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市場調查報告書

全球覆晶技術市場:各凸塊技術 (銅柱,錫鉛凸塊,金凸塊) 、各包裝技術,各包裝類型,各產業,各地區:全球方案,市場規模,預測,趨勢與預測

Flip Chip Technologies Market (By Bumping Technology: Copper Pillar, Solder Bumping, Gold Bumping; By Packaging Technology: By Packaging Type: By industry: By Geography) Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 - 2024

出版商 Variant Market Research LLP 商品編碼 599393
出版日期 內容資訊 英文 130 Pages
商品交期: 最快1-2個工作天內
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全球覆晶技術市場:各凸塊技術 (銅柱,錫鉛凸塊,金凸塊) 、各包裝技術,各包裝類型,各產業,各地區:全球方案,市場規模,預測,趨勢與預測 Flip Chip Technologies Market (By Bumping Technology: Copper Pillar, Solder Bumping, Gold Bumping; By Packaging Technology: By Packaging Type: By industry: By Geography) Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 - 2024
出版日期: 2018年01月02日 內容資訊: 英文 130 Pages
簡介

本報告提供全球覆晶技術市場相關調查分析,市場概要相關各凸塊技術、各包裝技術、各包裝類型、各產業、各地區的考察,主要企業的簡介等相關整體分析,歸結著。

第1章 簡介

  • 市場範圍
  • 報告書的說明
  • 調查方法

第2章 摘要整理

  • 全球覆晶技術市場與前一年同期比較成長率(%)

第3章 市場概要

  • 市場方向性,趨勢,預測,著眼點
  • 市場佔有率分析:企業的競爭模式
  • 市場動態
    • 促進要素
    • 抑制因素
    • 機會

第4章 全球覆晶技術市場:各凸塊技術:市場規模與預測

  • 概要
  • 銅柱
  • 錫鉛凸塊
  • 金凸塊
  • 其他

第5章 全球覆晶技術市場:各包裝技術:市場規模與預測

  • 概要
  • 3D IC
  • 5D IC
  • 2D IC

第6章 全球覆晶技術市場:各終端用戶:市場規模與預測

  • 概要
  • 覆晶SiP包裝
  • 覆晶PGA包裝
  • 覆晶BGA包裝
  • 覆晶LGA包裝
  • 晶圓層級包裝-CSPnl

第7章 全球覆晶技術市場:各垂直產業:市場規模與預測

  • 概要
  • 電子產品
  • 工業
  • 汽車,交通
  • 醫療
  • IT,通訊
  • 航太,防衛
  • 其他

第8章 全球覆晶技術市場:各地區:市場規模與預測

  • 概要
  • 北美
  • 歐洲
  • 亞太地區
  • 全球其他各國

第9章 企業簡介

  • Samsung Electronics Co.
  • ASE group
  • Powertech Technology Inc.
  • United Microelectronics Corporation
  • Intel Corporation
  • Amkor Technology, Inc.
  • TSMC
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Texas Instruments, Inc.
  • Siliconware Precision Industries Co., Ltd.
目錄

As per the latest report published by Variant Market Research, Global flip chip technologies market is estimated to reach $54 billion by 2024; growing at a CAGR of 9.3% from 2016 to 2024. Flip chip, a semiconductor interconnecting device is commonly used in many electronic products like PCs, smartphones, and medical devices, among others. Flip chip technology offers various benefits such as total package size reduction, reduction in the silicon cost, decrease in signal inductance, and high signal density. Flip chip technology is widely used in various industry verticals such as IT & telecommunication, automotive & transport, electronics, industrial, healthcare, and aerospace and defence, among others.

Major factors driving the global flip chip technologies market are advantages of flip chip technology than the traditional wire bond electrical connection, evolving internet of things, and rising demand for miniaturization & high-performing electronic devices. However, huge initial investment essential to set up new manufacturing plant may hamper the market growth. Furthermore, high acceptance of sensors in electronic devices would unfold with numerous growth opportunities in the forecasted year.

Major segments of the global flip chip technologies market are bumping technology, packaging type, packaging technology, industry vertical, and geography. Bumping technology comprises copper pillar, gold bumping, solder bumping (tin-lead eutectic solder, and lead-free solder), and other bumping technologies (aluminium & conductive polymer). By, packaging type, the market is categorized as flip chip PGA package, flip chip SiP package, flip chip BGA package, flip chip LGA package, and wafer level packaging-CSPnl. Furthermore, the market is sub segmented by packaging technology as 3D IC, 2.5D IC and 2D IC. Industry vertical is further divided into automotive & transport, electronics, industrial, healthcare, IT & telecommunication, aerospace and defence, and other industry verticals (renewable energy and media & entertainment).

Geographically, the global flip chip technologies market is categorized into North America, Europe, Asia-Pacific and RoW. The U.S., Mexico and Canada are covered under North America wherein Europe covers Germany, France, Italy, and Rest of Europe. Asia-Pacific covers China, Japan, South Korea, Taiwan, India, and Rest of Asia Pacific. Rest of the World (RoW) covers South America, Middle East and Africa.

The major players competing in the market are ASE group, Powertech Technology Inc., United Microelectronics Corporation, Intel Corporation, Siliconware Precision Industries Co., Ltd., Amkor Technology, Inc., TSMC, Jiangsu Changjiang Electronics Technology Co., Ltd., Samsung Electronics Co., and Texas Instruments, Inc., among others.

