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市場調查報告書

商品編碼

1425024

混合儲存立方體市場 - 2024 年至 2029 年預測

Hybrid Memory Cube Market - Forecasts from 2024 to 2029

出版日期: 2024年01月15日 | 出版商:

Knowledge Sourcing Intelligence | 英文 144 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

2022年混合儲存立方體市場規模為1,233,443,000美元。

混合記憶體立方 (HMC) 是一種簡報的 PC 不規則存取記憶體 (Slam) 介面，適用於穿透矽通孔主記憶體。它由三星電子和美光科技於2011年共同開發，承諾速度比DDR3快15倍。 HMC 與不相容的競爭對手介面 HBM（高頻寬記憶體）競爭。 HMC 是一種高效能儲存技術，將 DRAM 和邏輯整合到單晶片中。這是透過使用矽通孔 (TSV) 技術在邏輯晶粒頂部堆疊多個 DRAM晶粒來實現的。 TSV 是一種微小的電氣連接，可穿透矽基基板並實現 DRAM晶粒和邏輯晶粒之間的通訊。 Micron Technology 的 HMC Gen2資料將其描述為單一封裝，包含使用 TSV 技術堆疊的四個 DRAM晶粒和一個邏輯晶粒。

介紹：

混合儲存立方體市場涉及 HMC 技術的開發、製造和銷售。 HMC 是一種垂直堆疊而不是水平堆疊的 3D 記憶體。與傳統 DRAM 相比，這可實現更高的儲存密度和頻寬。 HMC 可用於多種應用，包括高效能運算、網路和人工智慧。儘管混合儲存立方體（HMC）市場仍處於起步階段，但預計未來幾年將快速成長。這是由各種應用程式對高效能記憶體不斷成長的需求所推動的。 HMC 市場的主要促進因素包括高效能運算市場的成長、人工智慧的日益普及以及網路應用對高頻寬記憶體的需求。 HMC 市場的主要參與企業包括 Micron Technologies、Intel Corporation、Fujitsu Limited、Semtech Corporation 和 OpenSilicon Corporation。這些公司正在大力投資 HMC 技術的開發和商業化。

促進因素

對高頻寬、低功耗和可擴展記憶體的需求不斷成長：HMC 技術提供了高效能運算、網路和資料中心所需的高頻寬和低功耗。對高頻寬、低功耗和可擴展記憶體不斷成長的需求預計將推動 HMC 市場的成長。
雲端服務影響力日益增強：HMC技術有望在需要高效能運算和高頻寬記憶體的雲端服務中發揮重要作用。
對行動性的需求不斷增加：HMC技術預計將在需要高效能運算和高頻寬記憶體的行動裝置中採用。由於行動需求的增加，HMC 市場預計將成長。
與產業參與企業的新合作：為了將 HMC 產品推向市場，公司正在專注於與能夠採用 HMC 技術並將其整合到其產品中的行業參與企業建立新的合作夥伴關係。例如，美光科技和英特爾公司在記憶體產品的開發和製造方面有著長期的合作關係。此次合作最顯著的成果之一是混合記憶體立方體 (HMC)，這是一項突破性記憶體技術，將 DRAM 的速度與快閃記憶體的密度結合在一起。

主要企業提供的產品

富士通超級電腦「PRIMEHPC FX100」採用尖端的3D堆疊混合儲存立方體（HMC）技術，實現480GB/s的高儲存頻寬。
三星的 HBM2（高頻寬記憶體）技術是一種用於顯示卡、高效能運算和網路應用的 HMC。
英特爾的 Stratix 10 現場可程式閘陣列 (FPGA) 使用 HMC 技術來提供高效能運算和網路所需的高頻寬和低功耗。

混合儲存立方體市場中 GPU（圖形處理單元）部分顯著成長：

在HMC（混合儲存立方體）市場中，GPU（圖形處理單元）領域的成長引人注目。 GPU 對於高效能運算、遊戲和人工智慧應用至關重要，這些應用需要高頻寬和低延遲記憶體解決方案。 HMC 技術採用 3D 堆疊架構和直通孔 (TSV) 技術，提供 GPU 實現最佳效能所需的高頻寬和低功耗。隨著對高階圖形和人工智慧驅動應用程式的需求持續成長，HMC 市場的 GPU 部分預計將顯著成長。

