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市場調查報告書
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1446792

全球 AMB 基板市場 - 2024-2031

Global AMB Substrate Market - 2024-2031

出版日期: | 出版商: DataM Intelligence | 英文 181 Pages | 商品交期: 約2個工作天內

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簡介目錄

概述

2023年,全球AMB(活性金屬釬焊)基板市場規模達13億美元,預計2031年將達到19億美元,2024-2031年預測期間CAGR為4.9%。

隨著5G、物聯網和電動車等新技術的出現,對具有特殊特性的陶瓷基板的需求將會更大,從而使活性金屬釬焊陶瓷基板市場擴展到新的應用領域。 5G 網路的部署以及對更快無線通訊系統日益成長的需求,需要使用能夠處理高頻和功率密度的現代電氣元件。

愛立信表示,預計2019年至2027年全球5G用戶將快速成長,從超過1,200萬人增加到超過40億。預測使用者數量最多的地區包括東北亞、東南亞、印度、尼泊爾和不丹。 AMB 陶瓷基板具有良好的溫度管理和電絕緣性,使其適用於基地台、天線和射頻模組。

到2022年,北美預計將成為全球AMB基板市場的第二個主導地區,覆蓋20%以上的市場佔有率。北美是醫療器材創新的中心。診斷設備、影像設備和穿戴式健康技術等醫療電子產品的進步有助於推動對 AMB 基板的需求。該地區以眾多行業的大量研發活動而聞名。

動力學

陶瓷和釬焊合金的進步

具有改進導熱性的先進陶瓷可以放入 AMB 基板中。它提高了基板散發電子元件產生的熱量的能力,這對於維持高性能設備的最佳工作溫度至關重要。陶瓷和釬焊合金的進步有助於製造具有更高機械強度和耐用性的基材。

它需要在製造和使用過程中支撐電子元件、保持結構完整性並承受機械負載。材料的進步有助於創建多層 AMB 基板,每層的品質都得到最佳化。它允許製造滿足訊號完整性、熱控制和結構支撐特定要求的基板。

對先進電子產品的需求不斷成長

包括各種技術和小工具在內的先進電子產品擴大應用於日常生活和工業應用。 AMB 基板對於為當今的小型化和創新電子元件提供結構和電氣支援至關重要。基板對於支援微型和輕型設備中包含的複雜電路和組件至關重要。

主要公司正在生產各種產品,以滿足對先進電子產品日益成長的需求,創造了無數的市場前景。例如,2021 年 5 月,惠而浦公司與 VTEX(一家提供全球完全整合的端到端商務解決方案的全球科技企業)合作,在製定數位商務策略中發揮至關重要的作用。

有限的兼容性和環境問題

活性金屬釬焊方法僅限於能夠成功黏合在一起的陶瓷和金屬的種類。它減少了可用材料組合的數量並影響市場的成長潛力。 AMB 陶瓷基板通常由低 CTE 陶瓷製成,例如氧化鋁或氮化鋁。

相較之下,AMB 程式中使用的金屬釬焊合金(例如銅基或銀基合金)具有更高的 CTE 值。活性金屬釬焊涉及的生產方法可能會使用有害物質或產生必須妥善處置的廢物。嚴格的環境規則可能會為企業帶來合規難度和成本。

遵守製造商規範並與合格的 HVAC 專業人員合作可以提供重要的見解並確保遵循正確的維護實務。此外,發展中國家缺乏有利的報銷方案和技術採用、對醫療器材徵收過高的關稅以及低收入和中等收入國家缺乏足夠的基礎設施預計將阻礙市場。

目錄

第 1 章:方法與範圍

  • 研究方法論
  • 報告的研究目的和範圍

第 2 章:定義與概述

第 3 章:執行摘要

  • 按類型分類的片段
  • 按應用程式片段
  • 按地區分類的片段

第 4 章:動力學

  • 影響因素
    • 促進要素
      • 陶瓷和釬焊合金的進步
      • 對先進電子產品的需求不斷成長
    • 限制
      • 有限的兼容性和環境問題
    • 機會
    • 影響分析

第 5 章:產業分析

  • 波特五力分析
  • 供應鏈分析
  • 定價分析
  • 監管分析
  • 俄烏戰爭影響分析
  • DMI 意見

第 6 章:COVID-19 分析

  • COVID-19 分析
    • 新冠疫情爆發前的情景
    • 新冠疫情期間的情景
    • 新冠疫情後的情景
  • COVID-19 期間的定價動態
  • 供需譜
  • 疫情期間政府與市場相關的舉措
  • 製造商策略舉措
  • 結論

