查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1159225

模塑互連元件的全球市場:預測(2022年～2028年)

Molded Interconnect Device Market 2022-2028
出版日期: | 出版商: Orion Market Research | 英文 120 Pages | 商品交期: 2-3個工作天內

價格

全球模塑互連元件的市場規模在預測期間內預計將以13％的年複合成長率擴大。消費電子產品對便攜式設備的需求不斷增長以及自動化的使用不斷增加是推動市場增長的關鍵因素。

本報告提供全球模塑互連元件市場相關調查，提供市場概要，以及各流程，各產品類型，各業界，各地區的趨勢，及加入此市場的主要企業簡介等資訊。

目錄

第1章 報告概要

第2章 市場概要與洞察

第3章 競爭情形

  • 主要企業分析
  • 主要策略分析
  • COVID-19對主要加入企業帶來的影響

第4章 市場決策要素

  • 促進因素
  • 阻礙因素
  • 機會

第5章 市場區隔

  • 全球模塑互連元件市場，各流程
    • 雷射直接成型
    • 2-發射成型
    • 薄膜技術
  • 全球模塑互連元件市場，各產品類型
    • 天線及連接模組
    • 連接器和交換器
    • 感測器
    • 照明
  • 全球模塑互連元件市場，各業界
    • 醫療
    • 汽車
    • 家電
    • 通訊
    • 航太·防衛

第6章 地區分析

  • 北美
  • 歐洲
  • 亞太地區
  • 其他地區

第7章 企業簡介

  • 2E Mechatronic
  • Amphenol Corp
  • Cicor Group
  • DuPont de Nemours, Inc.
  • Ensinger India Engineering Plastics Pvt. Ltd.
  • Evonik Industries AG
  • Fujitsu Ltd.
  • Harting Technology Group
  • JOHNAN Corp.
  • LANXESS
  • LPKF Laser & Electronics AG
  • M.I.D Solutions Pty. Ltd.
  • Molex LLC
  • Multiple Dimensions AG
  • RTP Co
  • RTP Company
  • SelectConnect Technologies
  • SINOPLAST GROUP LTD.
  • TE Connectivity Corp.
  • TEPROSA GmbH
  • THALES
  • Zeon Corp.
Product Code: OMR2026320

Global Molded Interconnect Device Market Size, Share & Trends Analysis Report by Process (Laser Direct Structuring, Two - Shot Molding and Film Technique), by Product Type (Antennae and Connectivity Modules, Connector and Switches, Sensors, and Lighting), and by Industry (Medical, Automotive, Consumer Electronics, Telecommunication, Aerospace and Defense) Forecast Period (2022-2028)

The global molded interconnect device market is anticipated to grow at a substantial CAGR of 13% during the forecast period. Rising demand for portable devices in consumer electronics as well as growing usage of automated applications are the major factors driving the market growth. Molded interconnect devices are gaining wide acceptance in end-user applications as they reduces the volume by attaining efficient space utilization and thereby optimizing the cost associated with it. Consumption of essential portable electronic devices, such as smartphones, LCD players, tablets are considerably increasing. However, high technical expertise requirement for manufacturing of molded interconnect device can restrain the market growth.

The global molded interconnect device market is segmented based on the process, product type and industry. Based on the process, the market is sub segmented into laser direct structuring, two - shot molding, film technique. Based on the product type, the market is sub-segmented into the antennae and connectivity modules, connector and switches, sensors, lighting. Based on industry, the market is sub-segmented into medical, automotive, consumer electronics, telecommunication, aerospace and defense. The above mentioned segments can be customized as per the requirements.

Geographically market is segmented into North America, Europe, Asia Pacific, and the Rest of the World. Increasing funding activities and initiatives by government in Asia-Pacific region are motivating consumer electronics manufacturers to augment their investments in new technologies and capacity expansions, thereby, driving the market growth. Whereas the increasing penetration of unmanned aerial vehicles in the U.S. defense and aerospace industry is creating significant scope for MID market in North America.

The major companies serving the global molded interconnect device market include Element Solutions Inc., Galtronics, HARTING Technology Group, LPKF Laser & Electronics AG, Molex LLC, DuPont de Nemours, Inc., Ensinger India Engineering Plastics Pvt. Ltd., Evonik Industries AG, JOHNAN Corp., M.I.D Solutions Pty. Ltd. and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers & acquisitions, collaborations, funding, and new product launches, to stay competitive in the market. For instance, In June 2020, a key player in electronic specialty materials, MacDermid Alpha Electronics Solution announced release of Systek SAP. It's a collection of high-performance build-up methods for IC substrate RDL that includes multiple process flows for various materials as well as groundbreaking technology advances in the desmear, conditioning, activation, and metallization steps.

Research Methodology

The market study of the global molded interconnect device market is incorporated by extensive primary and secondary research conducted by the research team at OMR. Secondary research has been conducted to refine the available data to breakdown the market into various segments, derive total market size, market forecast, and growth rate. Different approaches have been worked on to derive the market value and market growth rate. Our team collects facts and data related to the market from different geography to provide a better regional outlook. In the report, the country-level analysis is provided by analyzing various regional players, regional tax laws and policies, consumer behavior, and macro-economic factors. Numbers extracted from secondary research have been authenticated by conducting proper primary research. It includes tracking down key people from the industry and interviewing them to validate the data. This enables our analyst to derive the closest possible figures without any major deviations in the actual number. Our analysts try to contact as many executives, managers, key opinion leaders, and industry experts. Primary research brings authenticity to our reports.

