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市場調查報告書

IoT數位雙胞胎,DevOps,數位設計的原理

Digital Twin, DevOps and Digital Design Principles for the IoT

出版商 VDC Research Group, Inc. 商品編碼 602341
出版日期 內容資訊 英文 16 Pages; 223 Exhibits
商品交期: 最快1-2個工作天內
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IoT數位雙胞胎,DevOps,數位設計的原理 Digital Twin, DevOps and Digital Design Principles for the IoT
出版日期: 2018年01月31日 內容資訊: 英文 16 Pages; 223 Exhibits
簡介

本報告提供影響組織的IoT軟體、系統開發的新興數位設計趨勢 (十字工程網域整合,DevOps/DevSecOps,產品線/家庭工程,數位雙胞胎技術等) 之系統性資訊。

目錄

  • 調查內容
  • 摘要整理
  • 全球市場概要
  • Agile達到DevOps
  • DevOps:軟體發佈
  • DevSecOps:最小限度風險
  • 數位雙胞胎,數位威脅,IoT雲端平台
  • 關於VDC Research
目錄

A software-driven digital revolution is transforming the competitive landscape across multiple industries and changing the ways in which many companies define and deliver value to customers. For suppliers of development tools and services, this drive to reshape business plans and increasingly use software as a primary means for engaging with customers profoundly impacts how software and systems are conceived, planned, designed, built, delivered, and updated. The need for embedded OEMs to increase agility in their operations necessitates that they improve the speed and efficiency of the development and delivery of their software and systems.

This report analyzes emerging digital design trends influencing organizations developing software and systems for the IoT, including cross-engineering domain integration, DevOps/DevSecOps, product line/family engineering, and digital twin technologies. Market dynamics are discussed in the context of leading vendors, current technologies, tool selection priorities, and data from VDC's 2017 Software and System Development Survey.

What questions are addressed?

  • In what ways are engineering teams modifying Agile methods to fit the needs of the embedded market?
  • How does the use of hybrid development practices influence tooling selection?
  • What are the biggest challenges to adopting DevSecOps?
  • How does DevOps adoption differ by market?
  • Which vendors are best positioned to support organizations implementing Digital Twin?
  • What resources will companies utilize to create a Digital Thread?

Table of Contents

  • Inside This Report
  • Executive Summary
  • Global Market Overview
  • Agile Led to DevOps
  • DevOps - Accelerate Software Release
  • DevSecOps - Accelerate While Minimizing Risks
  • Digital Twin, Digital Thread, IoT Cloud Platforms
  • About VDC Research

LIST OF REPORT EXHIBITS

  • Exhibit 1: Agile Methodology Use, Segmented by Market and Industry (Percent of Responses)
  • Exhibit 2: Number of Development Methodologies Used in Current Project, Segmented by Use of Agile
  • Exhibit 3: Embedded/IoT Schedule Performance, Segmented by Use of Agile
  • Exhibit 4: Types of Tools Used on Embedded/IoT Project, Segmented by Use of Agile
  • Exhibit 5: Formality of Embedded/IoT Requirements Engineering, Segmented by Use of Agile
  • Exhibit 6: Multi-Domain Integration, Segmented by Vertical Market
  • Exhibit 7: DevOps Use Rates in 2016 and 2017, Segmented by Market
  • Exhibit 8: Importance of Security in Embedded/IoT Project, Segmented by Development Practice
  • Exhibit 9: Actions Taken in Response to Security Requirements, Segmented by Development Practice

