查看購物車
  • Simplified Chinese
  • English
  • Japanese
面板級封裝報告：2030 年趨勢、預測與競爭分析
市場調查報告書
商品編碼
1416544

面板級封裝報告：2030 年趨勢、預測與競爭分析

Panel Level Packaging Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

面板級封裝趨勢和預測

到2030年，全球面板級封裝市場預計將達到44億美元，2024年至2030年的年複合成長率為25.4%。該市場的主要促進因素是對降低封裝製程成本的需求不斷成長以及對緊湊性和高功能性的需求不斷成長。電子設備的普及和研發活動投資的增加。全球面板級封裝市場的未來前景廣闊，消費性電器產品、IT 和通訊、工業、航太和國防、汽車和醫療保健市場充滿機會。

面板級封裝市場洞察

Lucintel 預計該服務在預測期內將實現更高的成長。

由於智慧型設備和穿戴式裝置的日益普及，以及智慧家庭等應用中消費者物聯網電器產品的成長趨勢，消費性電子產品將繼續成為該市場的最大細分市場。

由於領先的半導體製造商的存在、消費性電器產品的需求不斷成長以及該地區先進技術的採用不斷增加，亞太地區在整個預測期內仍將是最大的地區。

常問問題

Q.1 面板級封裝的市場規模有多大？

A1. 到2030年，全球面板級封裝市場預計將達到44億美元。

Q.2 面板級封裝市場的成長預測為何：

A2. 2024年至2030年，全球面板級封裝市場預計將以25.4%的年複合成長率成長。

Q.3 影響面板級封裝市場成長的關鍵因素有哪些：

A3. 此市場的主要促進因素是對降低封裝製程成本的需求不斷增加、對小型和高性能電子設備的需求不斷增加以及對研發活動的投資不斷增加。

Q4.市場的主要細分市場是：

A4. 全球面板級封裝市場前景廣闊，消費性電器產品、IT 和通訊、工業、航太和國防、汽車和醫療保健市場充滿機會。

Q5.市場的主要企業是：

A5. 一些主要的面板級封裝公司是：

  • Samsung Electronics
  • Intel Corporation
  • Nepes Corporation
  • ASE Group
  • Powertech Technology
  • Fraunhofer Institute for Reliability and Micro integration IZM
  • Unimicron Technology Corporation
  • DECA Technologies
  • JCET/STATSChipPAC

Q6.未來最大的細分市場是什麼？

A6.Lucintel 預計服務在預測期內將經歷更高的成長。

Q7. 未來五年預計哪些地區的市場成長最大？

A7.由於領先的半導體製造商的存在、消費性電器產品的需求不斷成長以及該地區先進技術的採用不斷增加，亞太地區在整個預測期內仍將是最大的地區。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球面板級封裝市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球面板級封裝市場趨勢（2018-2023）與預測（2024-2030）
  • 全球面板級封裝市場（按組件）
    • 軟體
    • 服務
  • 全球面板級封裝市場，依發展分類
    • 公共
    • 私人的
    • 混合
  • 按公司規模分類的全球面板級封裝市場
    • 中小企業
    • 主要企業
  • 全球面板級封裝市場（依最終用途）
    • 家用電器
    • 資訊科技/通訊
    • 工業的
    • 航太和國防
    • 車
    • 衛生保健
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球面板級封裝市場（按地區）
  • 北美面板級封裝市場
  • 歐洲面板級封裝市場
  • 亞太面板級封裝市場
  • 其他地區面板級封裝市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球面板級封裝市場成長機會（按組件）
    • 全球面板級封裝市場的部署成長機會
    • 按公司規模分類的全球面板級封裝市場成長機會
    • 全球面板級封裝市場成長機會（依最終用途）
    • 全球面板級封裝市場區域成長機會
  • 全球面板級封裝市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球面板級封裝市場產能
    • 全球面板級封裝市場的合併、收購與合資企業
    • 認證和許可

第7章主要企業概況

  • Samsung Electronics
  • Intel Corporation
  • Nepes Corporation
  • ASE Group
  • Powertech Technology
  • Fraunhofer Institute for Reliability and Micro integration IZM
  • Unimicron Technology Corporation
  • DECA Technologies
  • JCET/STATSChipPAC
簡介目錄

Panel Level Packaging Trends and Forecast

The future of the global panel level packaging market looks promising with opportunities in the consumer electronic, IT & telecommunication, industrial, aerospace & defense, automotive, and healthcare markets. The global panel level packaging market is expected to reach an estimated $4.4 billion by 2030 with a CAGR of 25.4% from 2024 to 2030. The major drivers for this market are rising need for reduced cost of packaging process, increasing demand for compact and high functionality electronic devices, and growing investment in research & development activities.

A more than 150-page report is developed to help in your business decisions.

Panel Level Packaging by Segment

The study includes a forecast for the global panel level packaging by component, deployment, enterprise size, end use, and region

Panel Level Packaging Market by Component [Shipment Analysis by Value from 2018 to 2030]:

  • Software
  • services

Panel Level Packaging Market by Deployment [Shipment Analysis by Value from 2018 to 2030]:

  • Public
  • Private
  • Hybrid

Panel Level Packaging Market by Enterprise Size [Shipment Analysis by Value from 2018 to 2030]:

  • Small & Medium Enterprise
  • Large Enterprise

Panel Level Packaging Market by End Use [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • IT and Telecommunication
  • Industrial
  • Aerospace and Defense
  • Automotive
  • Healthcare
  • Others

Panel Level Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Panel Level Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies panel level packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the panel level packaging companies profiled in this report include-

  • Samsung Electronics
  • Intel Corporation
  • Nepes Corporation
  • ASE Group
  • Powertech Technology
  • Fraunhofer Institute for Reliability and Micro integration IZM
  • Unimicron Technology Corporation
  • DECA Technologies
  • JCET/ STATSChipPAC

Panel Level Packaging Market Insights

Lucintel forecasts that services is expected to witness higher growth over the forecast period.

