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有限元素和先進封裝用金屬化學品全球市場分析（2022-2023）
市場調查報告書
商品編碼
1413691

有限元素和先進封裝用金屬化學品全球市場分析（2022-2023）

Metal Chemicals for FE & Advanced Packaging Market Report (a Critical Materials Report) 2023-2024
出版日期: | 出版商: TECHCET | 英文 170 Pages | 商品交期: 最快1-2個工作天內

價格

本報告分析了先進封裝（晶圓級）和半導體裝置製造（鑲嵌製程）中使用的金屬化學品的市場趨勢和供應鏈。它還包括有關鍍銅和添加劑的趨勢、市場份額結構、技術趨勢、供應商簡介等資訊。附錄中還包括供應商產品比較圖，總結了先進封裝中使用的電鍍產品的公開資訊。

有關金屬化學品市場最新資訊和報告亮點的特色新聞稿：

目錄

第一章執行摘要

第二章 研究範圍、目的與研究方法

第三章 半導體產業市場現況與展望

  • 世界經濟
    • 連結半導體產業與全球經濟
    • 半導體銷售額成長率
    • 台灣月度銷售趨勢
    • 2023年高度不確定性－半導體收入成長預計將放緩至負值
  • 電子產品市場
    • 手機
    • PC 出貨量
    • 伺服器/IT市場
  • 半導體製造業的成長與擴張
    • 鑄造廠擴建公告：概述
    • 透過在世界各地擴大鑄造廠來加速成長
    • 資本支出趨勢
    • 技術路線圖
    • 代工投資評估
  • 政策和貿易趨勢及影響
  • 半導體材料概述
    • 晶片生產進度可能受到材料產能限制
    • 持續的物流問題：對西方世界的負面影響
    • Techcet晶圓開始預測至2026年
    • Techcet材料預測

第四章金屬化學品市場：按細分市場

  • 定義
  • 金屬電鍍化學品市場：概述
    • 概述：先進封裝和鑲嵌金屬化
    • 概述：電鍍市場的轉變趨勢
  • 先進封裝金屬化：市場驅動因素
    • 先進封裝：鍍銅添加劑收入
    • 先進封裝：銅化學品收入
    • 先進封裝添加劑用量
    • 其他先進封裝用電鍍材料
    • 鍍錫/錫銀
  • 鑲嵌成長趨勢
    • 鑲嵌驅動因素
    • 鑲嵌銅電鍍收入
    • 鑲嵌添加量

第五章科技趨勢

  • 封裝技術趨勢
    • 封裝技術挑戰
  • 技術趨勢
    • 市場驅動的技術趨勢
    • ADV邏輯互連佈線技術的演變
    • CU鑲嵌品質要求
    • 邏輯金屬化路線圖
    • ADV 邏輯嵌入式電源軌
    • 技術路線圖：採用 MO 或 RU 的 DRAM
    • 先驅技術路線圖：採用 MO 或 RU 的 3D NAND
    • 邏輯製程流程範例：20-32NM邏輯PVD
    • 技術要求總結1/2　

第六章 競爭狀況

  • 先進封裝鑲嵌整體市場份額
  • OEM市佔率：電鍍設備
  • 按應用劃分的市場份額：用於先進封裝的 CU 電鍍
  • 按地區/其他公司
  • 併購 (M&A) 活動

第七章 分析師評價

  • 先進金屬電鍍的利用：市場評估

第八章 供應商簡介

  • BASF
  • DUPONT
  • CHANG CHUN GROUP
  • INCHEON CHEMICAL COMPANY
  • ISHIHARA CHEMICAL/UNICON
  • JX NIPPON MINING AND METALS
  • 其他

第 9 章附錄 A：封裝技術的趨勢

This report covers the Metal Chemicals market trends and supply-chain as it applied to Advanced Packaging (wafer level) and Semiconductor Device Manufacturing (damascene process). Included are forecasts for copper plating and additives, market shares, technical trends, and supplier profiles. Also included in the appendix is a supplier product comparison table of publicly available information on plating products used for advanced packaging.