LIST OF EXCEL EXHIBITS

  • Exhibit 1: Types of Products Currently in Development or Production
  • Exhibit 2: Primary Area of Expertise
  • Exhibit 3: Primary Classification of Current or Most Recently Completed Project
  • Exhibit 4: Personal Involvement with Engineering in Project
  • Exhibit 5: Products Purchased by Respondent's Organization
  • Exhibit 6: Organization's Primary Industry
  • Exhibit 7: Number of People Working for Respondent's Organization Worldwide
  • Exhibit 8: Respondent's Primary Role Within Organization
  • Exhibit 9: Respondent's Country of Residence
  • Exhibit 10: Respondent's Region of Residence
  • Exhibit 11: Industry/Vertical Market
  • Exhibit 27: Capabilities or Features Included in Current Project
  • Exhibit 28: Capabilities or Features Expected for Similar Project in Three Years
  • Exhibit 33: Estimate of Total Project Length in Calendar Months (Time from Initial Specification to Shipment)
  • Exhibit 34: Current Project's Schedule
  • Exhibit 35: Estimate of Total Years for Which Current Product will be Manufactured Once Initial Development is Complete
  • Exhibit 36: Estimate of Product's Average Years of Useful Life Once Deployed in Field by End Customer
  • Exhibit 37: Reasons for Any Delays in Current Project
  • Exhibit 38: Engineering Tasks in which the Respondent is Personally Involved for the Current Project
  • Exhibit 39: Portion of Time Spent on Engineering Tasks in which the Respondent is Personally Involved for the Current Project
  • Exhibit 40: Tasks where Respondent Personally Planned for/Designed, Identified, or Remediated Security Issues
  • Exhibit 41: Percent of Time Spent on Each Task Personally Planning for/Designing, Identifying, or Remediating Security Issues
  • Exhibit 42: Estimated Distribution of Full-Time Engineers Working on Project
  • Exhibit 43: Estimated Number of Full-Time Engineers Employed by Respondent's Organization
  • Exhibit 44: Estimated Distribution of Full-Time Engineers Employed by Respondent's Organization
  • Exhibit 45: Estimated Total Cost of Development for the Project
  • Exhibit 46: Estimated Bill of Material (BOM) for the Project
  • Exhibit 47: Estimated Number of Units to be Shipped for the Project
  • Exhibit 48: Estimated Distribution of Development Costs on the Project
  • Exhibit 49: Estimated Distribution of Development Costs on the Project Three Years from Now
  • Exhibit 50: Estimate of the Fully-Loaded Labor Cost (including salary, benefits, overhead, etc.) for a Typical Embedded Engineer at Respondent's Location
  • Exhibit 51: Estimated Total Number of Defects or Software Patches Reported/Required per Year once Product is Deployed in Field
  • Exhibit 52: Estimated Combined IT and Engineering Time (man-hours) Required for each Patch or Defect Remediation
  • Exhibit 53: Estimated Percentage of Devices that will become Inoperable and Require Repair or Replacement each Year
  • Exhibit 54: Primary Method for Updating Devices once Deployed in Field
  • Exhibit 55: Types of Computer System Components or Sub-Systems Purchased by Organization
  • Exhibit 56: Types of Processors Used on Project
  • Exhibit 57: Types of Processors Expected to be Used on Similar Project in 3 Years
  • Exhibit 58: Primary/Application Processor Used on Project
  • Exhibit 59: Primary Processor Family/Architecture Used on Project
  • Exhibit 60: Processor Families/Architectures Considered for Project
  • Exhibit 61: Bit-Width of Architecture Used by Primary Processor on Project
  • Exhibit 62: Most Important Characteristics when Selecting Embedded Processors
  • Exhibit 63: CPU/MPU suppliers Currently Used on Project
  • Exhibit 64: MCU Suppliers Currently Used on Project
  • Exhibit 65: SoC Suppliers Currently Used on Project
  • Exhibit 66: ASSP Suppliers Currently Used on Project
  • Exhibit 67: FPGA Suppliers Currently Used on Project
