不斷成長

半導體晶圓、IC晶片、記憶體晶片、電路和其他零件是使用半導體製造設備製造的。在製造過程的早期階段，使用矽晶圓製造設備。晶片加工設備的範例包括微影術設備、蝕刻設備、化學氣相沉積設備、測量設備和製程/品管設備。半導體製造設備市場的成長預計將受到不同終端用戶對分立元件、功率半導體和高功率模組日益成長的需求的推動。此外，隨著客戶越來越偏好較小的產品，將半導體整合到單一晶片上的趨勢日益成長。在這種情況下，該裝置的主要用途是將半導體元件組裝到一個晶片中。

對黏合設備的需求不斷增加

對效率、處理能力和小尺寸半導體晶片的需求不斷成長，推動了對半導體鍵合設備的需求，也是預測期內市場的驅動力。前端製程的顯著進步也導致對半導體鍵合設備的需求增加。對黏合設備解決方案的需求也受到其他應用和尖端封裝技術投資的推動。例如，2022 年 3 月，英特爾公司在歐盟半導體價值鏈上投資了 800 億歐元，其中包括尖端封裝技術。此外，生產商正專注於加強生產後端機械和半導體製造設備（SME）所需的半導體。例如，據透露，全球領先的電源和連接解決方案供應商Qorvo已獲得半導體製造設備（SME）許可。

亞太地區在預測期內將經歷指數級成長

亞太半導體後端設備市場預計將在預測期內快速成長。國內主要供應商的策略投資和成熟半導體產業的成長預計將推動市場。隨著晶片消費的增加，預計未來四年亞太半導體市場規模將是美洲的三倍以上。

此外，5G技術的採用推動了半導體製造設備市場的發展，從而增加了該地區對半導體晶片的需求。預計 5G 技術將顯著改善全球數位基礎設施。

重要市場公告

  • 2023年8月，領先的半導體代工廠台積電開始向多家尖端封裝設備供應商新訂單。谷登精工、Apic Yamada、Disco、Scientech等供應商已與該公司合作。
  • 2022年6月，美國晶圓製造設備製造商Lam Research於2023年6月宣布推出Coronaus DX。該設備可以一步在晶圓的兩個邊緣沉積一層獨特的保護塗層，有助於防止先進半導體製造過程中可能出現的缺陷和損壞。這項創新為採用以前不可能的先進邏輯、封裝和晶片製造流程打開了大門。這些發展預計也將影響先進後端硬體的進步。

目錄

第1章 簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章調查方法

  • 研究設計
  • 調查過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析
  • 分析師觀點

第5章半導體後端設備市場：依製程分類

  • 介紹
  • 晶圓測試
  • 黏合
  • 切丁
  • 測量
  • 組裝包裝

第6章 半導體後端設備市場：依地區分類

  • 介紹
  • 北美洲
  • 南美洲
  • 歐洲
  • 中東/非洲
  • 亞太地區

第7章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第8章 公司簡介

  • ASML Holding
  • Applied Materials
  • Lam Research
  • S firm Applied Materials Inc（Tokyo Electron Limited）
  • KLA Corporation
  • Onto Innovation Inc
  • SCREEN Holdings Co Ltd
  • Teradyne Inc
  • Japan Industrial Partners（Toshiba Corporation）
簡介目錄
Product Code: KSI061614890

The semiconductor back-end equipment market is expected to grow at a CAGR of 8.11%, reaching a market size of US$148.756 billion in 2029 from US$86.193 billion in 2022.

The market is expected to grow as a result of the increasing demand for small devices as well as functional advancements in electronic goods like laptops, digital cameras, smartphones, and others. Since IC designs are becoming more complex and more semiconductor products must be introduced to the market to manufacture ICs, the demand for semiconductors is increasing steadily. Semiconductors are used in I.C. development because they lower costs, speed up mass production, and increase the operational value of the finished product.

There are two processes involved in the production of semiconductors that are front-end and back-end. Back-end processing is the step-in semiconductor production that comes after the circuit definition on the wafer. To guarantee the functionality, dependability, performance, and durability of the semiconductor chips, several stages are included in the processes. For conducting analysis and function at incredibly minute levels, each process needs a particular set of tools. Therefore, businesses provide the goods and services needed by semiconductor foundries and manufacturing facilities to meet the demand for such equipment. The rising worldwide demand for semiconductors across the industrial sector has boosted their production scale which will drive the semiconductor back-end equipment market.

High demand for semiconductors

The global demand for semiconductors is increasing owing to growing end-user applications. To satisfy the demands for product development and manufacturing, younger, emerging companies rely on Original Design Manufacturers (ODMs) and Outsourced Semiconductor Assembly and Test (OSAT) service providers. Governments around the world are focusing on domestic semiconductor production to reduce their reliance on foreign vendors. They welcome direct investment programs from well-known manufacturers and provide favourable regulations.