第 7 章:按類型

  • Si3N4 AMB 基板
  • AlN AMB 基板

第 8 章:按應用

  • 汽車
  • 電子產品
  • 新能源及電網
  • 軍事與航太
  • 工業的
  • 其他

第 9 章:按地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 義大利
    • 俄羅斯
    • 歐洲其他地區
  • 南美洲
    • 巴西
    • 阿根廷
    • 南美洲其他地區
  • 亞太
    • 中國
    • 印度
    • 日本
    • 澳洲
    • 亞太其他地區
  • 中東和非洲

第 10 章:競爭格局

  • 競爭場景
  • 市場定位/佔有率分析
  • 併購分析

第 11 章:公司簡介

  • Rogers Corporation
    • 公司簡介
    • 產品組合和描述
    • 財務概覽
    • 主要進展
  • Winning Imperatives
  • Heraeus Electronics
  • Kyocera
  • NGK Electronics Devices
  • Toshiba Materials
  • Denka
  • DOWA METALTECH
  • Ferrotec
  • BYD

第 12 章:附錄

簡介目錄
Product Code: MA7960

Overview

Global AMB (Active Metal Brazed) Substrate Market reached US$ 1.3 billion in 2023 and is expected to reach US$ 1.9 billion by 2031, growing with a CAGR of 4.9% during the forecast period 2024-2031.

As new technologies arise, such as 5G, the Internet of Things and electric vehicles, there will be a greater need for ceramic substrates with specialised characteristics, allowing the active metal brazed ceramic substrate market to expand into new application areas. The deployment of 5G networks, as well as the growing need for faster wireless communication systems, necessitate the use of modern electrical components that can handle high frequencies and power densities.

In accordance with Ericsson, global 5G subscriptions are expected to increase rapidly between 2019 and 2027, from more than 12 million to over 4 billion. The regions with the highest predicted number of subscribers include North East Asia, South East Asia, India, Nepal and Bhutan. AMB ceramic substrates provide good temperature management and electrical insulation, making them appropriate for use in base stations, antennas and RF modules.

In 2022, North America is expected to hold the second-dominant region in the global AMB substrate market covering over 20% of the market. North America is a hub of medical device innovation. Advances in medical electronics, such as diagnostic equipment, imaging devices and wearable health technology, help to drive demand for AMB substrates. The region is distinguished by considerable R&D operations in numerous industries.

Dynamics

Advancements in Ceramics and Brazing Alloys

Advanced ceramics with improved heat conductivity can be put into AMB substrates. It increases the substrate's ability to dissipate heat generated by electronic components, which is critical for maintaining optimal operating temperatures in high-performance devices. Ceramic and brazing alloy advancements help to build substrates with greater mechanical strength and durability.

It is required to support electronic components, maintain structural integrity and withstand mechanical loads during manufacturing and use. Material advancements help to create multilayered AMB substrates with optimised qualities in each layer. It allows for the fabrication of substrates that meet specific requirements for signal integrity, thermal control and structural support.

Rising Demand for Advanced Electronics

Advanced electronics, which include a variety of technologies and gadgets, are increasingly being used in everyday life and industrial applications. AMB substrates are essential in providing structural and electrical support for today's miniaturised and innovative electronic components. The substrates are critical for supporting the sophisticated circuitry and components included in tiny and lightweight gadgets.

Key firms are producing a diverse range of products to fulfil the increasing demand for advanced electronics, creating a myriad of market prospects. For example, in May 2021, Whirlpool Corporation collaborated with VTEX, a globally tech business that offers global, fully integrated end-to-end commerce solutions, to play a vital role in developing digital commerce strategy.

Limited Compatibility and Environmental Concerns

Active metal brazing methods are limited in the sorts of ceramics and metals that can be successfully bonded together. It reduces the number of accessible material combinations and impact the market's growth potential. AMB ceramic substrates are typically built of low-CTE ceramics like alumina or aluminum nitride.

In contrast, metal brazing alloys utilised in AMB procedures, such as copper or silver-based alloys, have greater CTE values. The production methods involved in active metal brazing may employ hazardous substances or produce waste items that must be properly disposed of. Stringent environmental rules can make compliance difficult and costly for enterprises.

