市場調查報告書
商品編碼
1466455
SMT 貼裝設備市場:按設備、應用分類 - 2024-2030 年全球預測SMT Placement Equipment Market by Equipment (Cleaning Equipment, Inspection Equipment, Placement Equipment), Application (Aerospace & Defence, Automotive, Consumer Electronics) - Global Forecast 2024-2030 |
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預計2023年SMT貼裝設備市場規模為13.2億美元,預計2024年將達14.2億美元,2030年將達21.9億美元,複合年成長率為7.44%。
表面黏著技術(SMT) 貼裝設備在電子產業中至關重要,因為它可以將電子元件高效、精確地組裝到 PCB(電子設備的建構模組)上。電子元件包括電阻器、電容器、二極體和積體電路。隨著家用電子電器和汽車產業的不斷成長,電子元件小型化的趨勢需要高效的製造方法,例如SMT貼裝設備。世界各國政府正在採取各種措施支持PCB產業在各個領域的發展,例如建立PCB技術研發中心、鼓勵創新和進步。另一方面,SMT貼片設備的引進和實施面臨高成本、技術複雜、熟練勞動力缺乏的挑戰。然而,這些限制可以透過進一步的技術改進和增加培訓和開發支出來解決。 SMT 貼裝設備軟體的進步不斷改進印刷電路基板製造流程。此外,智慧製造正在迅速發展,智慧製造利用物聯網(IoT)、人工智慧(AI)和機器人等先進技術來自動化和最佳化PCB的製造流程。此外,由於新技術的出現以及對高品質、高效和永續製造流程的需求不斷增加,SMT貼裝設備的未來預計將創造利潤豐厚的商機。
主要市場統計 | |
---|---|
基準年[2023] | 13.2億美元 |
預測年份 [2024] | 14.2億美元 |
預測年份 [2030] | 21.9億美元 |
複合年成長率(%) | 7.44% |
利用維修和再加工設備對有缺陷的設備零件進行再加工
SMT 生產線清洗設備旨在保持印刷電路基板(PCB) 在焊接過程之前和之後不受污染。清洗設備專門滿足電子元件組件的高可靠性需求,其中高性能和安全性至關重要。檢測設備對於品管至關重要,它使用從自動光學檢測 (AOI) 到 X光系統等多種技術。在 SMT 生產線上,貼裝設備對於在印刷基板準確貼裝元件非常重要。速度、精度和彈性對於滿足現代電子製造的需求至關重要。維修設備是用於修復組裝PCB中的缺陷和問題的專用設備。維修和返工設備提供了返工焊點、更換有缺陷的零件以及挽救有價值的電子設備免受小缺陷所需的工具。網版印刷設備在放置元件之前將焊膏塗布在 PCB 上。焊接設備包括形成焊點的各種技術,例如回流焊接爐和波峰焊接設備。
SMT 貼裝設備在各個應用產業的多種用途
在航太和國防領域,精度、可靠性和耐用性至關重要。航太和國防工業的 SMT 設備必須支援組裝能夠承受惡劣條件的高度可靠的電子設備。汽車產業需要能夠支援汽車電子生產的 SMT 設備,其特點是安全性、連接性和自動化方面的進步。消費性電子產品是一個快速發展的領域,對緊湊、高效能設備的需求很高。家用電子電器領域的SMT貼裝設備必須提供高速度、高精度以及高效貼裝小型元件的能力。醫療用電子設備製造需要能夠實現高精度和清潔度的SMT設備。在通訊領域,需要SMT設備支援高速通訊設備和基礎設施需求。
區域洞察
SMT 部署設備的區域格局多種多樣,亞太地區、北美和歐洲發生了重要的戰略活動。這些國家正在透過發展工廠和製造單位的智慧機械和智慧製造來發展半導體和電子元件的生產。這些地區正在透過擴大和加強我們的地理足跡來擴大國內半導體和電子元件的生產。亞太地區在 SMT 貼裝設備全球銷售額中所佔的佔有率最大且最高。中國、日本、韓國、台灣等國家是擁有大量擁有AMT貼片設備製造能力的玩家的主要國家。此外,北美是加強國內半導體生產和創新的重要市場,以供應創新汽車、醫療設備、航太和國防領域所需的 PCB。
歐洲也是一個擁有多家製造商的地區,例如德國、瑞士和英國等國家。隨著競爭對手汽車製造商設定了積極的生產目標,歐洲的汽車產量和銷售量不斷增加,推動了對自動化設備的需求,以改善晶片製造流程。此外,南美洲和非洲國家正在經歷緩慢的成長,並處於開發階段,以確保與印刷電路基板(PCB) 製造商的廣泛合作和契約,並部署自適應 SMT 貼裝設備。
FPNV定位矩陣
FPNV定位矩陣對於評估SMT貼裝設備市場至關重要。我們檢視與業務策略和產品滿意度相關的關鍵指標,以對供應商進行全面評估。這種深入的分析使用戶能夠根據自己的要求做出明智的決策。根據評估,供應商被分為四個成功程度不同的像限:前沿(F)、探路者(P)、利基(N)和重要(V)。
市場佔有率分析
市場佔有率分析是一種綜合工具,可對 SMT 貼裝設備市場供應商的現狀進行深入而詳細的研究。全面比較和分析供應商在整體收益、基本客群和其他關鍵指標方面的貢獻,以便更好地了解公司的績效及其在爭奪市場佔有率時面臨的挑戰。此外,該分析還提供了對該行業競爭特徵的寶貴見解,包括在研究基準年觀察到的累積、分散主導地位和合併特徵等因素。這種詳細程度的提高使供應商能夠做出更明智的決策並制定有效的策略,從而在市場上獲得競爭優勢。
1. 市場滲透率:提供有關主要企業所服務的市場的全面資訊。