Secondary Sources Include:

  • Financial reports of companies involved in the market.
  • Whitepapers, research papers, and news blogs.
  • Company websites and their product catalog.

The report provides an in-depth analysis of market size, intended quality of the service preferred by consumers. The report will serve as a source for a 360-degree analysis of the market thoroughly integrating different models.

Market Segmentation

1. Global Molded Interconnect Device Market Research and Analysis by Process

2. Global Molded Interconnect Device Market Research and Analysis by Product Type

3. Global Molded Interconnect Device Market Research and Analysis by Industry

The Report Covers:

  • Comprehensive Research Methodology of the global molded interconnect device market.
  • This report also includes a detailed and extensive market overview with key analyst insights.
  • An exhaustive analysis of macro and micro factors influencing the market guided by key recommendations.
  • Analysis of regional regulations and other government policies impacting the global molded interconnect device market.
  • Insights about market determinants that are stimulating the global molded interconnect device market.
  • Detailed and extensive market segments with the regional distribution of forecasted revenues.
  • Extensive profiles and recent developments of market players.

Table of Contents

1. Report Summary

  • Current Industry Analysis and Growth Potential Outlook
  • Impact of COVID-19 on the Global Molded Interconnect Device Market
  • Recovery Scenario of Global Molded Interconnect Device Market
  • 1.1. Research Methods and Tools
  • 1.2. Market Breakdown
    • 1.2.1. By Segments
    • 1.2.2. BY Region

2. Market Overview and Insights

  • 2.1. Scope of the Report
  • 2.2. Analyst Insight & Current Market Trends
    • 2.2.1. Key Findings
    • 2.2.2. Recommendations
    • 2.2.3. Conclusion

3. Competitive Landscape

  • 3.1. Key Company Analysis
    • 3.1.1. Overview
    • 3.1.2. Financial Analysis
    • 3.1.3. SWOT Analysis
    • 3.1.4. Recent Developments
  • 3.2. Key Strategy Analysis
  • 3.3. Impact of COVID-19 on key players

4. Market Determinants

  • 4.1. Motivators
  • 4.2. Restraints
  • 4.3. Opportunitie

5. Market Segmentation

  • 5.1. Global Molded Interconnect Device Market by Process
    • 5.1.1. Laser Direct Structuring
    • 5.1.2. Two - Shot Molding
    • 5.1.3. Film Technique
  • 5.2. Global Molded Interconnect Device Market by Product Type
    • 5.2.1. Antennae and Connectivity Modules
    • 5.2.2. Connector and Switches
    • 5.2.3. Sensors
    • 5.2.4. Lighting
  • 5.3. Global Molded Interconnect Device Market by Industry
    • 5.3.1. Medical
    • 5.3.2. Automotive
    • 5.3.3. Consumer Electronics
    • 5.3.4. Telecommunication
    • 5.3.5. Aerospace and Defence

6. Regional Analysis

  • 6.1. North America
    • 6.1.1. US
    • 6.1.2. Canada
  • 6.2. Europe
    • 6.2.1. UK
    • 6.2.2. Germany
    • 6.2.3. Italy
    • 6.2.4. Spain
    • 6.2.5. France
    • 6.2.6. Rest of Europe
  • 6.3. Asia-Pacific
    • 6.3.1. China
    • 6.3.2. India
    • 6.3.3. Japan
    • 6.3.4. South Korea
    • 6.3.5. Rest of Asia-Pacific
  • 6.4. Rest of the World

7. Company Profiles

  • 7.1. 2E Mechatronic
  • 7.2. Amphenol Corp
  • 7.3. Cicor Group
  • 7.4. DuPont de Nemours, Inc.
  • 7.5. Ensinger India Engineering Plastics Pvt. Ltd.
  • 7.6. Evonik Industries AG
  • 7.7. Fujitsu Ltd.
  • 7.8. Harting Technology Group
  • 7.9. JOHNAN Corp.
  • 7.10. LANXESS
  • 7.11. LPKF Laser & Electronics AG
  • 7.12. M.I.D Solutions Pty. Ltd.
  • 7.13. Molex LLC
  • 7.14. Multiple Dimensions AG
  • 7.15. RTP Co
  • 7.16. RTP Company
  • 7.17. SelectConnect Technologies
  • 7.18. SINOPLAST GROUP LTD.
  • 7.19. TE Connectivity Corp.
  • 7.20. TEPROSA GmbH
  • 7.21. THALES
  • 7.22. Zeon Corp.

