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市場調查報告書
商品編碼
1413688
CMP漿料墊全球市場分析（2023-2024）CMP Slurry & Pads Market Report (a Critical Materials Report) 2023-2024 |
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價格
簡介目錄
CMP 漿料墊在半導體製造中極為重要。製程整合需要生產薄的、均勻的平面層，以在半導體晶圓上建構裝置結構。隨著每一代新一代元件技術的發展，CMP 製程步驟的數量不斷增加。新裝置技術的特點是更多的層數、新材料、更嚴格的製程控制要求以及先進封裝的新技術。這些製造挑戰需要 CMP 漿料和拋光墊的新開發。
本報告對半導體裝置製造中使用的CMP耗材（特別是CMP漿料和拋光墊）市場和供應鏈進行了分析，提供了產品概述、市場基本結構和最新情況、主要市場推動和限制因素、我們將為您提供市場規模和應用份額、趨勢展望以及主要供應商概述等資訊。
有關 CMP 耗材市場最新資訊和報告亮點的專題新聞稿：
目錄
第一章執行摘要
第二章 研究範圍、目的與研究方法
第三章 半導體產業市場現況與展望
- 世界經濟
- 連結半導體產業與全球經濟
- 半導體銷售額成長率
- 台灣月度銷售趨勢
- 2023年高度不確定性－半導體收入成長預計將放緩至負值
- 晶片銷售：以電子領域分類
- 手機
- PC 出貨量
- 伺服器/IT市場
- 半導體製造業的成長與擴張
- 鑄造廠擴建公告：概述
- 透過在世界各地擴大鑄造廠來加速成長
- 資本支出趨勢
- 技術路線圖
- 代工投資評估
- 政策和貿易趨勢及影響
- 半導體材料概述
- 晶片生產進度可能受到材料產能限制
- 持續的物流問題：對西方世界的負面影響
- TECHCET晶圓投入量預測（至2027年）
- TECHCET材料預測
第四章 CMP耗材發展趨勢
- CMP消費趨勢
- 技術因素/材料變化與轉變
- 3D NAND路線圖
- 3D NAND 堆疊
- 先進封裝技術趨勢
- TSV 的 CMP
- 化合物半導體技術趨勢
- 碳化矽CMP
- 碳化矽缺陷
- 碳化矽的 CMP 挑戰
- 按地區劃分的趨勢
- 區域趨勢和驅動因素
- EHS（健康、衛生和安全）和物流問題
- 新材料EHS問題
- 物流問題
- 與漿料處置、回收和回收相關的 EHS 問題
第五章 CMP漿料供應商市佔率
- CMP漿料預測（收入基礎，5年）
- CMP漿料預測（基於數量，5年）
- CMP漿料市場領導者
- 整體漿料市場佔有率
- 氧化物（二氧化鈰）漿料市場
- HKMG泥漿市場
- 多晶矽漿料市場
- 氧化物（二氧化矽）漿料市場
- 鎢漿市場
- 銅散裝漿料市場
- 銅阻隔漿料市場
- 新型金屬漿料市場
- 銅埋地電力軌（BPR）漿料市場
- CMP 漿料產業的企業併購 (M&A) 活動、公告和業務聯盟
- CMP漿料工廠關閉
- 新進入者
- 供應商或零件/產品線面臨停產風險
- CMP漿料價格走勢
- TECHCET 分析師對 CMP 漿料市場的評估
第六章 CMP 拋光墊市場統計與預測
- CMP 拋光墊預測（收入基礎，5 年）
- CMP拋光墊獲利預測（5年）
- CMP 拋光墊預測（基於數量，5 年）
- CMP 拋光墊工廠關閉
- 新進入者
- 供應商或零件/產品線面臨停產風險
- CMP Pad 的企業併購 (M&A) 活動/公告或業務聯盟
- CMP拋光墊價格趨勢
- TECHCET分析師評級
第七章 下層原料供應
- 磨料供應商
- 垂直整合供應商
- 原料供應鏈的破壞者
- 原料併購活動
- 磨料供應鏈中的 EHS 與物流問題
- 磨料供應鏈的新進入者
- 磨料供應鏈工廠最新資訊 - 新
- 磨料供應鏈工廠關閉
- 磨料供應鏈的趨勢
- 下游供應鏈：TECHCET 分析師評估
第八章 供應商簡介
- NANOPHASE TECHNOLOGIES CORPORATION
- 3M COMPANY
- ABRASIVE TECHNOLOGY
- ACE NANOCHEM
- ANJI MICRO SHANGHAI
- ASAHI GLASS
- 其他20多家企業
第9章附錄
簡介目錄
This report covers the CMP Consumables market (specifically CMP slurry and pads) and supply-chain for those consumables used in semiconductor device fabrication. The report contains data and analysis from TECHCET's data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. CMP slurries and pads are a critical in semiconductor manufacturing as process integration requires the fabrication of thin and uniformly flat layers to build up device structures across the semiconductor wafers. The number of CMP process steps continue to increase with each generation of new device technology. New device technology is characterized by more layers, new materials, tighter process control requirements, and new techniques for advanced packaging. These manufacturing challenges require new developments in CMP slurries and pads. This report looks at the market drivers, slurry and pad forecasts by application, market shares, abrasive suppliers, and includes a special focus on advanced packaging.