Within this market, consumer electronics will remain the largest segment due to rising adoption of smart devices and wearables and increasing inclination towards consumer IOT devices in applications like smart homes.

APAC will remain the largest region over the forecast period due to the presence of major semiconductor manufacturers, rising consumer electronics demand, and growing adoption of advanced technologies in the region.

Features of the Global Panel Level Packaging Market

Market Size Estimates: Panel level packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Panel level packaging market size by various segments, such as by component, deployment, enterprise size, end use, and region in terms of value ($B).

Regional Analysis: Panel level packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different components, deployments, enterprise sizes, end uses, and regions for the panel level packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the panel level packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the panel level packaging market size?

Answer: The global panel level packaging market is expected to reach an estimated $4.4 billion by 2030.

Q.2 What is the growth forecast for panel level packaging market?

Answer: The global panel level packaging market is expected to grow with a CAGR of 25.4% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the panel level packaging market?

Answer: The major drivers for this market are rising need for reduced cost of packaging process, increasing demand for compact and high functionality electronic devices, and growing investment in research & development activities.

Q4. What are the major segments for panel level packaging market?

Answer: The future of the global panel level packaging market looks promising with opportunities in the consumer electronic, IT & telecommunication, industrial, aerospace & defense, automotive, and healthcare markets

Q5. Who are the key panel level packaging market companies?

Answer: Some of the key panel level packaging companies are as follows:

  • Samsung Electronics
  • Intel Corporation
  • Nepes Corporation
  • ASE Group
  • Powertech Technology
  • Fraunhofer Institute for Reliability and Micro integration IZM
  • Unimicron Technology Corporation
  • DECA Technologies
  • JCET/ STATSChipPAC

Q6. Which panel level packaging market segment will be the largest in future?

Answer: Lucintel forecasts that services is expected to witness higher growth over the forecast period.

Q7. In panel level packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to the presence of major semiconductor manufacturers, rising consumer electronics demand, and growing adoption of advanced technologies in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the panel level packaging market by component (software and services), deployment (public, private, and hybrid), enterprise size (small & medium enterprise, and large enterprise), end use (consumer electronics, IT & telecommunication, industrial, aerospace & defense, automotive, healthcare, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Panel Level Packaging Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Panel Level Packaging Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Panel Level Packaging Market by Component
    • 3.3.1: Software
    • 3.3.2: Services
  • 3.4: Global Panel Level Packaging Market by Deployment
    • 3.4.1: Public
    • 3.4.2: Private
    • 3.4.3: Hybrid
  • 3.5: Global Panel Level Packaging Market by Enterprise Size
    • 3.5.1: Small & Medium Enterprise
    • 3.5.2: Large Enterprise
  • 3.6: Global Panel Level Packaging Market by End Use
    • 3.6.1: Consumer Electronics
    • 3.6.2: IT and Telecommunication
    • 3.6.3: Industrial
    • 3.6.4: Aerospace and Defense
    • 3.6.5: Automotive
    • 3.6.6: Healthcare
    • 3.6.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Panel Level Packaging Market by Region
  • 4.2: North American Panel Level Packaging Market
    • 4.2.1: North American Panel Level Packaging Market by Component: Software and Services
    • 4.2.2: North American Panel Level Packaging Market by End Use: Consumer Electronics, IT and Telecommunication, Industrial, Aerospace and Defense, Automotive, Healthcare, and Others
  • 4.3: European Panel Level Packaging Market
    • 4.3.1: European Panel Level Packaging Market by Component: Software and Services
    • 4.3.2: European Panel Level Packaging Market by End Use: Consumer Electronics, IT and Telecommunication, Industrial, Aerospace and Defense, Automotive, Healthcare, and Others
  • 4.4: APAC Panel Level Packaging Market
    • 4.4.1: APAC Panel Level Packaging Market by Component: Software and Services
    • 4.4.2: APAC Panel Level Packaging Market by End Use: Consumer Electronics, IT and Telecommunication, Industrial, Aerospace and Defense, Automotive, Healthcare, and Others
  • 4.5: ROW Panel Level Packaging Market
    • 4.5.1: ROW Panel Level Packaging Market by Component: Software and Services
    • 4.5.2: ROW Panel Level Packaging Market by End Use: Consumer Electronics, IT and Telecommunication, Industrial, Aerospace and Defense, Automotive, Healthcare, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Panel Level Packaging Market by Component
    • 6.1.2: Growth Opportunities for the Global Panel Level Packaging Market by Deployment
    • 6.1.3: Growth Opportunities for the Global Panel Level Packaging Market by Enterprise Size
    • 6.1.4: Growth Opportunities for the Global Panel Level Packaging Market by End Use
    • 6.1.5: Growth Opportunities for the Global Panel Level Packaging Market Region
  • 6.2: Emerging Trends in the Global Panel Level Packaging Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Panel Level Packaging Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Panel Level Packaging Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Samsung Electronics
  • 7.2: Intel Corporation
  • 7.3: Nepes Corporation
  • 7.4: ASE Group
  • 7.5: Powertech Technology
  • 7.6: Fraunhofer Institute for Reliability and Micro integration IZM
  • 7.7: Unimicron Technology Corporation
  • 7.8: DECA Technologies
  • 7.9: JCET/ STATSChipPAC