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半導體生產設備電子材料半導體製造設備

市場調查報告書

商品編碼

1474071

全球半導體和 IC 封裝材料市場 - 2024-2031

Global Semiconductor and IC Packaging Materials Market - 2024-2031

出版日期: 2024年05月02日 | 出版商:

DataM Intelligence | 英文 195 Pages | 商品交期: 約2個工作天內

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簡介目錄

概述

全球半導體和IC封裝材料市場2023年達到431億美元，預計2031年將達937億美元，2024-2031年預測期間複合年成長率為10.2%。

電子硬體的發展需要使用能夠提供出色效能、速度和頻寬的運算能力，同時保持低延遲和功耗。先進封裝技術非常適合滿足這些不同的效能期望和先進的異質整合要求，使企業能夠利用高速運算、人工智慧和 5G 不斷變化的需求。

由於對高效能運算、物聯網和 5G 設備的需求增加，主要半導體封裝供應商的收入顯著成長。 Amkor 的計算部門由資料中心、基礎設施、PC/筆記型電腦和儲存組成，佔總銷售額的20%，高於2022 年第二季的18%。推動了市場需求。

到2023年，北美預計將成為主導地區，約佔全球半導體和IC封裝材料市場的35%。該地區不斷成長的投資可能會推動對半導體封裝材料的需求。例如，德州儀器(TI) 於2022 年2 月宣布，到2031 年將在美國半導體晶片製造領域投資數十億美元。億美元。

動力學

高性能半導體的技術進步

預計半導體產業在預測期內將大幅成長。半導體和 IC 基板、鍵合線、晶片連接材料和陶瓷封裝都是任何電子設備的重要組件。這些材料有助於開發速度更快、更可靠且功耗更低的高性能積體電路。

半導體技術的快速突破提振了市場需求。 2021 年 12 月，在冠狀病毒造成毀滅性後果後，印度政府批准了一項 100 億美元的激勵計劃，以加強半導體產業。這些因素將鼓勵半導體和 IC 封裝材料的使用，從而促進市場成長。

消費性電子產品的需求不斷成長

由於數位化的不斷發展和技術突破，消費性電子產品的需求量很大。電氣設備的小型化需要將積體電路合併到多晶片模組中。半導體和 IC 封裝材料有助於縮小外形尺寸，同時提高可靠性和性能。

此外，領先企業對突破性技術的持續研發投資和包裝系統營運效率的提高推動了市場向前發展。例如，2021 年 5 月，英特爾宣布對其 Rio Rancho 工廠投資 35 億美元，以支援先進的 3D 封裝和製造技術 Foveros。這些因素將影響半導體和積體電路封裝材料的市場需求。

成本高

積體電路生產的原料成本高、製程複雜是限制市場發展的重要因素。半導體和IC封裝材料的高成本限制了它們的使用，對市場產生了負面影響。此外，由於 IC 的複雜性，晶圓製造成本明顯更高。

半導體封裝單元的設計、開發和實施需要大量初始投資，以滿足汽車、消費性電子、醫療保健、IT 和電信以及航空航太和國防等廣泛行業的需求。晶片及積體電路封裝多樣化，圖案複雜，影響整體成本，導致半導體及IC封裝材料市場擴張有限。

The growth of electronic hardware needs the use of computational power capable of delivering great performance, speed and bandwidth while maintaining low latency and power consumption. Advance packaging technologies are ideally adapted to fulfill these different performance expectations and the advanced heterogeneous integration requirements, thus allowing enterprises to capitalize on the shifting demands of high-speed computing, artificial intelligence and 5G.

Major semiconductor packaging vendors are seeing significant revenue growth due to increased demand for high-performance computing, IoT and 5G devices. Amkor's computing division, consisting of data center, infrastructure, PC/laptop and storage, accounted for 20% of total sales, up from 18% in the second quarter of 2022. Government-implemented initiatives accelerate the shift toward car electrification, driving market demand.

In 2023, North America is expected to be the dominant region with about 35% of the global semiconductor and IC packaging materials market. Growing investments in the region are likely to drive up demand for semiconductor packaging materials. For example, Texas Instruments announced in February 2022 that it will invest billions of dollars in semiconductor chip manufacture in U.S. through 2031. Texas Instruments announced intentions to invest US$ 3.5 billion per year in semiconductor chip manufacturing in U.S. until 2025.

Dynamics

Technological Advancements for High-Performance Semiconductors

The semiconductor sector is expected to increase significantly during the forecast period. semiconductor and IC substrates, bonding wires, die attach materials and ceramic packaging are all essential components of any electronic device. The materials aid in the development of high-performance integrated circuits that are faster, more reliable and require less power.