This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.
TABLE OF CONTENTS
1. EXECUTIVE SUMMARY
- 1.1. CMP CONSUMABLES MARKET OVERVIEW
- 1.2. CMP CONSUMABLES REVENUE TRENDS
- 1.3. MARKET TRENDS IMPACTING CMP CONSUMABLES OUTLOOK
- 1.4. YEAR 2022 IN REVIEW
- 1.5. CMP CONSUMABLES FORECASTS BY MATERIAL SEGMENT
- 1.5.1. CMP SLURRIES 5-YEAR REVENUE FORECAST
- 1.5.2. CMP PADS 5-YEAR REVENUE FORECAST
- 1.6. TECHNOLOGY TRENDS
- 1.6.1. BACKSIDE TECHNOLOGY TRENDS
- 1.7. SLURRY SUPPLIER COMPETITIVE LANDSCAPE
- 1.8. PAD SUPPLIER COMPETITIVE LANDSCAPE
- 1.9. ANALYST ASSESSMENT
2. SCOPE, PURPOSE AND METHODOLOGY
- 2.1. SCOPE
- 2.2. PURPOSE
- 2.3. METHODOLOGY
- 2.4. OVERVIEW OF OTHER TECHCET CMR™ REPORTS
3. SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK
- 3.1. WORLDWIDE ECONOMY
- 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2. SEMICONDUCTOR SALES GROWTH
- 3.1.3. TAIWAN MONTHLY SALES TRENDS
- 3.1.4. UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023-SLOWER TO NEGATIVE SEMICONDUCTOR REVENUE GROWTH EXPECTED
- 3.2. CHIPS SALES BY ELECTRONIC GOODS SEGMENT
- 3.2.1. SMARTPHONES
- 3.2.2. PC UNIT SHIPMENTS
- 3.2.3. SERVERS / IT MARKET
- 3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
- 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
- 3.3.2. WW FAB EXPANSION DRIVING GROWTH
- 3.3.3. EQUIPMENT SPENDING TRENDS
- 3.3.4. TECHNOLOGY ROADMAPS
- 3.3.5. FAB INVESTMENT ASSESSMENT
- 3.4. POLICY & TRADE TRENDS AND IMPACT
- 3.5. SEMICONDUCTOR MATERIALS OVERVIEW
- 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
- 3.5.2. LOGISTICS ISSUES EASED DOWN
- 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2027
- 3.5.4. TECHCET'S MATERIAL FORECAST
4. CMP CONSUMABLES MARKET TRENDS
- 4.1. CMP CONSUMABLES MARKET TRENDS
- 4.2. TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS
- 4.2.1. 3D NAND ROADMAP
- 4.2.2. 3D NAND STACKING
- 4.2.3. TECHNICAL TRENDS IN ADVANCED PACKAGING
- 4.2.4. CMP FOR TSV
- 4.3. TECHNICAL TRENDS IN COMPOUND SEMICONDUCTOR
- 4.3.1. CMP OF SILICON CARBIDE
- 4.3.2. SILICON CARBIDE DEFECTS
- 4.3.3. CMP CHALLENGES IN SILICON CARBIDE
- 4.4. REGIONAL TRENDS
- 4.4.1. REGIONAL TRENDS AND DRIVERS
- 4.5. EHS AND LOGISTIC ISSUES
- 4.5.1. EHS ISSUES FOR NEW MATERIALS
- 4.5.2. LOGISTIC ISSUES
- 4.5.3. EHS ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM
5. CMP SLURRY SUPPLIER MARKET SHARES
- 5.1. CMP SLURRIES 5-YEAR REVENUE FORECAST
- 5.2. CMP SLURRIES 5-YEAR FORECAST BY UNITS
- 5.3. CMP SLURRY MARKET LEADERS
- 5.3.1. TOTAL SLURRY MARKET SHARE
- 5.3.2. OXIDE (CERIA) SLURRY MARKET
- 5.3.3. HKMG SLURRY MARKET
- 5.3.4. POLYSILICON SLURRY MARKET
- 5.3.5. OXIDE (SILICA) SLURRY MARKET
- 5.3.6. TUNGSTEN SLURRY MARKET
- 5.3.7. CU BULK SLURRY MARKET
