智慧型手機品牌半導體晶片自主開發分析

Analysis of In-house Development of Semiconductor Chips by Smartphone Brands

出版日期: 2023年10月23日 | 出版商:

TrendForce | 英文 13 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

隨著全球半導體產業日益專業化，積體電路（IC）設計公司主要負責智慧型手機應用處理器（AP）和系統單晶片（SoC）的設計和開發。然而，隨著蘋果成功發表自研晶片，各智慧型手機品牌也開始採取同樣的策略。

對於智慧型手機品牌來說，內部開發半導體元件需要大量的初始投資。此外，SoC 由各種模組和架構組成，例如影像訊號處理器 (ISP) 和數據機。晶片設計人員面臨的挑戰是透過優化這些模組和架構之間的資源分配來實現效能和功耗之間的最佳平衡。整體而言，對於沒有足夠經驗和技術專長的智慧型手機品牌來說，內部開發半導體元件是一項複雜的任務。儘管如此，在各種動機的推動下，智慧型手機品牌仍然希望追求這一目標。

本報告調查了智慧型手機品牌半導體晶片的內部開發情況，提供了內部開發的驅動力、各公司的趨勢、風險和挑戰以及對IC設計行業的未來影響。

With the global semiconductor industry increasingly adopting specialization, the design and development of application processor (AP) and system on a chip (SoC) for smartphones are primarily undertaken by integrated circuit (IC) design companies. However, in the wake of Apple's successful release of in-house developed chips, various smartphone brands have started to adopt the same strategy.

For smartphone brands, developing semiconductor components in-house requires a significant initial investment. Additionally, a SoC consists of various modules and architectures, such as image signal processors (ISP) and modems. Chip designers are tested to see if they can achieve the best balance between performance and power consumption by optimizing the allocation of resources between these modules and architectures. Overall, developing semiconductor components in-house is a complex task for smartphone brands without sufficient prior experience and technological expertise. Nevertheless, driven by various motivations, smartphone brands still want to pursue this goal.