預計亞太地區將在混合儲存立方體市場中佔據主要佔有率：

預計亞太地區將佔據混合儲存立方體（HMC）市場的主要佔有率。這是由多種因素推動的，包括該地區在電子和半導體行業的強大影響力，以及中國、日本和韓國等國家對高效能運算、遊戲和人工智慧應用不斷成長的需求。此外，亞太地區是 HMC 技術的主要市場，因為雲端服務的快速成長和先進技術的採用正在推動對高頻寬、低功耗、高可擴展性記憶體解決方案的需求。

主要進展：

2021年11月，三星電子宣佈開發出混合基板立方體（H-Cube）技術。它是最新的 2.5D 捆綁方案，專門用於 HPC、基於電腦的智慧、伺服器群和半導體，適合需要高效能和大面積捆綁技術的組織。

The Hybrid Memory Cube (HMC) is a superior presentation PC irregular access memory (Slam) interface for through-silicon vias (TSV)- based stacked Measure memory. It was co-developed by Samsung Electronics and Micron Technology in 2011 and promised a 15 times speed improvement over DDR3. The HMC is competing with the incompatible rival interface High Bandwidth Memory (HBM). HMC is a high-performance memory technology that combines DRAM and logic on a single chip. This is achieved by stacking multiple DRAM dies on top of a logic die using through-silicon via (TSV) technology. TSVs are tiny electrical connections that pass through the silicon substrate, allowing the DRAM dies to communicate with the logic die. The HMC Gen2 data sheet by Micron Technology explains that it is a single package containing four DRAM dies and one logic die, all stacked together using TSV technology.

Introduction:

The hybrid memory cube market deals in the development, manufacturing, and sale of HMC technology. HMC is a type of 3D memory that is stacked vertically, rather than horizontally. This allows for higher memory density and bandwidth than traditional DRAM. HMC is used in a variety of applications, including high-performance computing, networking, and artificial intelligence. The hybrid memory cube (HMC) market is still in its infancy, but it is poised for rapid growth in the years to come. This is driven by the growing demand for high-performance memory in a wide range of applications. The main drivers of the HMC market are mainly attributed to the growth of the high-performance computing market, the increasing adoption of artificial intelligence, and the need for high-bandwidth memory in networking applications. The major players in the HMC market are Micron Technologies, Intel Corporation, Fujitsu Ltd., Semtech Corporation, and Open Silicon Inc. These companies are investing heavily in the development and commercialization of HMC technology.

Drivers:

Growing need for high bandwidth, low power consumption, and highly scalable memories: The HMC technology provides high bandwidth and low power consumption, which is essential for high-performance computing, networking, and data centers. The HMC market is expected to grow due to the increasing demand for high-bandwidth, low-power-consuming, and scalable memories.
Rising impact of cloud services: The HMC technology is expected to play a significant role in cloud services, which require high-performance computing and high-bandwidth memory. The HMC market is expected to grow due to the rising impact of cloud services.
Increasing demand for mobility: The HMC technology is expected to be used in mobile devices, which require high-performance computing and high-bandwidth memory. The HMC market is expected to grow due to the increasing demand for mobility.
New collaborations with industry players: To launch HMC products in the market, companies focus on new collaborations with industry players who could use and integrate HMC technology into their products. For example, Micron Technology and Intel Corporation have a long-standing partnership in the development and manufacturing of memory products. One of the most notable outcomes of this partnership is the Hybrid Memory Cube (HMC), a revolutionary memory technology that combines the speed of DRAM with the density of flash memory.

Products offered by key companies:

Fujitsu's PRIMEHPC FX100 supercomputer uses the state-of-the-art 3D-stacked Hybrid Memory Cube (HMC) technology, achieving a high memory bandwidth of 480 GB/s.
Samsung's HBM2 (High Bandwidth Memory) technology is a type of HMC that is used in graphics cards, high-performance computing, and networking applications. HBM2 provides high bandwidth and low power consumption, which is essential for high-performance computing and high-bandwidth memory.
Intel's Stratix 10 FPGA (Field Programmable Gate Array) uses HMC technology to provide high bandwidth and low power consumption, which is essential for high-performance computing and networking.