For instance, in February 2022, India announced partnerships from companies like Vedanta with Foxconn, ISMC, and the Singapore-based IGSS venture totalling USD 20 billion. These businesses want to establish display fabs and semiconductor production facilities in the nation. In September 2022, a semiconductor park and related facilities will be built in Kerala according to plans developed collaboratively by Keltron, the Center for Development of Advanced Computing (C-DAC), the Electronic and Semiconductor Association (ESA), and the Vikram Sarabhai Space Center (VSSC) (ESA). As the semiconductor demand and industry setup increase it will boost the semiconductor back-end equipment market growth.

Increasing use of water testing equipment

The wafer testing is carried out with the assistance of wafer probers, which are pieces of test tools. A wafer probe is an automatic test device used in the creation and production of semiconductors to electrically test wafers. To prevent reliability concerns later, the wafer is inspected for any irregularities or defects using optical inspection and electron-beam inspection techniques. Following that is the wafer test and dicing, which checks the circuit's operation and signal responses before slicing the wafer into individual dice. The increasing development of new wafer testing systems by the market players will increase the demand for wafer testing and hence will boost the semiconductor back-end equipment market

Rising need in the manufacturing industry

Semiconductor wafers, IC chips, memory chips, circuits, and other components are made with semiconductor manufacturing equipment. Early in the manufacturing process, silicon wafer manufacturing equipment is used. Photolithography tools, etching machines, chemical vapour deposition machines, measurement machines, and process/quality control apparatus are examples of wafer processing equipment. The growth of the semiconductor manufacturing equipment market is anticipated to be driven by the growing need for discrete devices, power semiconductors, and high-power modules for diverse end users. Moreover, the trend of combining semiconductors onto a single chip is growing as customers' preferences for small-sized products grow. In this case, the main application of this equipment is the assembly of semiconductor parts into a single chip.

Increasing demand for bonding equipment

The growing need for semiconductor chips with greater efficiency, processing power, and smaller footprints is driving demand for semiconductor bonding equipment, which will propel the market during the forecast period. The substantial advancements in front-end processes have also led to an increase in the need for semiconductor bonding equipment. The need for bonding equipment solutions is also fueled by investments in other applications and state-of-the-art packaging technologies. For example, Intel Corp. invested EUR 80 billion in March 2022 throughout the European Union's semiconductor value chain, including state-of-the-art packaging technologies. In addition, producers are focusing on enhancing the semiconductors required for the production of back-end machinery and semiconductor manufacturing equipment (SME). For example, it was disclosed that Qorvo, a major worldwide supplier of power and connectivity solutions, had licensed

Asia Pacific is witnessing exponential growth during the forecast period.

During the forecast period, the Asia-Pacific Semiconductor Back-End Equipment Market is anticipated to grow at a rapid pace. Strategic investments from major domestic suppliers and the growth of the established semiconductor industry are expected to propel the market. The Asia-Pacific semiconductor market is anticipated to more than triple in size from that of the Americas over the next four years as chip consumption rises.

Additionally, the introduction of 5G technology has increased demand for semiconductor chips in the region by boosting the market for equipment used in semiconductor manufacturing. It is predicted that 5G technology will significantly improve the digital infrastructure globally.

Market key launches

  • In August 2023, Leading semiconductor foundry TSMC started placing new orders with various suppliers of cutting-edge packaging equipment. Suppliers including Gudeng Precision Industrial, Apic Yamada, Disco, and Scientech have been collaborating with the company. The company's choice to interact with equipment suppliers is indicative of its continuous endeavours to improve its advanced packaging capacities.
  • In June 2022, the US wafer fabrication equipment manufacturer Lam Research introduced Coronus DX in June 2023. This device can deposit a proprietary protective film on both wafer edges in a single step, helping to prevent defects and damage that can arise during advanced semiconductor manufacturing. This innovation opens the door for the adoption of previously unfeasible advanced logic, packaging, and chip production processes. It is also expected that these developments will have an impact on the advancement of sophisticated back-end hardware.