This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. EXECUTIVE SUMMARY
  • 1.2. ADVANCED PACKAGING PER WAFER STARTS
  • 1.3. DEVICE DEMAND DRIVERS-LOGIC
  • 1.4. CU PLATING FORECAST FOR DAMASCENE (FE) AND ADVANCED PACKAGING
  • 1.5. MARKET SHARES
  • 1.6. SUPPLIER ACTIVITIES-VARIOUS ANNOUNCEMENTS
  • 1.7. RISK FACTORS
  • 1.8. ANALYST ASSESSMENT

2. SCOPE, PURPOSE AND METHODOLOGY

  • 2.1. SCOPE
  • 2.2. PURPOSE
  • 2.3. METHODOLOGY
  • 2.4. OVERVIEW OF OTHER TECHCET CMR™ 2022 REPORTS

3. SEMICONDUCTOR INDUSTRY MARKET OUTLOOK

  • 3.1. WORLDWIDE ECONOMY
    • 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
    • 3.1.2. SEMICONDUCTOR SALES GROWTH
    • 3.1.3. TAIWAN MONTHLY SALES TRENDS
    • 3.1.4. UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023-SLOWER TO NEGATIVE SEMI REVENUE GROWTH EXPECTED
  • 3.2. ELECTRONIC GOODS MARKET
    • 3.2.1. SMARTPHONES
    • 3.2.2. PC UNIT SHIPMENTS
      • 3.2.2.1. ELECTRIC VEHICLE (EV) MARKET TRENDS
      • 3.2.2.2. INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
    • 3.2.3. SERVERS / IT MARKET
  • 3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
    • 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
    • 3.3.2. WW FAB EXPANSION DRIVING GROWTH
    • 3.3.3. EQUIPMENT SPENDING TRENDS
    • 3.3.4. TECHNOLOGY ROADMAPS
    • 3.3.5. FAB INVESTMENT ASSESSMENT
  • 3.4. POLICY & TRADE TRENDS AND IMPACT
    • 3.4.1. POLICY AND TRADE ISSUES
  • 3.5. SEMICONDUCTOR MATERIALS OUTLOOK
    • 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
    • 3.5.2. CONTINUED LOGISTICS ISSUES PLAGUE THE WESTERN WORLD
    • 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2026
      • 3.5.3.1. TECHCET WAFER START MODELING METHODOLOGY
    • 3.5.4. TECHCET'S MATERIAL FORECAST

4. METAL CHEMICALS MARKET BY SEGMENT

  • 4.1. DEFINITIONS
  • 4.2. METAL PLATING CHEMICALS MARKET OVERVIEW
    • 4.2.1. OVERVIEW-ADVANCED PACKAGING AND DAMASCENE METALLIZATION
    • 4.2.2. OVERVIEW-PLATING MARKET TRANSITIONAL TRENDS
  • 4.3. ADVANCED PACKAGING METALLIZATION-MARKET DRIVERS
    • 4.3.1. ADVANCED PACKAGING-ADDITIVES FOR CU PLATING REVENUE
    • 4.3.2. ADVANCED PACKAGING-COPPER CHEMICALS REVENUE
    • 4.3.3. ADVANCED PACKAGING ADDITIVE VOLUMES
    • 4.3.4. OTHER PLATING MATERIALS FOR ADVANCED PACKAGING
    • 4.3.5. SN / SNAG PLATING
      • 4.3.5.1. WW NI PLATING MARKET FORECAST
  • 4.4. DAMASCENE GROWTH TRENDS
    • 4.4.1. DAMASCENE GROWTH DRIVERS
    • 4.4.2. DAMASCENE CU PLATING REVENUES
    • 4.4.3. DAMASCENE ADDITIVE VOLUMES

