市場調查報告書
商品編碼
1466363
半導體製造設備市場:依產品類型、尺寸和設備類型 - 2024-2030 年全球預測Semiconductor Manufacturing Equipment Market by Product Type (Memory Logics, Micro-electromechanical system, Microprocessor Units), Dimension (2.5D ICs, 2D ICs, 3D ICs), Equipment Type - Global Forecast 2024-2030 |
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預計2023年半導體製造設備市場規模為906.3億美元,預估2024年將達961.6億美元,2030年將達1,442.9億美元,複合年成長率為6.86%。
半導體製造設備包括用於製造半導體裝置(例如積體電路(IC)、電晶體和其他電子元件)的機器和工具。半導體製造設備是指生產各種半導體產品所必需的生產設備,屬於半導體產業鏈的重要支撐環節。半導體產量和銷量的增加正在增加對半導體製造設備的需求。根據最近的一項研究,2021 年半導體產業的銷量將達到 1.15 兆顆。半導體製造設備包括晶圓製造設備、組裝/封裝設備、測試/檢查設備等各個領域。對電子設備的需求不斷成長以及半導體行業的技術進步正在推動對半導體製造設備的需求。半導體產業的逐步變化,例如節點和晶圓尺寸的小型化,以及超大規模整合技術對更大晶圓尺寸的需求,正在推動半導體製造設備的使用。然而,全球晶片短缺問題正在阻礙市場成長。市場廠商正在引進先進的半導體製造設備,市場規模可望擴大。
主要市場統計 | |
---|---|
基準年[2023] | 906.3億美元 |
預測年份 [2024] | 961.6億美元 |
預測年份 [2030] | 1442.9億美元 |
複合年成長率(%) | 6.86% |
半導體技術中對儲存邏輯裝置的高需求,以實現產品類型資料的儲存和搜尋
記憶體邏輯元件是現代半導體技術的重要組成部分,可實現資料儲存和搜尋。記憶體邏輯半導體製造設備必須能夠製造各種類型的記憶體,包括DRAM(動態隨機存取記憶體)、SRAM(靜態RAM)和快閃記憶體。這些設備在家用電子電器、汽車和工業應用中發揮關鍵作用,需要高精度和高效的製造技術。對更密集、更快速、更節能的記憶體解決方案的需求正在推動微影術、沉積和蝕刻設備的創新,重點是 3D 記憶體結構的製造和縮放挑戰的進步。電子機械系統 (MEMS) 是在微觀尺度上整合機械和電氣元件,從而產生適用於各種應用(從汽車系統中的感測器到醫療設備)的具有移動部件的設備。製造 MEMS 涉及複雜的工藝,例如矽微加工,需要精密沉澱、微影製程、蝕刻和封裝設備。
隨著物聯網設備和穿戴式技術等 MEMS 應用的擴展,對半導體製造設備的要求正在朝向更高的精度和多功能性發展,以適應 MEMS 製造中涉及的複雜結構和多樣化材料。微處理器單元 (MPU) 是運算設備的核心,對於確定效能和功能至關重要。製造 MPU 涉及先進的半導體製造程序,需要最先進的設備,例如微影術、離子布植、化學氣相沉積 (CVD) 和金屬有機 CVD。莫耳定律對更小、更快、更節能微處理器的不懈追求強調了製造設備不斷創新的必要性。將晶片線寬降低到 10 nm 以下以及透過原子級工程減少缺陷等挑戰凸顯了先進設備在 MPU 製造中的戰略重要性。
尺寸:3D IC 在需要高資料處理和速度等級的應用中的適用性