2. 市場開拓:我們深入研究利潤豐厚的新興市場,並分析其在成熟細分市場的滲透率。
3. 市場多元化:提供有關新產品發布、開拓地區、最新發展和投資的詳細資訊。
4.競爭評估與資訊:對主要企業的市場佔有率、策略、產品、認證、監管狀況、專利狀況、製造能力等進行全面評估。
5. 產品開發與創新:提供對未來技術、研發活動和突破性產品開發的見解。
1.SMT貼片設備市場的市場規模及預測為何?
2.SMT貼裝設備市場預測期間需要考慮投資的產品、細分市場、應用和領域有哪些?
3.SMT貼片設備市場的技術趨勢和法規結構是什麼?
4.SMT貼片設備市場主要廠商的市場佔有率為何?
5.進入SMT貼片設備市場的合適型態和策略手段是什麼?
[185 Pages Report] The SMT Placement Equipment Market size was estimated at USD 1.32 billion in 2023 and expected to reach USD 1.42 billion in 2024, at a CAGR 7.44% to reach USD 2.19 billion by 2030.
Surface mount technology (SMT) placement equipment is essential in the electronics industry as it allows for the efficient and accurate assembly of electronic components onto the PCBs, which are the building blocks of electronic devices. The electronic components can include resistors, capacitors, diodes, integrated circuits, and other components. The consumer electronics and automotive industries are growing, and there is a need for efficient manufacturing methods, such as SMT placement equipment, due to the popularity of miniaturization of the electronic components. Governments worldwide are taking various initiatives to support the development of the PCB industry in different sectors by establishing research & development (R&D) centers for PCB technology to encourage innovation and advancements. On the other hand, the high cost, technical complexities, and non-availability of skilled workers for deploying and installing the SMT placement equipment are challenging the adoption and implementation of SMT placement equipment. However, these limitations can be solved with further technological improvements and more spending on training and development. There are ongoing software advancements in SMT placement equipment, which are contributing to the improvement of the manufacturing process of PCBs. Additionally, there is a rapid inclination and advances in smart manufacturing, which uses advanced technologies such as the Internet of Things (IoT), artificial intelligence (AI), and robotics to automate and optimize the manufacturing process of PCBs. Moreover, the future of SMT placement equipment is expected to create lucrative opportunities, with new technologies emerging and increasing demand for high-quality, efficient, and sustainable manufacturing processes.