5. TECHNICAL TRENDS

  • 5.1. PACKAGING TECH TRENDS
    • 5.1.1. PACKAGING TECHNICAL CHALLENGES
  • 5.2. TECH TRENDS
    • 5.2.1. MARKET DRIVES TECHNOLOGY TRENDS
    • 5.2.2. ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION
      • 5.2.2.1. TRENDS-MOL AND BEOL IRDS ROADMAP
    • 5.2.3. CU DAMASCENE QUALIFICATION REQUIREMENTS
    • 5.2.4. LOGIC METALLIZATION ROADMAP
      • 5.2.4.1. INTERCONNECT FOR ADVANCED LOGIC
    • 5.2.5. ADV LOGIC BURIED POWER RAIL
    • 5.2.6. TECHNOLOGY ROADMAP: DRAM WITH MO OR RU
      • 5.2.6.1. GENERAL PROCESS FLOW ADVANCED DRAM
    • 5.2.7. PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU
      • 5.2.7.1. 3D-NAND GENERATIONS 2020-2025
    • 5.2.8. EXAMPLE OF LOGIC PRO CESS FLOW 20 NM TO 32 NM LOGIC PVD
    • 5.2.8. TECHNICAL REQUIREMENTS SUMMARY 1/2
      • 5.2.8.1. TECHNICAL REQUIREMENTS SUMMARY 2/2

6. COMPETITIVE LANDSCAPE

  • 6.1. TOTAL ADVANCED PACKAGING AND DAMASCENE MARKET SHARES
  • 6.2. OEM MARKET SHARE-PLATING EQUIPMENT
  • 6.3. MARKET SHARE BY APPLICATION-CU PLATING FOR ADVANCED PACKAGING
  • 6.4. REGIONAL PLAYERS AND OTHERS
  • 6.5. M&A ACTIVITY

7. ANALYST ASSESSMENT

  • 7.1. ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT

8. SUPPLIER PROFILES

  • BASF
  • DUPONT
  • CHANG CHUN GROUP
  • INCHEON CHEMICAL COMPANY
  • ISHIHARA CHEMICAL/UNICON
  • JX NIPPON MINING AND METALS
  • AND MORE...