- 5.3.8. COPPER BARRIER SLURRY MARKET
- 5.3.9. NEW METALS SLURRY MARKET
- 5.3.10. CU BURIED POWER RAIL (BPR) SLURRY MARKET
- 5.4. CMP SLURRY M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS
- 5.5. CMP SLURRY PLANT CLOSURES
- 5.6. NEW ENTRANTS
- 5.7. SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK OF DISCONTINUATIONS
- 5.8. CMP SLURRY PRICING TRENDS
- 5.9. TECHCET ANALYST ASSESSMENT OF CMP SLURRY MARKET
6. CMP PAD MARKET STATISTICS & FORECASTS
- 6.1. CMP PADS 5-YEAR REVENUE FORECAST
- 6.1.1. CMP PADS 5-YEAR REVENUE FORECAST
- 6.2. CMP PADS 5-YEAR FORECAST BY UNITS
- 6.3. CMP PAD PLANT CLOSURES
- 6.4. NEW ENTRANTS
- 6.5. SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK OF DISCONTINUATIONS
- 6.6. CMP PAD M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS
- 6.7. CMP PAD PRICING TRENDS
- 6.8. TECHCET ANALYST ASSESSMENT
7. MATERIAL SUB-TIER SUPPLY
- 7.1. ABRASIVE SUPPLIERS
- 7.2. VERTICALLY INTEGRATED SUPPLIERS
- 7.3. RAW SUPPLY CHAIN DISRUPTORS
- 7.4. RAW MATERIALS M&A ACTIVITY
- 7.5. ABRASIVE SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
- 7.6. ABRASIVE SUPPLY CHAIN "NEW" ENTRANTS
- 7.7. ABRASIVE SUPPLY-CHAIN PLANTS UPDATES-NEW
- 7.8. ABRASIVE SUPPLY-CHAIN PLANT CLOSURES
- 7.9. ABRASIVE SUPPLY-CHAIN PRICING TRENDS
- 7.10. SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT
8. SUPPLIER PROFILES
- NANOPHASE TECHNOLOGIES CORPORATION
- 3M COMPANY
- ABRASIVE TECHNOLOGY
- ACE NANOCHEM
- ANJI MICRO SHANGHAI
- ASAHI GLASS
- ...and 20+ more
9. APPENDIX
- APPENDIX A: CMP CONSUMABLES OVERVIEW
- APPENDIX B: TECHNICAL TRENDS IN SIC
- APPENDIX C: PAD MANUFACTURING COST DRIVERS
TABLE OF FIGURES
- FIGURE 1: FORECASTED 2023 MARKET SIZE
- FIGURE 2: CMP CONSUMABLES FORECAST
- FIGURE 3: CMP STEPS FOR ADVANCED DEVICES
- FIGURE 4: 2022 CMP CONSUMABLES REVENUE
- FIGURE 5: CMP CONSUMABLES REVENUE BY APPLICATION
- FIGURE 6: CMP SLURRY REVENUE BY APPLICATION
- FIGURE 7: CMP PAD REVENUE BY APPLICATION
- FIGURE 8: CMOS TECHNOLOGY ROADMAP
- FIGURE 9: LIMITATIONS OF FS-PDN
- FIGURE 10: 2D DEVICE ARCHITECTURE EVOLUTION
- FIGURE 11: 2022 SLURRY SUPPLIER MARKET SHARES
- FIGURE 12: 2022 PAD SUPPLIER MARKET SHARES
- FIGURE 13: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2022)
- FIGURE 14: WORLDWIDE SEMICONDUCTOR SALES
- FIGURE 15: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)*
- FIGURE 16: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
- FIGURE 17: 2022 SEMICONDUCTOR CHIP APPLICATIONS
- FIGURE 18: MOBILE PHONE SHIPMENTS WW ESTIMATES
- FIGURE 19: WORLDWIDE PC AND TABLET FORECAST
- FIGURE 20: ELECTRIFICATION TREND BY WORLD REGION
- FIGURE 21: SEMICONDUCTOR AUTOMOTIVE PRODUCTION