Adhering to manufacturer specifications and collaborating with qualified HVAC professionals can provide significant insights and ensure proper maintenance practices are followed. Furthermore, the absence of favourable reimbursement scenarios and technology adoption in developing nations, excessive customs tax imposed on medical devices and lack of sufficient infrastructure in low- and middle-income countries are expected to hamper the market.

Segment Analysis

The global AMB substrate market is segmented based type, application and region.

Rising Demand for AMB Substrate in Automotive

Automotive is expected to drive the market demand with a share of about 1/3rd of the global AMB substrate market in 2022. As a result of their superior thermal and mechanical capabilities, the automotive industry is increasingly using active metal brazed ceramic substrates into components such as power electronics modules, sensors and exhaust gas management devices. AMB ceramic substrates are utilised in EV power modules, motor drives and battery management systems to provide reliable thermal and electrical insulation.

According to the International Energy Agency, the electric car market is expanding at an exponential rate, with sales exceeding 10 million by 2022. In 2022, electric vehicles accounted for 14% of all new automobile sales, up from 9% in 2021 and less than 5% in 2020. According to the IEA Stated Policies Scenario, the global forecast for the percentage of electric car sales based on existing policies and business aims has climbed to 35% in 2031, up from less than 25% in the prior outlook. The increased acceptance and production of EVs globally will boost the segment's growth.

Geographical Penetration

Rising Adoption of Connected Devices in Asia-Pacific

During the forecast period, Asia-Pacific is expected to be the dominant region in global AMB substrate market with over 1/3rd of the market. The growing popularity of smart devices, such as smartphones, tablets, smartwatches and other connected devices, drives up demand for AMB substrates utilised in their manufacture. AMB substrates play an important part in the production of electronic components utilised in modern cars, which helps to drive market growth.

Strong market giants such as Oppo, Xiaomi and Vivo are headquartered in Asia-Pacific. According to GSMA, smartphone usage in the Asia-Pacific area reached 74% in 2021 and is expected to climb to 84% by 2025. Furthermore, it is estimated that 62% of mobile customers will be present in the same year. The smartphone adoption rate in the region is expected to reach 20% between 2019 and 2025.

Competitive Landscape

The major global players in the market include Rogers Corporation, Winning Imperatives, Heraeus Electronics, Kyocera, NGK Electronics Devices, Toshiba Materials, Denka, DOWA METALTECH, Ferrotec and BYD.

COVID-19 Impact Analysis

The pandemic disrupted global supply networks, disrupting the production and shipment of materials necessary to manufacture AMB substrates. Lockdowns, social distance and worker disruptions caused manufacturing delays and temporary shutdown of production facilities, affecting the output of AMB substrates. The AMB substrate market is strongly related to end-user sectors including automotive and telecoms.

During the pandemic, the picture for global EV sales was uncertain at the start of the year. However, 2020 proved to be a surprise positive year, with global EV sales increasing by 43% over 2019 and the global electric car industry market share reaching a record 4.6% in 2020. The slowdown in these industries during the epidemic influenced the demand for AMB substrates.

Russia-Ukraine War Impact

The conflict interrupted the supply chain for materials needed in AMB substrate manufacture. Closures, logistical issues or personnel interruptions have a direct influence on the region's industrial facilities, affecting AMB substrate production. Geopolitical developments cause economic uncertainty, influencing global markets.

Uncertainty may influence investment decisions and overall demand for technology components, particularly AMB substrates. Depending on the commodities received from the region, costs fluctuated owing to geopolitical tensions and supply chain interruptions. Companies in the AMB substrate market may consider diversifying their supply chains to reduce the risks associated with reliance on specific locations.

By Type

  • Si3N4 AMB Substrates
  • AlN AMB Substrates

By Application

  • Automotive
  • Electronics
  • New Energy & Power Grid
  • Military & Aerospace
  • Industrial
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Russia
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa

Key Developments

  • In November 2023, Tecdia Co. Ltd. recently announced a significant development by opening its newest office in Chengdu, China. Chengdu, the country's third largest city and known for its significant developments in telecommunications and high technology, represents an attractive market for Tecdia's main product, single-layer ceramic capacitors.
  • In May 2022, Heraeus Electronics introduced the Condura.ultra Ag-free AMB substrate. The metal substrate is well-suited for power electronics uses.
  • In July 2021, Daleba Electronics Ltd. recently created a new AMB ceramic substrate for power electronics solutions. The active metal brazing process allows for double-sided copper weighing on 0.25mm thin ceramic substrates.

Why Purchase the Report?