  • Exhibit 68: Satisfaction with Embedded Processor Suppliers that Respondent has Purchased from
  • Exhibit 69: Most Important Product Selection Criteria (Excluding Cost) when Purchasing/Specifying CPU Boards, Blades and/or Modules
  • Exhibit 70: Architectures or Form Factors of Boards/Modules Used on Project
  • Exhibit 71: Architectures or Form Factors of Boards/Modules Expected to be Used on a Similar Project in Three Years
  • Exhibit 72: Embedded Board Vendors Currently Used on Project
  • Exhibit 73: Most Important Product Selection Criteria (Excluding Cost) when Purchasing/Specifying Embedded Computing and/or Storage Systems
  • Exhibit 74: Architectures or Form Factors Used in Embedded Computing Systems that are Purchased by Respondent's Organization on Project
  • Exhibit 75: Architectures or Form Factors in Embedded Computing Systems Expected to be Purchased by Respondent's Organization on Similar Project in Three Years
  • Exhibit 76: Motherboard Form Factors Currently Used in Organization's Systems
  • Exhibit 77: Motherboard Form Factors Expected to be Used in Organization's Systems on Similar Project in Three Years
  • Exhibit 78: COM Form Factors Currently Used in Organization's Systems
  • Exhibit 79: COM Form Factors Expected to be Used in Organization's Systems on Similar Project in Three Years
  • Exhibit 80: Types of Wired, Optical, and/or Wireless Connections Used in Systems/Services Produced by Organization
  • Exhibit 81: Types of Wired, Optical, and/or Wireless Connections Expected to be Used in Systems/ Services Produced by Organization in Three Years
  • Exhibit 82: Types of Low-Powered Wide-Area-Networks (LPWAN) Used in Systems/Services Produced by Organization
  • Exhibit 83: Types of Low-Powered Wide-Area-Networks (LPWAN) Expected to be Used in Embedded Systems/Services Produced by Organization on Similar Project in Three Years
  • Exhibit 84: Estimated Amount of Data Generated by Organization's Products on Average each Day per Device
  • Exhibit 85: Estimated Amount of Data Generated by Organization's Products on Average each Day per Device on Similar Project in Three years
  • Exhibit 86: IoT Middleware Frameworks/Platforms Used on Project
  • Exhibit 87: IoT Protocols Used on Project
  • Exhibit 88: Approximate Distance Needed for Devices to Communicate Wirelessly
  • Exhibit 89: Source of Primary Operating System Used on Previous Project
  • Exhibit 90: Source of Primary Operating System Used on Project
  • Exhibit 91: Expected Source of Primary Operating System on Similar Project in Three Years
  • Exhibit 92: Commercially Obtained, NON Open Source OS Used on Project
  • Exhibit 93: Commercially or Consortia Obtained, Open Source OS Used on Project
  • Exhibit 94: Freely and/or Publicly Available, Open Source OS Used on Project
  • Exhibit 95: Chip/Board Vendor-Supplied OS Used on Project
  • Exhibit 96: Most Important Characteristics when Selecting Primary Operating System
  • Exhibit 97: Likelihood of Using same Operating System on Similar Project in Three Years
  • Exhibit 98: Software Stack Components Required on Project (Aside from OS)
  • Exhibit 99: Software Stack Components Required on Similar Project Three Years from Now (Aside from OS)
  • Exhibit 100: Importance of Security in Project
  • Exhibit 101: Actions Organization has Taken in Response to Security Requirements
  • Exhibit 102: How Well Organization has Addressed Security Requirements
  • Exhibit 103: Primary Reason Security is Not Important for Project
  • Exhibit 104: Have any Security Vulnerabilities or Failures within Organization's Products been Exposed or Identified
  • Exhibit 105: Were any Vulnerabilities Disclosed to Customers
  • Exhibit 106: Results of Security Vulnerabilities
  • Exhibit 107: Implications of Security Vulnerabilities
  • Exhibit 108: Commercial Security Vendors Used on Project