Rapid technological breakthroughs in semiconductors boost market demand. In December 2021, the Indian government authorized a US$ 10 billion incentive plan to strengthen the semiconductor industry following the coronavirus's devastating consequences. The factors would encourage the usage of semiconductor and IC packaging materials, which would boost market growth.

Rising Demand for Consumer Electronics

Consumer electronics are in high demand as a result of growing digitization and technical breakthroughs. Miniaturization of electrical equipment necessitates the incorporation of integrated circuits into multi-chip modules. Semiconductor & IC packaging materials contribute by allowing for a reduced form factor with increased reliability and performance.

Furthermore, leading players' ongoing R&D investments in breakthrough technologies and improved operational efficiency of packaging systems propel the market forward. For example, in May 2021, Intel announced a US$ 3.5 billion investment in its Rio Rancho facility to support Foveros, an advanced 3D packaging and manufacturing technology. The factors will impact the semiconductor and integrated circuit packaging materials market demand.

High Costs

The raw materials high costs and the intricate process of integrated circuit production are important factors that limit market development. High cost of semiconductor and IC packaging materials limits their usage which negatively affects the market. Also, the wafer manufacturing cost is significantly higher because of the complexities of ICs.

A significant initial investment is required in the design, development and implementation of semiconductor packaging units to cater to a wide range of industries like automotive, consumer electronics, healthcare, IT & telecommunications and aerospace & defense. The overall cost gets affected by the packaging of diverse chips and integrated circuits with complicated patterning resulting in limited expansion of the semiconductor and IC packaging materials market.

Segment Analysis

The global semiconductor and IC packaging materials market is segmented based on type, technology, end-user and region.

Rising Consumer Electronics Drives the Segment Growth

Wafer-level packaging is expected to be the dominant segment with over 30% of the market during the forecast period 2024-2031. The increasing need for consumer electronics, the requirement for high-performance computing and the benefits of wafer-level packaging, including as energy efficiency, ultra-thinness and compact form factor, are driving the segment's growth.

In July 2021, JCET Group announced the formal launch of XDFOITM, a unique technology for ultra-high-density wafer-level packaging that will provide cost-effective options with maximum integration, high-density connectivity and excellent durability for a variety of chipsets. Such improvements would accelerate the expansion of the wafer-level packaging segment, increasing market demand.

Geographical Penetration

Rising Demand for High-Performance ICs in Asia-Pacific

Asia-Pacific is the dominant region in the global semiconductor and IC packaging materials market covering more than 35% of the market. The rising semiconductor sector, demand for high-performance integrated circuits and ongoing R&D initiatives by leading manufacturers are driving market expansion in this region. Taiwan Semiconductor Manufacturing Co. revealed in September 2021 that it was working on a new advanced small-outline packaging technology for the development of miniaturized systems.

Japan also has a large presence in the semiconductor and electronics industries, as it is home to some of the most important integrated circuit chip manufacturers. According to WSTS, Japan's semiconductor sector income increased by 14.2% in 2022 and is predicted to rise higher in the next years. The nation's packaging demand is increasing mostly because of the country's tremendous improvements in the semiconductor and integrated chip industries.

Competitive Landscape

The major global players in the market include Intel, Amkor Technology, Deca Technologies, Siemens, Samsung, Advanced Semiconductor Engineering Inc, Taiwan Semiconductor Manufacturing Company, Microchip Technology, Synapse Electronique and FlipChip International LLC.

COVID-19 Impact Analysis

The COVID-19 epidemic compelled manufacturing industries to rethink their traditional production procedures, primarily driving digital change and smart manufacturing practices throughout production lines. In accordance to the Semiconductor Industry Association, global semiconductor sales are estimated to reach US$ 515.1 billion in 2023. Semiconductors are critical components of electrical gadgets and the sector is extremely competitive.

The year-on-year drop rate in 2023 was 10.3%, with a rapid recovery projected in 2024. Notable semiconductor chip manufacturers include Intel and Samsung Electronics, with Intel producing US$ 58.4 billion and Samsung producing US$ 65.6 billion in semiconductor sales in 2022, putting them among the greatest businesses in terms of semiconductor sector revenues.

Russia-Ukraine War Impact

The Russia-Ukraine conflict has the potential to worsen semiconductor supply chain concerns and chip shortages that have plagued the industry. The greatest threat is to the supply of certain raw materials required in semiconductor manufacture, such as neon and palladium. With Ukraine as a major source of rare gases like neon, used in the manufacture of semiconductor fab lasers and Russia as a significant supplier of rare metals like palladium, there are concerns about the load on semiconductor chip supply chains.

Ukrainian enterprises, such as Cryoin, play an important role in the semiconductor supply chain. The companies produce specialty gases such as neon, helium, xenon and krypton, as well as their isotopes. The lack of semiconductors will have a domino effect and businesses such as the automotive sector, electrical appliances, cell phones and more will face an increase in costs and a collapse in production.