  • To visualize the global AMB substrate market segmentation based on type, application and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities by analyzing trends and co-development.
  • Excel data sheet with numerous data points of AMB substrate market-level with all segments.
  • PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
  • Product mapping available as excel consisting of key products of all the major players.

The global AMB substrate market report would provide approximately 49 tables, 41 figures and 181 pages.

Target Audience 2024

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1. Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

  • 3.1. Snippet by Type
  • 3.2. Snippet by Application
  • 3.3. Snippet by Region

4. Dynamics

  • 4.1. Impacting Factors
    • 4.1.1. Drivers
      • 4.1.1.1. Advancements in Ceramics and Brazing Alloys
      • 4.1.1.2. Rising Demand for Advanced Electronics
    • 4.1.2. Restraints
      • 4.1.2.1. Limited Compatibility and Environmental Concerns
    • 4.1.3. Opportunity
    • 4.1.4. Impact Analysis

5. Industry Analysis

  • 5.1. Porter's Five Force Analysis
  • 5.2. Supply Chain Analysis
  • 5.3. Pricing Analysis
  • 5.4. Regulatory Analysis
  • 5.5. Russia-Ukraine War Impact Analysis
  • 5.6. DMI Opinion

6. COVID-19 Analysis

  • 6.1. Analysis of COVID-19
    • 6.1.1. Scenario Before COVID
    • 6.1.2. Scenario During COVID
    • 6.1.3. Scenario Post COVID
  • 6.2. Pricing Dynamics Amid COVID-19
  • 6.3. Demand-Supply Spectrum
  • 6.4. Government Initiatives Related to the Market During Pandemic
  • 6.5. Manufacturers Strategic Initiatives
  • 6.6. Conclusion

7. By Type

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 7.1.2. Market Attractiveness Index, By Type
  • 7.2. Si3N4 AMB Substrates*
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3. AlN AMB Substrates

8. By Application

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 8.1.2. Market Attractiveness Index, By Application
  • 8.2. Automotive*
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3. Electronics
  • 8.4. New Energy & Power Grid
  • 8.5. Military & Aerospace
  • 8.6. Industrial
  • 8.7. Others

9. By Region

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 9.1.2. Market Attractiveness Index, By Region
  • 9.2. North America
    • 9.2.1. Introduction
    • 9.2.2. Key Region-Specific Dynamics
    • 9.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.2.5.1. U.S.
      • 9.2.5.2. Canada
      • 9.2.5.3. Mexico
  • 9.3. Europe
    • 9.3.1. Introduction
    • 9.3.2. Key Region-Specific Dynamics
    • 9.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.3.5.1. Germany
      • 9.3.5.2. UK
      • 9.3.5.3. France
      • 9.3.5.4. Italy
      • 9.3.5.5. Russia
      • 9.3.5.6. Rest of Europe
  • 9.4. South America
    • 9.4.1. Introduction
    • 9.4.2. Key Region-Specific Dynamics
    • 9.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.4.5.1. Brazil
      • 9.4.5.2. Argentina
      • 9.4.5.3. Rest of South America
  • 9.5. Asia-Pacific
    • 9.5.1. Introduction
    • 9.5.2. Key Region-Specific Dynamics
    • 9.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.5.5.1. China
      • 9.5.5.2. India
      • 9.5.5.3. Japan
      • 9.5.5.4. Australia
      • 9.5.5.5. Rest of Asia-Pacific
  • 9.6. Middle East and Africa
    • 9.6.1. Introduction
    • 9.6.2. Key Region-Specific Dynamics
    • 9.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application

10. Competitive Landscape

  • 10.1. Competitive Scenario
  • 10.2. Market Positioning/Share Analysis
  • 10.3. Mergers and Acquisitions Analysis

11. Company Profiles

  • 11.1. Rogers Corporation*
    • 11.1.1. Company Overview
    • 11.1.2. Product Portfolio and Description
    • 11.1.3. Financial Overview
    • 11.1.4. Key Developments
  • 11.2. Winning Imperatives
  • 11.3. Heraeus Electronics
  • 11.4. Kyocera
  • 11.5. NGK Electronics Devices
  • 11.6. Toshiba Materials
  • 11.7. Denka
  • 11.8. DOWA METALTECH
  • 11.9. Ferrotec
  • 11.10. BYD

LIST NOT EXHAUSTIVE

12. Appendix

  • 12.1. About Us and Services
  • 12.2. Contact Us