  • Exhibit 109: Embedded Security Software Used on Project
  • Exhibit 110: Embedded Security Hardware Used on Project
  • Exhibit 111: Inclusion of PKIs in Project
  • Exhibit 112: Functions of Digital Certificates/Keys
  • Exhibit 113: Place Where Digital Certificates/Keys are Stored
  • Exhibit 114: How Digital Certificates are Provisioned
  • Exhibit 115: CA Primarily Used to Issue Digital Certificate
  • Exhibit 116: Cost Per Device of Digital Certificate
  • Exhibit 117: Types of Devices Connected to Organization's Enterprise/IT Network on Project
  • Exhibit 118: Types of Devices Connected to Organization's Enterprise/IT Network on Similar Project in Three Years
  • Exhibit 119: Do Organization's Current IT Security Policies Cover IoT Devices
  • Exhibit 120: Has Organization Enacted IT Security Policies Specifically to Cover IoT Devices
  • Exhibit 121: Will Organization Enact Specific Security Policies for IoT Devices in Three Years
  • Exhibit 122: Expected Coverage of IoT Security Solutions from Organization's IT Security Vendor
  • Exhibit 123: Types of Security Threats Organization is Concerned about for IoT Devices
  • Exhibit 124: Extent of Agreement with Following IoT Security Statements
  • Exhibit 125: Security Solutions Currently Used to Protect IoT Devices Connected to Organization's Network
  • Exhibit 126: Security Solutions Expected to be Used to Protect IoT Devices Connected to Organization's Network in Three Years
  • Exhibit 127: Commercial IT Security Vendors Currently Used by Respondent's Organization
  • Exhibit 128: Use of Security Solutions from IoT Specialist Vendors
  • Exhibit 129: Percentage of Organization's IT Security Budget Related to Security
  • Exhibit 130: Percentage of Organization's IT Security Budget Related to Commercial Security Software/ Services
  • Exhibit 131: Percentage of Organization's IT Security Budget Related to Security on a Similar Project in Three Years
  • Exhibit 132: Person Responsible for Selection and Purchase of Enterprise Security Solutions
  • Exhibit 133: Types of Tools Used on Project
  • Exhibit 134: Types of Tools Used on Similar Project in Three Years
  • Exhibit 135: Most Important Characteristics when Selecting Compiler Used on Project
  • Exhibit 136: Types of Compiler Purchased by Respondent's Organization
  • Exhibit 137: Compilation Tools Currently Used on Project
  • Exhibit 138: Static Analysis or SAST Tools Used on Project
  • Exhibit 139: Most Important Characteristics when Selecting SAST or Static Analysis Tool Used on Project
  • Exhibit 140: Who Makes Purchasing Decision for Static Analysis and SAST Tools
  • Exhibit 141: Dynamic Testing or DAST Tools Being Used on Project
  • Exhibit 142: Most Important Characteristics when Selecting Dynamic Testing or DAST Tools Used on Project
  • Exhibit 143: Who Makes Purchasing Decision for Dynamic Testing or DAST Tools
  • Exhibit 144: Requirements Management/Definition Tools being Used on Project
  • Exhibit 145: Most Important Characteristics when Selecting Requirements Management/Definition Tools Used on Project
  • Exhibit 146: Who Makes Purchasing Decision for Requirements Management/Definition Tools
  • Exhibit 147: Product Line Engineering (PLE) Tools Used on Project
  • Exhibit 148: Most Important Characteristics when Selecting PLE Tools Used on Project
  • Exhibit 149: Who Makes Purchasing Decision for PLE Tools
  • Exhibit 150: Release Management/Continuous Deployment Tools Used on Project
  • Exhibit 151: Most Important Characteristics when Selecting Release Management/Continuous Deployment Tools Used on Project
  • Exhibit 152: Who Makes Purchasing Decision for Release Management/Continuous Deployment Tools
  • Exhibit 153: Software Composition Analysis (SCA)/IP Compliance Tools Used on Project
  • Exhibit 154: Most Important Characteristics when Selecting SCA/IP Compliance Tools Used on Project