Prominent growth in the Graphics Processing Unit (GPU) segment within the hybrid memory cube market:

The Graphics Processing Unit (GPU) segment is experiencing prominent growth within the Hybrid Memory Cube (HMC) market. GPUs are essential for high-performance computing, gaming, and artificial intelligence applications, which require high bandwidth and low latency memory solutions. The HMC technology, with its 3D-stacked architecture and through-silicon via (TSV) technology, provides the necessary high bandwidth and low power consumption for GPUs to deliver optimal performance. As the demand for advanced graphics and AI-driven applications continues to rise, the GPU segment within the HMC market is expected to witness significant growth.

The Asia Pacific region is expected to hold a significant share of the hybrid memory cube market:

The Asia Pacific region is expected to hold a significant share of the Hybrid Memory Cube (HMC) market. This can be attributed to several factors, including the region's strong presence in the electronics and semiconductor industries, as well as the increasing demand for high-performance computing, gaming, and artificial intelligence applications in countries like China, Japan, and South Korea. Additionally, the rapid growth of cloud services and the adoption of advanced technologies in the Asia Pacific region are driving the need for high-bandwidth, low-power consuming, and highly scalable memory solutions, making it a key market for HMC technology.

Key development:

In November 2021, Samsung Electronics declared that it has created Hybrid-Substrate Cube (H-Cube) technology, its most recent 2.5D bundling arrangement specific for semiconductors for HPC, computer-based intelligence, server farm and organization items that require high-execution and enormous region bundling technology.

Segments

By Product

2 GB
4 GB
8 GB

By Application

Graphics Processing Unit (GPU)
Central Processing Unit (CPU)
Accelerated Processing Unit (APU)
Field-programmable Gate Array (FPGA)
Application-specific Integrated Circuit (ASIC)

By End Use Industry

Enterprise Storage
Telecommunications and Networking
Others

By Geography

North America
United States
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
United Kingdom
Germany
France
Spain
Others
Middle East and Africa
Saudi Arabia
UAE
Israel
Others
Asia Pacific
Japan
China
India
South Korea
Indonesia
Thailand
Others

1. INTRODUCTION

1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Market Segmentation
1.5. Currency
1.6. Assumptions
1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

2.1. Research Data
2.2. Research Process

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers
4.2. Market Restraints
4.3. Porter's Five Force Analysis
- 4.3.1. Bargaining Power of Suppliers
- 4.3.2. Bargaining Power of Buyers
- 4.3.3. Threat of New Entrants
- 4.3.4. Threat of Substitutes
- 4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis

5. HYBRID MEMORY CUBE MARKET, BY PRODUCT

5.1. Introduction
5.2. 2 GB
5.3. 4 GB
5.4. 8 GB

6. HYBRID MEMORY CUBE MARKET, BY APPLICATION

6.1. Introduction
6.2. Graphics Processing Unit (GPU)
6.3. Central Processing Unit (CPU)
6.4. Accelerated Processing Unit (APU)
6.5. Field-programmable Gate Array (FPGA)
6.6. Application-specific Integrated Circuit (ASIC)

7. HYBRID MEMORY CUBE MARKET, BY END-USE INDUSTRY

7.1. Introduction
7.2. Enterprise Storage
7.3. Telecommunications and Networking
7.4. Others

8. HYBRID MEMORY CUBE, BY GEOGRAPHY

8.1. Introduction
8.2. North America
- 8.2.1. United States
- 8.2.2. Canada
- 8.2.3. Mexico
8.3. South America
- 8.3.1. Brazil
- 8.3.2. Argentina
- 8.3.3. Others
8.4. Europe
- 8.4.1. United Kingdom
- 8.4.2. Germany
- 8.4.3. France
- 8.4.4. Spain
- 8.4.5. Others
8.5. The Middle East and Africa
- 8.5.1. Saudi Arabia
- 8.5.2. UAE
- 8.5.3. Israel
- 8.5.4. Others
8.6. Asia Pacific
- 8.6.1. Japan
- 8.6.2. China
- 8.6.3. India
- 8.6.4. South Korea
- 8.6.5. Indonesia
- 8.6.6. Thailand
- 8.6.7. Others