KEY MARKET STATISTICS | |
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Base Year [2023] | USD 1.32 billion |
Estimated Year [2024] | USD 1.42 billion |
Forecast Year [2030] | USD 2.19 billion |
CAGR (%) | 7.44% |
Equipment: Utilization of repair and rework equipments for reworking defective components
Cleaning equipment in the SMT line is designed to ensure that printed circuit boards (PCBs) are free of contaminants before and after the soldering process. Cleaning equipment caters to the need for high reliability in electronic assemblies, particularly in high-performance and safety-critical applications. Inspection equipment is critical in quality control, with technologies ranging from Automated Optical Inspection (AOI) to X-ray systems. At the SMT line, placement equipment is responsible for accurately placing components on PCBs. Speed, precision, and flexibility are crucial for meeting the demands of modern electronics production. Repair equipment is specialized for fixing defects and issues in assembled PCBs. Repair and rework equipment provides necessary tools for reworking solder joints, replacing defective components, and salvaging valuable electronics from minor faults. Screen printing equipment applies solder paste to PCBs before component placement, a critical step for ensuring strong solder joints. Soldering equipment encompasses a range of technologies for forming solder joints, including reflow ovens and wave soldering machines.
Application: Diverse applications of SMT placement equipment across industries
In the Aerospace & Defence sector, precision, reliability, and durability are paramount. SMT equipment for Aerospace & Defence industries must support the assembly of high-reliability electronics that can withstand extreme conditions. The automotive sector demands SMT equipment that can support automotive electronics production featuring advancements in safety, connectivity, and automation. Consumer electronics is a rapidly evolving segment with a high demand for compact, high-performance devices. SMT placement equipment for the consumer electronics sector needs to offer high speed, precision, and the ability to place small components efficiently. Medical electronics manufacturing requires SMT equipment that can deliver high precision and cleanliness. The telecommunication sector seeks SMT equipment to support high-speed communication devices and infrastructure demand.
Regional Insights
The geographic landscape for SMT placement equipment is diverse, with significant strategic activities in the Asia-Pacific, North America, and Europe. The countries are developing semiconductor and electronic component production owing to the development of intellectual machines and smart manufacturing in the factories and manufacturing units. These regions are proliferating their domestic semiconductor and electronic component production by expanding and enhancing their geographical footprint. APAC is the largest and highest market share for SMT placement equipment for most global sales. Countries such as China, Japan, South Korea, and Taiwan are the major countries with a significant number of players and manufacturing capacity for AMT placement equipment. Furthermore, North America is a significant market to strengthen domestic semiconductor production and innovation to supply necessary PCBs for innovative automotive, medical equipment, and aerospace & defense sectors.
Europe is another region with several manufacturers based in countries such as Germany, Switzerland, and the United Kingdom. The production and sales of cars have increased in Europe due to aggressive output objectives established by rival automakers, increasing the demand for automated equipment to improve chip manufacturing processes. Moreover, South American and African countries are witnessing slow growth and are still in the development phase for capturing the extensive collaborations and agreements with printed circuit board (PCB) manufacturers to deploy adaptive SMT placement equipment.
FPNV Positioning Matrix
The FPNV Positioning Matrix is pivotal in evaluating the SMT Placement Equipment Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the SMT Placement Equipment Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Key Company Profiles
The report delves into recent significant developments in the SMT Placement Equipment Market, highlighting leading vendors and their innovative profiles. These include Autotronik-SMT GmbH, Beijing Huawei Silkroad Electronic Technology Co., Ltd., Beijing Torch Co., Ltd., DDM Novastar, Inc., ESO Electronic Service Ottenbreit GmbH, Essemtec AG, Europlacer Limited, Faroad Intelligent Equipment, Fritsch GmbH, Fuji Corporation, Hangzhou TronStol Technology Co., Ltd., Hanwha Group, Heller Industries, Inc., Hillmancurtis, Hitachi, Ltd., IBE SMT Equipment, LLC, Juki Corporation, Kulicke and Soffa Industries, Inc., Manncorp Inc., Mirae Corporation, Mycronic AB, Nordson Corporation, Panasonic Corporation, Ren Thang Co., Ltd., SumiLax SMT Technologies Pvt. Ltd., Universal Instruments Corporation, Versatec, LLC, Wenzhou Yingxing Technology Co., Ltd., Yamaha Motor Co., Ltd., and Zhejiang Neoden Technology Co.,Ltd.
Market Segmentation & Coverage
1. Market Penetration: It presents comprehensive information on the market provided by key players.
2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.
1. What is the market size and forecast of the SMT Placement Equipment Market?
2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the SMT Placement Equipment Market?
3. What are the technology trends and regulatory frameworks in the SMT Placement Equipment Market?
4. What is the market share of the leading vendors in the SMT Placement Equipment Market?
5. Which modes and strategic moves are suitable for entering the SMT Placement Equipment Market?