市場調查報告書
商品編碼
1466076
軟性印刷電路板市場:按類型、最終用戶分類 - 2024-2030 年全球預測Flexible Printed Circuit Board Market by Type (Double-sided Flexible Circuits, Multilayer Flexible Circuits, Rigid-flex Circuits), End User (Automotive Electronics, Consumer Electronics & Wearables, Defense & Aerospace) - Global Forecast 2024-2030 |
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預計2023年軟性印刷電路板市場規模為230.4億美元,預計2024年將達261.9億美元,2030年將達594.7億美元,複合年成長率為14.50%。
軟性印刷電路板(FPCB)市場包括安裝在聚醯亞胺、PEEK(聚醚醚酮)和導電聚酯薄膜等軟塑膠基板上的軟性電路的開發、生產和銷售。電子元件小型化不斷創新的技術進步對市場空間產生正面影響。消費性電子產品的需求和可攜式智慧型設備的普及正在推動市場需求。車輛中電子內容的增加和自動駕駛的傾向正在推動市場成長。然而,高昂的初始製造成本和複雜的製造流程限制了市場規模。原料成本的波動也會影響盈利並對市場成長構成挑戰。此外,環保和永續材料的開拓正在不斷創造市場機會。將 FPCB 整合到下一代物聯網設備中也創造了市場潛在機會。
主要市場統計 | |
---|---|
基準年[2023] | 230.4億美元 |
預測年份 [2024] | 261.9億美元 |
預測年份 [2030] | 594.7億美元 |
複合年成長率(%) | 14.50% |
由於結構剛度和可靠性的提高,剛撓結合電路越來越受歡迎
雙面軟性電路由形成在軟性介電薄膜上的兩個導電層組成。非常適合佈線空間不足以容納單面軟性電路的複雜電路設計。此外,還可以使用分頻電路,這是一項重要的設計功能。多層軟性電路具有三個或更多導電層,其間具有絕緣層。用於需要高密度互連和大容量的高度複雜的電子系統。多層軟性電路適用於雙面軟性電路無法容納的複雜、高密度電子設備。剛柔結合電路是將軟性電路的彈性與硬板基板的剛性結合在一起的混合電路。這使您可以在想要安裝組件的地方獲得剛性支撐,並在需要的地方彈性。雕塑軟性電路是一種軟性電路,其中導電銅的厚度在整個電路中變化,以在特定區域提供結構完整性。它用於在同一電路內需要穩健連接和可變彈性的應用。單面軟性電路在軟性基底上有一個導電層。最簡單且最常見的類型,用於複雜性有限的應用。
最終用戶:汽車產業向電動和先進安全功能的轉變正在推動 FPCB 的採用
隨著汽車產業傾向於電動和先進的安全功能,汽車電子產品對 FPCB 的需求急劇增加。 FPCB 因其彈性、重量輕和耐惡劣環境而受到製造商的青睞。 FPCB 通常用於儀表板、ABS 系統和安全氣囊系統等應用。該領域的主要企業包括 Nippon Mektron、 工業和 Flexium Interconnect。消費性電子產品和穿戴式裝置越來越受歡迎,FPCB 對於實現智慧型裝置的緊湊外型至關重要。 FPCB 因其彈性和高密度封裝能力而被用於智慧型手機、平板電腦和健身追蹤器。高可靠性和準確性是國防和航太領域不可妥協的要求。 FPCB 因其耐用性和在惡劣環境下的高性能標準而被使用。 FPCB在人造衛星、通訊系統、航空電子設備等方面有應用。醫療保健行業使用可整合到小型醫療設備和心律調節器、影像處理系統和測試設備等設備中的 FPCB。由於對可靠性和準確性的要求,FPCB 是該領域的首選。照明產業擴大採用 FPCB,尤其是在 LED 應用中。彈性可實現創新的照明設計,而 FPCB 的熱性能使其適合高強度照明產品的散熱。 FPCB 的軍事應用(例如國防和航太)需要在惡劣條件下具有高可靠性。 FPCB用於通訊設備、智慧制服、武器系統等。需求是由對輕質、高度適應性零件的需求所驅動的。在通訊領域,FPCB用於高速資料傳輸和天線應用。該行業對 FPCB 的需求是由小型化和改進的完整性所驅動的。
區域洞察
在美洲,美國和加拿大處於FPCB創新和消費的前沿。美洲地區的家用電子電器和軍事領域正在推動需求,買家專注於高品質、高性能的產品。在美洲,研究通常集中在提高電子元件的可回收性和減少其環境足跡,政府和私營部門的投資支持這些努力。歐洲、中東和非洲市場複雜,對高科技和環保產品有需求。有害物質限制 (RoHS) 等歐盟法規正在影響 FPCB 設計和材料,推動環保解決方案的創新。歐洲產業相關人員正在投資研發和永續性,以推動市場成長。亞太地區的消費性電子產業正在崛起,推動了該地區產品的需求。政府對 FPCB 國內生產的日益重視也促進了亞太地區市場的成長。
FPNV定位矩陣
FPNV定位矩陣對於評估軟性印刷電路板市場至關重要。我們檢視與業務策略和產品滿意度相關的關鍵指標,以對供應商進行全面評估。這種深入的分析使用戶能夠根據自己的要求做出明智的決策。根據評估,供應商被分為四個成功程度不同的像限:前沿(F)、探路者(P)、利基(N)和重要(V)。
市場佔有率分析
市場佔有率分析是一種綜合工具,可對軟性印刷電路板市場供應商的現狀進行深入而詳細的研究。全面比較和分析供應商在整體收益、基本客群和其他關鍵指標方面的貢獻,以便更好地了解公司的績效及其在爭奪市場佔有率時面臨的挑戰。此外,該分析還提供了對該行業競爭特徵的寶貴見解,包括在研究基準年觀察到的累積、分散主導地位和合併特徵等因素。這種詳細程度的提高使供應商能夠做出更明智的決策並制定有效的策略,從而在市場上獲得競爭優勢。
1. 市場滲透率:提供有關主要企業所服務的市場的全面資訊。
2. 市場開拓:我們深入研究利潤豐厚的新興市場,並分析其在成熟細分市場的滲透率。
3. 市場多元化:提供有關新產品發布、開拓地區、最新發展和投資的詳細資訊。
4. 競爭評估和情報:對主要企業的市場佔有率、策略、產品、認證、監管狀況、專利狀況和製造能力進行全面評估。
5. 產品開發與創新:提供對未來技術、研發活動和突破性產品開發的見解。
1.軟性印刷電路板市場規模及預測為何?
2.在軟性印刷電路板市場的預測期間內,有哪些產品、細分市場、應用和領域需要考慮投資?
3.軟性印刷電路板市場的技術趨勢與法規結構是什麼?
4.軟性印刷電路板市場主要廠商的市場佔有率為何?
5.進入軟性印刷電路板市場的合適型態和策略手段是什麼?