2D IC 代表傳統的半導體裝置型態,其中組件製造在單一矽平面或矽層上。這種 IC 設計方法幾十年來一直主導著電子產業,為電子設備的小型化和提高性能奠定了基礎。然而,隨著莫耳定律接近其極限,2D IC 的小型化變得越來越困難和昂貴。 2.5D IC 提供了一種過渡解決方案,可實現更高的晶片性能和功能,而不會產生與直接轉向3D整合相關的直接複雜性和成本。在 2.5D IC 中,多個晶粒並排放置在內插器(通常由矽製成)上,中介層提供晶粒之間的電氣連接。該架構允許晶粒之間的連接更短,從而比傳統 2D IC 具有更低的延遲和更高的頻寬。它還支援異質整合,允許組合由不同製造程序製造的組件。 3D IC 代表了半導體製造的重大發展,堆疊多層主動電子元件並將它們垂直互連。這種範例實現了極其密集的配置,具有更高的性能、更低的功耗和更小的外形尺寸的潛力。垂直堆疊和整合顯著縮短了各個電晶體之間的距離,提高了資料傳輸速度,同時降低了功耗。 3D IC 在需要高資料處理和速度等級的應用中特別有用,例如運算、行動通訊和高效能圖形渲染。儘管 3D IC 具有許多優點,但它也帶來了重大的製造挑戰,包括散熱、層間互連和產量比率管理,這些挑戰正在透過技術進步和設計方法來積極解決。
區域洞察
中國、韓國、日本和越南等國家持續致力於擴大半導體產業,在亞太地區創造了一系列半導體製造設備。中國政府持續將半導體產業視為經濟成長和技術領先的驅動力,預計到2030年將增加全球新增半導體產能的約40%。 2022 年 11 月,南亞和中亞各國政府啟動了一個重點關注半導體產業的貿易代表團。目標是為印度提供支持,應對半導體供應鏈內的挑戰並增強國內半導體製造能力。智慧電子產品和消費性電子產品在醫療保健、汽車和製造等各種最終用途產業的高採用率,正在為亞太地區半導體製造設備的成長創造平台。半導體研發、製造和分銷以及政府獎勵計劃的顯著成長正在推動半導體製造設備的利用,以滿足美洲對半導體不斷成長的需求。 2020 年 6 月,美國政府推出了《CHIPS 法案》,其中包括一項約 390 億美元的製造業激勵計劃,旨在振興美國跨多種技術的晶片製造生態系統。 《CHIPS/科學法案》還設立了由美國財政部管理的 25% 先進製造業投資稅額扣抵,以補充製造業獎勵計畫。快速數位化、行動電子設備的普及以及對消費性電子產品和智慧工業機械不斷成長的需求預計將推動 EMEA 半導體製造設備市場的成長。
FPNV定位矩陣
FPNV定位矩陣對於評估半導體製造設備市場極為重要。我們檢視與業務策略和產品滿意度相關的關鍵指標,以對供應商進行全面評估。這種深入的分析使用戶能夠根據自己的要求做出明智的決策。根據評估,供應商被分為四個成功程度不同的像限:前沿(F)、探路者(P)、利基(N)和重要(V)。
市場佔有率分析
市場佔有率分析是一種綜合工具,可以對半導體製造設備市場供應商的現狀進行深入而深入的研究。全面比較和分析供應商在整體收益、基本客群和其他關鍵指標方面的貢獻,以便更好地了解公司的績效及其在爭奪市場佔有率時面臨的挑戰。此外,該分析還提供了對該行業競爭特徵的寶貴見解,包括在研究基準年觀察到的累積、分散主導地位和合併特徵等因素。詳細程度的提高使供應商能夠做出更明智的決策並制定有效的策略,從而在市場上獲得競爭優勢。
1. 市場滲透率:提供有關主要企業所服務的市場的全面資訊。
2. 市場開拓:我們深入研究利潤豐厚的新興市場,並分析其在成熟細分市場的滲透率。
3. 市場多元化:提供有關新產品發布、開拓地區、最新發展和投資的詳細資訊。
4. 競爭評估和情報:對主要企業的市場佔有率、策略、產品、認證、監管狀況、專利狀況和製造能力進行全面評估。
5. 產品開發與創新:提供對未來技術、研發活動和突破性產品開發的見解。
1.半導體製造設備市場的市場規模與預測是多少?
2.半導體製造設備市場預測期間需要考慮投資的產品、細分市場、應用和領域有哪些?
3.半導體製造設備市場的技術趨勢和法規結構是什麼?