9. APPENDIX A: PACKAGING TECH TRENDS

LIST OF FIGURES

  • FIGURE 1: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M'S)
  • FIGURE 2: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
  • FIGURE 3: ADVANCED LOGIC DEVICES GROWTH FORECAST
  • FIGURE 4: COPPER PLATING CHEMICALS REVENUES ($M'S) FOR ADVANCED PACKAGING & FE/DAMASCENE
  • FIGURE 5: TOTAL PLATING MARKET SHARES FOR ADVANCED PACKAGING AND SEMICONDUCTOR DEVICE MFG. 2022
  • FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2021)
  • FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES
  • FIGURE 8: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX*
  • FIGURE 9: 2022 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
  • FIGURE 10: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
  • FIGURE 11: SEMICONDUCTOR CHIP APPLICATIONS
  • FIGURE 12: MOBILE PHONE SHIPMENTS WW ESTIMATES
  • FIGURE 13: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3
  • FIGURE 14: GLOBAL EV TRENDS
  • FIGURE 15: SEMICONDUCTOR SPEND PER VEHICLE TYPE
  • FIGURE 16: TSMC CONSTRUCTION SITE IN ARIZONA
  • FIGURE 17: CHIP EXPANSIONS 2021-2026 > US$460 B
  • FIGURE 18: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
  • FIGURE 19: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT BILLINGS
  • FIGURE 20: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP
  • FIGURE 21: EUROPE CHIP EXPANSION UPSIDE
  • FIGURE 22: TECHCET WAFER START FORECAST BY NODE
  • FIGURE 23: TECHCET MATERIALS FORECAST
  • FIGURE 24: PACKAGING METALLIZATION APPLICATIONS
  • FIGURE 25: USE OF SILICON INTERPOSER
  • FIGURE 26: VERSIONS OF TSV & PROCESS FLOW EXAMPLE
  • FIGURE 27: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M'S)
  • FIGURE 28: CU PLATING CHEMICALS 5-YEAR FORECAST
  • FIGURE 29: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
  • FIGURE 30: CU PLATING ADVANCED PACKAGING REVENUE FORECAST ESTIMATES
  • FIGURE 31: CU PILLAR & CU RDL SEGMENTED FORECAST
  • FIGURE 32: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST
  • FIGURE 33: ADV. PACKAGING CU PLATING ADDITIVES VOLUME DEMAND FORECAST
  • FIGURE 34: MATERIALS STACK USING CU PILLAR (< 40 UM PITCH)
  • FIGURE 35: SN AND SNAG PLATING REVENUE
  • FIGURE 36: NICKEL PLATING REVENUE
  • FIGURE 37: ADVANCED LOGIC DEVICES GROWTH FORECAST
  • FIGURE 38: ADV LOGIC METAL PLATING WAFER PASSES
  • FIGURE 39: WW DAMASCENE REVENUE FORECAST ESTIMATES
  • FIGURE 40: DAMASCENE CU VMS VOLUME DEMAND FORECAST ESTIMATES
  • FIGURE 41: DAMASCENE CU PLATING ADDITIVES CHEMICAL VOLUME DEMAND FORECAST
  • FIGURE 42: KEY TRENDS IN ADVANCED PACKAGING
  • FIGURE 43: CHALLENGES OF ELECTROPLATING VIA FILL
  • FIGURE 44: METAL LEVELS PER LOGIC NODE
  • FIGURE 45: INTERCONNECT METAL COMPARISON BY RESISTIVITY
  • FIGURE 46: CU DAMASCENE QUALIFICATION
  • FIGURE 47: LEADING EDGE LOGIC POWER RAIL SCHEMES
  • FIGURE 48: DRAM STRUCTURE
  • FIGURE 49: 3D NAND STRUCTURE
  • FIGURE 50: TOTAL PLATING FOR ADV. PACKAGING AND SEMICONDUCTOR DEVICE MANUFACTURING 2022
  • FIGURE 51: PLATING EQUIPMENT OEM MARKET SHARES 2020%
  • FIGURE 52: PLATING CHEMICAL SUPPLIER FOR DAMASCENE AND ADVANCED PACKAGING APPLICATIONS
  • FIGURE 53: CLEANING COMPLEXITY
  • FIGURE 54: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND
  • FIGURE 55: WAFER LEVEL PLATING
  • FIGURE 56: ADVANCED PACKAGING MARKET DRIVERS AND APPLICATIONS.
  • FIGURE 57: COMPARISON WITH DAMASCENE-TYPE RDL
  • FIGURE 58: USE OF SILICON INTERPOSER
  • FIGURE 59: APPLE EXAMPLE INTERPOSERS
  • FIGURE 60: TSV PROCESS FLOW EXAMPLE

LIST OF TABLES

  • TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
  • TABLE 2: IMF ECONOMIC OUTLOOK*
  • TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES FORECAST 2021
  • TABLE 4: IRDS 2022 LOGIC CORE INTERCONNECT ROADMAP
  • TABLE 5: LOGIC DEVICE ROADMAP FOR METALS
  • TABLE 6: METALS REQUIRED FOR DEVICE FEATURES
  • TABLE 7: DRAM USE OF MO OR RU PRESENT & FUTURE
  • TABLE 8: GENERAL PROCESS FLOW ADVANCED DRAM
  • TABLE 9: 3D NAND MATERIAL CHANGES PRESENT & FUTURE
  • TABLE 10: NUMBER OF STACKS (S) & LAYERS (L) PER GENERATION OF 3DNAND
  • TABLE 11: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD
  • TABLE 12: TECHNICAL REQUIREMENTS SUMMARY 1/2
  • TABLE 13: TECHNICAL REQUIREMENTS SUMMARY 2/2
  • TABLE 14: REGIONAL PLAYERS-MARKET LEADER AND "OTHERS"
  • TABLE 15: CU PACKAGING APPLICATIONS AND REQUIREMENTS