By Type

Organic Substrates
Bonding Wires
Leadframes
Ceramic Packages
Die Attach Materials
Thermal Interface Materials
Solder Balls
Encapsulation Resins
Others

By Technology

Grid Array
Wafer-level Packaging
Small-outline Package (SOP)
Flat no-leads Packages
Dual In-line Packages
3D Packaging
Others

By End-User

Consumer Electronics
Automotive
Healthcare
IT & Telecommunication
Aerospace and Defense
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Russia
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

In June 2021, Samsung revealed an updated collection of chipsets for its next-generation 5G solutions and products, which include Compact Macro, Massive MIMO radios and baseband units, which was commercially available in 2022.
In February 2021, Siemens Digital Industries Software and Advanced Semiconductor Engineering, Inc. recently revealed their collaboration to analyze complicated integrated circuit package assemblies that interact in a single system.

Why Purchase the Report?

To visualize the global semiconductor and IC packaging materials market segmentation based on type, technology, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of semiconductor and IC packaging materials market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global semiconductor and IC packaging materials market report would provide approximately 62 tables, 65 figures and 195 pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Type
3.2.Snippet by Technology
3.3.Snippet by End-User
3.4.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Technological Advancements for High-Performance Semiconductors
  - 4.1.1.2.Rising Demand for Consumer Electronics
- 4.1.2.Restraints
  - 4.1.2.1.High Costs
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID-19
- 6.1.1.Scenario Before COVID-19
- 6.1.2.Scenario During COVID-19
- 6.1.3.Scenario Post COVID-19
6.2.Pricing Dynamics Amid COVID-19
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Type

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 7.1.2.Market Attractiveness Index, By Type
7.2.Organic Substrates*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Bonding Wires
7.4.Leadframes
7.5.Ceramic Packages
7.6.Die Attach Materials
7.7.Thermal Interface Materials
7.8.Solder Balls
7.9.Encapsulation Resins
7.10.Others

8.By Technology

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 8.1.2.Market Attractiveness Index, By Technology
8.2.Grid Array*
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Wafer-level Packaging
8.4.Small-outline Package (SOP)
8.5.Flat no-leads Packages
8.6.Dual In-line Packages
8.7.3D Packaging
8.8.Others

9.By End-User

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 9.1.2.Market Attractiveness Index, By End-User
9.2.Consumer Electronics*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.Automotive
9.4.Healthcare
9.5.IT & Telecommunication
9.6.Aerospace and Defense
9.7.Others

10.By Region

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 10.1.2.Market Attractiveness Index, By Region
10.2.North America
- 10.2.1.Introduction
- 10.2.2.Key Region-Specific Dynamics
- 10.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 10.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.2.6.1.U.S.
  - 10.2.6.2.Canada
  - 10.2.6.3.Mexico
10.3.Europe
- 10.3.1.Introduction
- 10.3.2.Key Region-Specific Dynamics
- 10.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 10.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.3.6.1.Germany
  - 10.3.6.2.UK
  - 10.3.6.3.France
  - 10.3.6.4.Italy
  - 10.3.6.5.Russia
  - 10.3.6.6.Rest of Europe
10.4.South America
- 10.4.1.Introduction
- 10.4.2.Key Region-Specific Dynamics
- 10.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 10.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.4.6.1.Brazil
  - 10.4.6.2.Argentina
  - 10.4.6.3.Rest of South America
10.5.Asia-Pacific
- 10.5.1.Introduction
- 10.5.2.Key Region-Specific Dynamics
- 10.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 10.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.5.6.1.China
  - 10.5.6.2.India
  - 10.5.6.3.Japan
  - 10.5.6.4.Australia
  - 10.5.6.5.Rest of Asia-Pacific
10.6.Middle East and Africa
- 10.6.1.Introduction
- 10.6.2.Key Region-Specific Dynamics
- 10.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 10.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11.Competitive Landscape

11.1.Competitive Scenario
11.2.Market Positioning/Share Analysis
11.3.Mergers and Acquisitions Analysis

12.Company Profiles

12.1.Intel*
- 12.1.1.Company Overview
- 12.1.2.Product Portfolio and Description
- 12.1.3.Financial Overview
- 12.1.4.Key Developments
12.2.Amkor Technology
12.3.Deca Technologies
12.4.Siemens
12.5.Samsung
12.6.Advanced Semiconductor Engineering Inc
12.7.Taiwan Semiconductor Manufacturing Company
12.8.Microchip Technology
12.9.Synapse Electronique
12.10.FlipChip International LLC

LIST NOT EXHAUSTIVE