4.半導體製造設備市場主要廠商的市場佔有率是多少?
5.進入半導體製造設備市場的合適型態和策略手段是什麼?
[193 Pages Report] The Semiconductor Manufacturing Equipment Market size was estimated at USD 90.63 billion in 2023 and expected to reach USD 96.16 billion in 2024, at a CAGR 6.86% to reach USD 144.29 billion by 2030.
The semiconductor manufacturing equipment includes machinery and tools used to manufacture semiconductor devices such as integrated circuits (ICs), transistors, and other electronic components. Semiconductor manufacturing equipment refers to the production equipment required to produce various semiconductor products and belongs to the key supporting link of the semiconductor industry chain. Increasing production and sale of semiconductors elevates the demand for semiconductor manufacturing equipment. According to a recent study, the industry sold 1.15 trillion units of semiconductors in 2021. The semiconductor manufacturing equipment includes various ranges such as wafer fabrication equipment, assembly and packaging equipment, and testing and inspection equipment. The growing demand for electronic devices and technological advancements in the semiconductor industry drives the demand for semiconductor manufacturing equipment. The gradual transitions in the semiconductor industry, such as the miniaturization of nodes and wafer sizes and the demand for increasing the wafer sizes for ultra-large-scale integration technologies, are fostering the usage of semiconductor manufacturing equipment. However, the chip shortage issues worldwide are impeding the growth of the market. The ongoing introduction of advanced semiconductor manufacturing equipment by market vendors is expected to expand the market scope.
KEY MARKET STATISTICS | |
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Base Year [2023] | USD 90.63 billion |
Estimated Year [2024] | USD 96.16 billion |
Forecast Year [2030] | USD 144.29 billion |
CAGR (%) | 6.86% |
Product Type: High demand for memory logic devices in semiconductor technology for the storage and retrieval of data
Memory Logic devices form an essential component of modern semiconductor technology, enabling the storage and retrieval of data. Semiconductor manufacturing equipment for memory logic must cater to producing various types of memories, including Dynamic Random-Access Memory (DRAM), Static RAM (SRAM), and Flash memory. These devices play pivotal roles in consumer electronics, automotive, and industrial applications, calling for highly precise and efficient fabrication technologies. The demand for denser, faster, and energy-efficient memory solutions drives innovation in lithography, deposition, and etching equipment, emphasizing advancements in 3D memory structure manufacturing and scaling challenges. Micro-electromechanical Systems (MEMS) integrate mechanical and electrical components at a microscopic scale, leading to devices with moving parts with applications ranging from sensors in automotive systems to medical devices. Manufacturing MEMS involves intricate processes such as silicon micromachining and necessitates precision deposition, photolithography, etching, and packaging equipment.
As the application areas of MEMS expand, including IoT devices and wearable technology, the requirement for semiconductor manufacturing equipment evolves towards higher precision and versatility to accommodate the complex structures and diverse materials involved in MEMS fabrication. The heart of computing devices, microprocessor units (MPUs), are critical in defining performance and functionality. Manufacturing MPUs involves sophisticated semiconductor fabrication processes that require cutting-edge equipment for lithography, ion implantation, chemical vapor deposition (CVD), and metal-organic CVD, among others. The relentless pursuit of Moore's Law, aiming for smaller, faster, and more energy-efficient microprocessors, underscores the constant need for innovation in manufacturing equipment. Challenges such as reducing line widths on chips to sub-10 nm scales and mitigating defects in atomic-scale engineering underscore the strategic importance of advanced equipment in MPU production.