[186 Pages Report] The Flexible Printed Circuit Board Market size was estimated at USD 23.04 billion in 2023 and expected to reach USD 26.19 billion in 2024, at a CAGR 14.50% to reach USD 59.47 billion by 2030.
The flexible printed circuit board (FPCB) market comprises developing, producing, and selling flexible circuits mounted on flexible plastic substrates, including polyimide, PEEK (Polyether ether ketone), or conductive polyester film. Technological advancements in continuous innovation in electronic components miniaturization positively influence market space. The demand for consumer electronics and the popularity of portable and smart devices has increased the market demand. The growing electronic content in vehicles and inclination towards autonomous driving has enhanced the market growth. However, high initial manufacturing costs and complex fabrication processes are limiting the market scope. The fluctuating raw material costs also impact profitability, creating market growth challenges. Moreover, the development of eco-friendly and sustainable materials is constantly creating opportunities in the market. Integrating FPCBs into next-generation IoT devices also creates potential opportunities in the market.
KEY MARKET STATISTICS | |
---|---|
Base Year [2023] | USD 23.04 billion |
Estimated Year [2024] | USD 26.19 billion |
Forecast Year [2030] | USD 59.47 billion |
CAGR (%) | 14.50% |
Type: Growing popularity of rigid-flex circuits due to its structural rigidity and increased reliability
Double-sided flexible circuits consist of two conductive layers on a flexible dielectric film. They are ideal for complex circuit designs where single-sided flex circuits lack sufficient routing space. They allow for cross-over circuits, which can be a crucial design feature. Multilayer flexible circuits have three or more conductive layers with insulating layers in between. They are used for highly complex electronic systems that require dense interconnects and high capacity. Multilayer flexible circuits are chosen for complex and dense electronics that cannot be accommodated by double-sided flex circuits. Rigid-flex circuits are hybrid circuits that combine the flexibility of flexible circuits with the rigidity of hardboard substrates. This allows for a rigid support where components are mounted and flexibility where needed. Sculptured flexible circuits are a variant of flexible circuits where the thickness of the conductive copper varies across the circuit, providing structural integrity in specific areas. Leveraged in applications that require robust connections and variable flexibility within the same circuit. Single-sided flexible circuits have a single conductive layer on a flexible base. They are the simplest and most common type, used in applications with limited complexity.