LIST OF TABLES

  • 1. GLOBAL MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY PROCESS, 2021-2028 ($ MILLION)
  • 2. GLOBAL LASER DIRECT STRUCTURING IN MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 3. GLOBAL TWO - SHOT MOLDING IN MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 4. GLOBAL FILM TECHNIQUE IN MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 5. GLOBAL MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY PRODUCT TYPE, 2021-2028 ($ MILLION)
  • 6. GLOBAL ANTENNAE AND CONNECTIVITY MODULES FOR MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 7. GLOBAL CONNECTOR AND SWITCHES FOR MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 8. GLOBAL SENSORS FOR MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 9. GLOBAL LIGHTING FOR MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 10. GLOBAL MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY INDUSTRY, 2021-2028 ($ MILLION)
  • 11. GLOBAL MOLDED INTERCONNECT DEVICE IN MEDICAL MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 12. GLOBAL MOLDED INTERCONNECT DEVICE IN AUTOMOTIVE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 13. GLOBAL MOLDED INTERCONNECT DEVICE IN CONSUMER ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 14. GLOBAL MOLDED INTERCONNECT DEVICE IN TELECOMMUNICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 15. GLOBAL MOLDED INTERCONNECT DEVICE IN AEROSPACE AND DEFENCE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
  • 16. GLOBAL MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY GEOGRAPHY, 2021-2028 ($ MILLION)
  • 17. NORTH AMERICAN MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2021-2028 ($ MILLION)
  • 18. NORTH AMERICAN MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY PROCESS, 2021-2028 ($ MILLION)
  • 19. NORTH AMERICAN MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY PRODUCT TYPE, 2021-2028 ($ MILLION)
  • 20. NORTH AMERICAN MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY INDUSTRY, 2021-2028 ($ MILLION)
  • 21. EUROPEAN MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2021-2028 ($ MILLION)
  • 22. EUROPEAN MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY PROCESS, 2021-2028 ($ MILLION)
  • 23. EUROPEAN MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY PRODUCT TYPE, 2021-2028 ($ MILLION)
  • 24. EUROPEAN MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY INDUSTRY, 2021-2028 ($ MILLION)
  • 25. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2021-2028 ($ MILLION)
  • 26. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY PROCESS, 2021-2028 ($ MILLION)
  • 27. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY PRODUCT TYPE, 2021-2028 ($ MILLION)
  • 28. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY INDUSTRY, 2021-2028 ($ MILLION)
  • 29. REST OF THE WORLD MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2021-2028 ($ MILLION)
  • 30. REST OF THE WORLD MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY PROCESS, 2021-2028 ($ MILLION)
  • 31. REST OF THE WORLD MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY PRODUCT TYPE, 2021-2028 ($ MILLION)
  • 32. REST OF THE WORLD MOLDED INTERCONNECT DEVICE MARKET RESEARCH AND ANALYSIS BY INDUSTRY, 2021-2028 ($ MILLION)

LIST OF FIGURES

  • 1. IMPACT OF COVID-19 ON GLOBAL MOLDED INTERCONNECT DEVICE MARKET, 2021-2028 ($ MILLION)
  • 2. IMPACT OF COVID-19 ON GLOBAL MOLDED INTERCONNECT DEVICE MARKET BY SEGMENT, 2021-2028 ($ MILLION)
  • 3. RECOVERY OF GLOBAL MOLDED INTERCONNECT DEVICE MARKET, 2022-2028 (%)
  • 4. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SHARE BY PROCESS, 2021 VS 2028 (%)
  • 5. GLOBAL LASER DIRECT STRUCTURING IN MOLDED INTERCONNECT DEVICE MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 6. GLOBAL TWO - SHOT MOLDING IN MOLDED INTERCONNECT DEVICE MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 7. GLOBAL FILM TECHNIQUE IN MOLDED INTERCONNECT DEVICE MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 8. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SHARE BY PRODUCT TYPE, 2021 VS 2028 (%)
  • 9. GLOBAL ANTENNAE AND CONNECTIVITY MODULES FOR MOLDED INTERCONNECT DEVICE MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 10. GLOBAL CONNECTOR AND SWITCHES FOR MOLDED INTERCONNECT DEVICE MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 11. GLOBAL SENSOR FOR MOLDED INTERCONNECT DEVICE MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 12. GLOBAL LIGHTING FOR MOLDED INTERCONNECT DEVICE MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 13. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SHARE BY INDUSTRY, 2021 VS 2028 (%)
  • 14. GLOBAL MOLDED INTERCONNECT DEVICE IN MEDICAL MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 15. GLOBAL MOLDED INTERCONNECT DEVICE IN AUTOMOTIVE MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 16. GLOBAL MOLDED INTERCONNECT DEVICE IN CONSUMER ELECTRONICS MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 17. GLOBAL MOLDED INTERCONNECT DEVICE IN TELECOMMUNICATION MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 18. GLOBAL MOLDED INTERCONNECT DEVICE IN AEROSPACE AND DEFENCE MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 19. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SHARE BY GEOGRAPHY, 2021 VS 2028 (%)
  • 20. US MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 21. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 22. UK MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 23. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 24. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 25. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 26. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 27. REST OF EUROPE MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 28. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 29. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 30. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 31. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 32. REST OF ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)
  • 33. REST OF THE WORLD MOLDED INTERCONNECT DEVICE MARKET SIZE, 2021-2028 ($ MILLION)