Dimension: Suitability of 3D ICs in applications requiring high data processing and speed levels
2D ICs represent the conventional form of semiconductor devices where components are fabricated on a single plane or layer of silicon. This approach to IC design has dominated the electronics industry for decades, providing a basis for the miniaturization & performance enhancement of electronic devices. However, with the approaching limits of Moore's Law, scaling down 2D ICs has become increasingly challenging and costly, giving rise to alternative dimensional integration techniques. 2.5D ICs offer a transitional solution towards achieving higher chip performance and functionality without the immediate complexities and costs associated with transitioning directly to 3D integration. In 2.5D ICs, multiple dies are placed side by side on an interposer (usually made of silicon), providing electrical connections between them. This architecture allows for shorter connections between dies, resulting in lower latency and higher bandwidth than traditional 2D ICs. It also enables heterogeneous integration, allowing for the combination of components built on different manufacturing processes. 3D ICs represent a significant evolution in semiconductor manufacturing, where multiple layers of active electronic components are stacked and interconnected vertically. This paradigm allows for incredibly dense configurations, potentially delivering higher performance, reduced power consumption, and smaller form factors. The vertical stacking and integration facilitate a much shorter distance between individual transistors, enhancing data transfer speeds while reducing power usage. 3D ICs are particularly beneficial in applications requiring high data processing and speed levels, such as computing, mobile communications, and high-performance graphics rendering. Despite their advantages, 3D ICs pose significant manufacturing challenges, including heat dissipation, inter-layer connectivity, and yield management, which are actively being addressed through technological advancements and design methodologies.
Regional Insights
The countries such as China, South Korea, Japan, and Vietnam are continuously increasing their focus on expanding their semiconductor industry, creating a scope of semiconductor manufacturing equipment in Asia-Pacific. The Chinese government is expected to add roughly 40% of the new global semiconductor capacity by 2030 and continues to prioritize the semiconductor industry as a driver of economic growth and technological leadership. In November 2022, governments in South and Central Asia launched a trade mission focused on the semiconductor industry. The objective was to provide support to India in addressing challenges within the semiconductor supply chain and to enhance the country's domestic semiconductor manufacturing capabilities. The high adoption rate of smart electronics & consumable electronics across various end-use industries, including healthcare, automobiles, and manufacturing, is creating a platform for the growth of semiconductor manufacturing equipment in Asia-Pacific. The substantial growth in the research & development, manufacturing, and distribution of semiconductors with government incentive programs propel the utilization of semiconductor manufacturing equipment to fulfill the growing demand for semiconductors in the Americas. In June 2020, the Government of the United States introduced the CHIPS Act with an approximately 39 billion manufacturing incentive program to revitalize the U.S. chipmaking ecosystem across various technologies. The CHIPS and Science Act also established a 25% advanced manufacturing investment tax credit to be implemented by the U.S. Department of Treasury to complement the manufacturing incentive program. Rapid digitalization, penetration of portable electronic devices, and rising demand for consumer electronics products and smart industrial machinery are expected to drive the growth of EMEA's semiconductor manufacturing equipment market.
FPNV Positioning Matrix
The FPNV Positioning Matrix is pivotal in evaluating the Semiconductor Manufacturing Equipment Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Semiconductor Manufacturing Equipment Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Key Company Profiles
The report delves into recent significant developments in the Semiconductor Manufacturing Equipment Market, highlighting leading vendors and their innovative profiles. These include Advanced Dicing Technologies Ltd., Advantest Corporation, Applied Materials, Inc., ASM International N.V., ASML Holding N.V., Atlas Copco AB, Cannon Inc., Energetiq Technology, Inc., EV Group, Ferrotec Holdings Corporation, FutureFab, Inc., Hitachi, Ltd., Intel Corporation, JEOL Ltd., KLA Corporation, Lam Research Corporation, Modutek Corporation, Nikon Corporation, Nordson Corporation, Onto Innovation Inc., Screen Holdings Co., Ltd., Support Specialties, Inc. (S-Cubed), SUSS MicroTec SE, Tokyo Seimitsu Co., Ltd., and Veeco Instruments Inc..
Market Segmentation & Coverage
1. Market Penetration: It presents comprehensive information on the market provided by key players.
2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.
1. What is the market size and forecast of the Semiconductor Manufacturing Equipment Market?
2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Semiconductor Manufacturing Equipment Market?
3. What are the technology trends and regulatory frameworks in the Semiconductor Manufacturing Equipment Market?
4. What is the market share of the leading vendors in the Semiconductor Manufacturing Equipment Market?
5. Which modes and strategic moves are suitable for entering the Semiconductor Manufacturing Equipment Market?