  • Exhibit 155: Who Makes SCA/IP Compliance Tool Purchasing Decisions
  • Exhibit 156: Organization Linking System Requirements on Project
  • Exhibit 157: Description of Organization's Requirements Engineering
  • Exhibit 158: Implementation/Investigation of ALM, PLM, EDA Integration
  • Exhibit 159: Advantages/Benefits of Cross-Engineering Domain Integrations
  • Exhibit 160: Investigation/Implementation of Enhanced Delivery of Continuous Post-Deployment Content and Services Support
  • Exhibit 161: Approximate Cost Budgeted for all Tools Used on Project
  • Exhibit 173: Languages Used on Previous Project
  • Exhibit 174: Languages Used on Project
  • Exhibit 175: Languages Expected to be Used on Similar Project in Three Years
  • Exhibit 176: Estimated Total Source Lines of Code (SLOC) on Project
  • Exhibit 177: Percent of Total Software Code in Final Design from Following Sources
  • Exhibit 178: Expected Change in Source Lines of Code (SLOC) on Next Project: Commercial Third-Party Software
  • Exhibit 179: Expected Change in Source Lines of Code (SLOC) on Next Project: Open Source Third- Party Software
  • Exhibit 180: Expected Change in Source Lines of Code (SLOC) on Next Project: In-house Developed Code
  • Exhibit 181: Percent Increase Expected for SLOC: Commercial Third-Party Software
  • Exhibit 182: Percent Increase Expected for SLOC: Open Source Third-Party Software
  • Exhibit 183: Percent Increase Expected for SLOC: In-house Developed Code
  • Exhibit 184: Percent Decrease Expected for SLOC: Commercial Third-Party Software
  • Exhibit 185: Percent Decrease Expected for SLOC: Open Source Third-Party Software
  • Exhibit 186: Percent Decrease Expected for SLOC: In-House Developed Code
  • Exhibit 187: Percent of In-House Developed Software Code for Project from Certain Sources
  • Exhibit 188: Software Design Methodologies Used on Project
  • Exhibit 189: Software Design Methodologies Expected to be Used on Similar Project Three Years from Now
  • Exhibit 190: Certification/Process Standard(s) Adhered to
  • Exhibit 191: Adherence to Coding Standards
  • Exhibit 192: Deployment of IoT Capabilities and/or Applications into Organization's Products
  • Exhibit 193: Primary Factor Driving Respondent's Organization to Utilize/Deploy IoT Capabilities
  • Exhibit 194: IoT Will Allow Respondent's Organization to...
  • Exhibit 195: Largest Overall Challenge for Respondent's Organization in Developing IoT Solutions
  • Exhibit 196: Most Important Factors when Selecting Suppliers of IoT Components and Solutions
  • Exhibit 197: Use of IoT Cloud Services to Build Embedded/IoT Project
  • Exhibit 198: Use of IoT Cloud Services to Connect, Manage, or Analyze any of IoT Devices on Networks
  • Exhibit 199: Types of IoT Cloud Services being Used on Project
  • Exhibit 200: Types of IoT Cloud Services Expected to be Used on Similar Project in Three Years
  • Exhibit 201: Plans to Resell IoT Services as Value-Added Service
  • Exhibit 202: Types of Cloud Analytics Used for IoT Data
  • Exhibit 203: Types of Non-Cloud IoT Services Used to Support Customers on Project
  • Exhibit 204: IoT Cloud Platforms-as-a-Service (PaaS) Used in Project
  • Exhibit 205: IoT Cloud Platforms-as-a-Service (PaaS) Used on a Similar Project Three Years from Now
  • Exhibit 206: IoT Platform Functions Used on Project
  • Exhibit 207: IoT Platform Functions Expected to be Used on Similar Project in Three Years
  • Exhibit 212: Most Important Requirements when Selecting Embedded Connectivity Products for IoT Gateways Purchased/Used/Integrated by Respondent's Company
  • Exhibit 213: Types of Other Devices/Systems IoT Gateways Designed to Connect to in Project
  • Exhibit 214: Percent of Overall Computation being Done at each Level of Full System
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