End User: Rising inclination towards electrification and advanced safety features of automotive industry drives adoption of FPCBs
As the automotive industry's inclination towards electrification and advanced safety features, the demand for FPCBs in automotive electronics has increased dramatically. Manufacturers prefer FPCBs for their flexibility, lightweight, and ability to withstand harsh environments. They are commonly used in applications such as dashboards, ABS systems, and airbag systems. Key players in this segment include Nippon Mektron, Sumitomo Electric, and Flexium Interconnect. Consumer electronics and wearables have become increasingly popular, and FPCBs are integral in enabling the compact form factors of smart devices. They are used in smartphones, tablets, and fitness trackers due to their flexibility and high-density assembly capabilities. In defense and aerospace, high reliability and precision are non-negotiable requirements. FPCBs are used due to their durability and high performance standards in rugged environments. They find applications in satellites, communication systems, and avionics. The healthcare industry utilizes FPCBs for their ability to integrate into compact medical devices and equipment, such as pacemakers, imaging systems, and laboratory instruments. The preference for FPCBs in this segment is compelled by the need for reliability and precision. The lighting industry is progressively adopting FPCBs, particularly in LED applications. The flexibility allows for innovative lighting designs, while the thermal properties of FPCBs make them suitable for heat dissipation in high-intensity lighting products. Similar to defense and aerospace, military applications of FPCBs require high reliability under extreme conditions. FPCBs are used in communication devices, smart uniforms, and weaponry systems. The demand is driven by the need for lightweight and highly adaptable components. The telecommunications sector relies on FPCBs for high-speed data transmission and antenna applications. The need for FPCBs in this industry stems from the drive for miniaturization and better signal integrity.
Regional Insights
In the Americas region, the United States and Canada remain at the forefront of FPCB innovation and consumption. The consumer electronics and military sectors in the Americas region drive demand, with purchasers focusing on high-quality and high-performance products. The initiatives in the Americas often focus on research in improving the recyclability and reducing the environmental footprint of electronic components, with government and private sector investments supporting these endeavors. The EMEA market is sophisticated, with a demand for high-tech, environmentally friendly products. EU regulations such as Restriction of Hazardous Substances (RoHS), influence FPCB designs and materials, are pushing innovation in eco-friendly solutions. European industry stakeholders invest in research and development, as well as sustainability initiatives to drive the market growth. The rising consumer electronics industry in the APAC region has fueled product demand in the region. The rising government emphasis on domestic FPCB production is contributing to the market growth in the APAC region.
FPNV Positioning Matrix
The FPNV Positioning Matrix is pivotal in evaluating the Flexible Printed Circuit Board Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Flexible Printed Circuit Board Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Key Company Profiles
The report delves into recent significant developments in the Flexible Printed Circuit Board Market, highlighting leading vendors and their innovative profiles. These include Abis Circuits Co., Ltd., AirBorn, Inc., Alper S.R.L., Amphenol Corporation, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, BHflex Co., Ltd., ES&S Solutions GmbH, Eurocircuits GmbH, ExPlus Co., Ltd., Fralock Holdings, LLC, Fujikura Ltd., Ichia Technologies Inc., Interplex Holdings Pte. Ltd., Jinghongyi PCB (HK) Co., Limited, Mekoprint A/S, Multek Corporation, Nitto Denko Corporation, NOK Corporation, RayMing, Schweizer Electronic AG, Shenzhen Kinwong Electronic Co., Ltd., Sumitomo Electric Industries Ltd., Tech Etch, Inc., Tianjin Printronics Circuit Corp., TTM Technologies, Inc., Unimicron Technology Corporation by United Microelectronics Corporation, Wurth Elektronik eiSos GmbH & Co. KG, and Zhen Ding Tech. Group Technology Holding Limited.
Market Segmentation & Coverage
1. Market Penetration: It presents comprehensive information on the market provided by key players.
2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.
1. What is the market size and forecast of the Flexible Printed Circuit Board Market?
2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Flexible Printed Circuit Board Market?
3. What are the technology trends and regulatory frameworks in the Flexible Printed Circuit Board Market?
4. What is the market share of the leading vendors in the Flexible Printed Circuit Board Market?
5. Which modes and strategic moves are suitable for entering the Flexible Printed Circuit Board Market?