Segmentation:

By Procedure

  • Wafer Testing
  • Bonding
  • Dicing
  • Metrology
  • Assembly Packaging

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • UK
  • France
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • Japan
  • South Korea
  • India
  • Australia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key Benefits to the Stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Processes

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SEMICONDUCTOR BACK-END EQUIPMENT MARKET, BY PROCEDURE

  • 5.1. Introduction
  • 5.2. Wafer Testing
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. Bonding
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness
  • 5.4. Dicing
    • 5.4.1. Market Trends and Opportunities
    • 5.4.2. Growth Prospects
    • 5.4.3. Geographic Lucrativeness
  • 5.5. Metrology
    • 5.5.1. Market Trends and Opportunities
    • 5.5.2. Growth Prospects
    • 5.5.3. Geographic Lucrativeness
  • 5.6. Assembly Packing
    • 5.6.1. Market Trends and Opportunities
    • 5.6.2. Growth Prospects
    • 5.6.3. Geographic Lucrativeness

6. SEMICONDUCTOR BACK-END EQUIPMENT MARKET, BY GEOGRAPHY

  • 6.1. Introduction
  • 6.2. North America
    • 6.2.1. By Procedure
    • 6.2.2. By Country
      • 6.2.2.1. USA
        • 6.2.2.1.1. Market Trends and Opportunities
        • 6.2.2.1.2. Growth Prospects
      • 6.2.2.2. Canada
        • 6.2.2.2.1. Market Trends and Opportunities
        • 6.2.2.2.2. Growth Prospects
      • 6.2.2.3. Mexico
        • 6.2.2.3.1. Market Trends and Opportunities
        • 6.2.2.3.2. Growth Prospects
  • 6.3. South America
    • 6.3.1. By Procedure
    • 6.3.2. By Country
      • 6.3.2.1. Brazil
        • 6.3.2.1.1. Market Trends and Opportunities
        • 6.3.2.1.2. Growth Prospects
      • 6.3.2.2. Argentina
        • 6.3.2.2.1. Market Trends and Opportunities
        • 6.3.2.2.2. Growth Prospects
      • 6.3.2.3. Others
        • 6.3.2.3.1. Market Trends and Opportunities
        • 6.3.2.3.2. Growth Prospects
  • 6.4. Europe
    • 6.4.1. By Procedure
    • 6.4.2. By Country
      • 6.4.2.1. Germany
        • 6.4.2.1.1. Market Trends and Opportunities
        • 6.4.2.1.2. Growth Prospects
      • 6.4.2.2. UK
        • 6.4.2.2.1. Market Trends and Opportunities
        • 6.4.2.2.2. Growth Prospects
      • 6.4.2.3. France
        • 6.4.2.3.1. Market Trends and Opportunities
        • 6.4.2.3.2. Growth Prospects
      • 6.4.2.4. Spain
        • 6.4.2.4.1. Market Trends and Opportunities
        • 6.4.2.4.2. Growth Prospects
      • 6.4.2.5. Others
        • 6.4.2.5.1. Market Trends and Opportunities
        • 6.4.2.5.2. Growth Prospects
  • 6.5. Middle East and Africa
    • 6.5.1. By Procedure
    • 6.5.2. By Country
      • 6.5.2.1. Saudi Arabia
        • 6.5.2.1.1. Market Trends and Opportunities
        • 6.5.2.1.2. Growth Prospects
      • 6.5.2.2. UAE
        • 6.5.2.2.1. Market Trends and Opportunities
        • 6.5.2.2.2. Growth Prospects
      • 6.5.2.3. Others
        • 6.5.2.3.1. Market Trends and Opportunities
        • 6.5.2.3.2. Growth Prospects
  • 6.6. Asia Pacific
    • 6.6.1. By Procedure
    • 6.6.2. By Country
      • 6.6.2.1. China
        • 6.6.2.1.1. Market Trends and Opportunities
        • 6.6.2.1.2. Growth Prospects
      • 6.6.2.2. Japan
        • 6.6.2.2.1. Market Trends and Opportunities
        • 6.6.2.2.2. Growth Prospects
      • 6.6.2.3. South Korea
        • 6.6.2.3.1. Market Trends and Opportunities
        • 6.6.2.3.2. Growth Prospects
      • 6.6.2.4. India
        • 6.6.2.4.1. Market Trends and Opportunities
        • 6.6.2.4.2. Growth Prospects
      • 6.6.2.5. Australia
        • 6.6.2.5.1. Market Trends and Opportunities
        • 6.6.2.5.2. Growth Prospects
      • 6.6.2.6. Others
        • 6.6.2.6.1. Market Trends and Opportunities
        • 6.6.2.6.2. Growth Prospects

7. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 7.1. Major Players and Strategy Analysis
  • 7.2. Market Share Analysis
  • 7.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 7.4. Competitive Dashboard

8. COMPANY PROFILES

  • 8.1. ASML Holding
  • 8.2. Applied Materials
  • 8.3. Lam Research
  • 8.4. S firm Applied Materials Inc (Tokyo Electron Limited)
  • 8.5. KLA Corporation
  • 8.6. Onto Innovation Inc
  • 8.7. SCREEN Holdings Co Ltd
  • 8.8. Teradyne Inc
  • 8.9. Japan Industrial Partners (Toshiba Corporation)