- FIGURE 22: TSMC PHOENIX INVESTMENT ESTIMATED WILL BE US $40 B
- FIGURE 23: CHIP EXPANSIONS 2022-2027 US$366 B
- FIGURE 24: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
- FIGURE 25: GLOBAL TOTAL EQUIPMENT SPENDING BY SEGMENT (US$ B)
- FIGURE 26: OVERVIEW OF ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP
- FIGURE 27: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST RENDERING (ON BOTTOM)
- FIGURE 28: EUROPE CHIP EXPANSION UPSIDE
- FIGURE 29: PORT OF LA
- FIGURE 30: TECHCET WAFER START FORECAST BY NODE SEGMENTS**
- FIGURE 31: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK
- FIGURE 32: CMP CONSUMABLES REVENUE FOR 2022
- FIGURE 33: NUMBER OF CMP STEPS FOR ADVANCED TECHNOLOGY NODES
- FIGURE 34: COMPARISON OF METALS RESISTIVITIES BY DIMENSION
- FIGURE 35: 14NM VS. 7NM METALLIZATION TECHNIQUES
- FIGURE 36: 3D NAND ROADMAP BY NODE
- FIGURE 37: STACKING FOR 3D NAND
- FIGURE 38: CMP OPPORTUNITIES IN ADVANCED PACKAGING
- FIGURE 39: KEY TRENDS IN ADVANCED PACKAGING
- FIGURE 40: CMP OPPORTUNITIES IN ADVANCED PACKAGING
- FIGURE 41: SILICON CARBIDE-BASED POWER DEVICE
- FIGURE 42: DEFECTS IN SILICON CARBIDE SUBSTRATES AND EPI WAFERS
- FIGURE 43: SILICON CARBIDE DEFECTS
- FIGURE 44: BATCH POLISH VS. CMP
- FIGURE 45: SLURRY AND PAD REVENUE BY HQ REGION
- FIGURE 46: CMP SLURRY REVENUE BY APPLICATION
- FIGURE 47: FORECASTED SLURRY VOLUME DEMAND
- FIGURE 48: SLURRY SUPPLIER MARKET SHARES IN 2022
- FIGURE 49: OXIDE (CERIA) SLURRY MARKET SHARES
- FIGURE 50: STI CMP PROCESS
- FIGURE 51: HKMG/FRONT-END SLURRY MARKET SHARES
- FIGURE 52: POLYSILICON SLURRY MARKET SHARES
- FIGURE 53: MEMS CMP CROSS SECTION
- FIGURE 54: OXIDE (SILICA) SLURRY MARKET SHARES
- FIGURE 55: TUNGSTEN SLURRY MARKET SHARES
- FIGURE 56: CU-BULK SLURRY MARKET SHARES
- FIGURE 57: CU-BARRIER CMP SLURRY MARKET SHARE
- FIGURE 58: NEW METALS SLURRY MARKET SHARES
- FIGURE 59: CU BPR SLURRY MARKET SHARES
- FIGURE 60: CMP PAD REVENUE BY APPLICATION
- FIGURE 61: CMP PAD REVENUE BY WAFER SIZE
- FIGURE 62: FORECASTED PAD USAGE
- FIGURE 63: CMP FOR IC MANUFACTURING PROCESS
- FIGURE 64: IC1000 LIKE PAD CROSS-SECTION
- FIGURE 65: IC1000 SEM CROSS-SECTION
TABLES
- TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
- TABLE 2: IMF ECONOMIC OUTLOOK*
- TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2022
- TABLE 4 & 5: SILICON CARBIDE WAFER MANUFACTURERS AND CONSUMABLES SUPPLIERS
- TABLE 6: REGIONAL WAFER MARKETS
- TABLE 7: REGIONAL WAFER MARKETS BY SUPPLIER HEADQUARTER REGION
- TABLE 8: 2022 SLURRY MARKET LEADERS AND TAM BY APPLICATION
- TABLE 9: PAD SUPPLIERS
- TABLE 10: ABRASIVE SUPPLIERS
- TABLE 11: VERTICALLY INTEGRATED SUPPLIERS
- TABLE 12: PHYSICAL AND ELECTRICAL PROPERTY COMPARISON OF SI AND SIC