The key takeaways from the report

  • The report will provide detailed analysis of Flip Chip Technologies Market with respect to major segments such as bumping technology, packaging type, packaging technology, and industry vertical
  • The report will include the qualitative and quantitative analysis with market estimation over 2015-2022 and compound annual growth rate (CAGR) between 2016 and 2022.
  • Comprehensive analysis of market dynamics including factors and opportunities.
  • An exhaustive regional analysis of Flip Chip Technologies Market.
  • Profile of key players of the Flip Chip Technologies Market, which include key financials, product & services and new developments.

Scope of Flip Chip Technologies Market

Bumping Technology Segments

  • Copper Pillar
  • Gold Bumping
  • Solder Bumping
    • Tin-lead eutectic solder
    • Lead-free solder
  • Other Bumping Technologies (Aluminium & Conductive polymer)

Packaging Type Segments

  • Flip Chip PGA Package
  • Flip Chip SiP Package
  • Flip Chip BGA Package
  • Flip Chip LGA Package
  • Wafer Level Packaging-CSPnl

Packaging Technology Segments

  • 3D IC
  • 2.5D IC
  • 2D IC

Industry Vertical Segments

  • Automotive & Transport
  • Electronics
  • Industrial
  • Healthcare
  • IT & telecommunication
  • Aerospace and Defence
  • Other Industry Verticals (Renewable Energy and Media & Entertainment)

Geographical Segments

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Taiwan
    • India
    • Rest of Asia-Pacific
  • RoW
    • South America
    • Middle East
    • Africa

Table of Contents

Chapter 1 Prefix

  • 1.1 Market Scope
  • 1.2 Report Description
  • 1.3 Research Methodology
    • 1.3.1 Primary Research
    • 1.3.2 Secondary Research
    • 1.3.3 In-house Data Modeling

Chapter 2 Executive Summary

  • 2.1 Global Flip Chip Technologies Market Year-on-Year Growth, 2016 - 2024 (%)

Chapter 3 Market Outline

  • 3.1 Market Inclination, Trend, Outlook and Viewpoint
  • 3.2 Market Share Analysis: Company's Competitive Scenario
  • 3.3 Market Dynamics
    • 3.3.1 Drivers
      • 3.3.1.1 Impact Analysis
    • 3.3.2 Restraints
      • 3.3.2.1 Impact Analysis
    • 3.3.3 Opportunities

Chapter 4 Global Flip Chip Technologies Market by Bumping Technology: Market Size and Forecast, 2015 - 2024

  • 4.1 Overview
  • 4.2 Copper Pillar
    • 4.2.1 Current Trend and Analysis
    • 4.2.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 4.2.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 4.3 Solder Bumping
    • 4.3.1 Current Trend and Analysis
    • 4.3.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 4.3.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
    • 4.3.4 Tin-Lead Eutectic Solder
      • 4.3.4.1 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
    • 4.3.5 Lead-Free Solder
      • 4.3.5.1 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 4.4 Gold Bumping
    • 4.4.1 Current Trend and Analysis
    • 4.4.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 4.4.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 4.5 Other Bumping Technologies
    • 4.5.1 Current Trend and Analysis
    • 4.5.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 4.5.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)

Chapter 5 Global Flip Chip Technologies Market by Packaging Technology: Market Size and Forecast, 2015 - 2024

  • 5.1 Overview
  • 5.2 3D IC
    • 5.2.1 Current Trend and Analysis
    • 5.2.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 5.2.2 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 5.3 2.5D IC
    • 5.3.1 Current Trend and Analysis
    • 5.3.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 5.3.2 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 5.4 2D IC
    • 5.4.1 Current Trend and Analysis
    • 5.4.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 5.4.2 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)

Chapter 6 Global Energy Management System Market by End User: Market Size and Forecast, 2015 - 2024

  • 6.1 Overview
  • 6.2 Flip Chip SiP Package
    • 6.2.1 Current Trend and Analysis
    • 6.2.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 6.2.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 6.3 Flip Chip PGA Package
    • 6.3.1 Current Trend and Analysis
    • 6.3.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 6.3.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 6.4 Flip Chip BGA Package
    • 6.4.1 Current Trend and Analysis
    • 6.4.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 6.4.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 6.5 Flip Chip LGA Package
    • 6.5.1 Current Trend and Analysis
    • 6.5.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 6.5.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 6.6 Wafer Level Packaging-CSPnl
    • 6.6.1 Current Trend and Analysis
    • 6.6.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 6.6.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)

Chapter 7 Global Flip Chip Technologies Market by Industry Vertical: Market Size and Forecast, 2015 - 2024

  • 7.1 Overview
  • 7.2 Electronics
    • 7.2.1 Current Trend and Analysis
    • 7.2.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 7.2.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 7.3 Industrial
    • 7.3.1 Current Trend and Analysis
    • 7.3.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 7.3.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 7.4 Automotive & Transport
    • 7.4.1 Current Trend and Analysis
    • 7.4.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 7.4.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 7.5 Healthcare
    • 7.5.1 Current Trend and Analysis
    • 7.5.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 7.5.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 7.6 IT & Telecommunication
    • 7.6.1 Current Trend and Analysis
    • 7.6.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 7.6.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 7.7 Aerospace and Defence
    • 7.7.1 Current Trend and Analysis
    • 7.7.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 7.7.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)
  • 7.8 Other Industry Verticals
    • 7.8.1 Current Trend and Analysis
    • 7.8.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 7.8.3 Market Size and Forecast by Region, 2015 - 2024 ($ Billion)

Chapter 8 Global Flip Chip Technologies Market by Geography: Market Size and Forecast, 2015 - 2024

  • 8.1 Overview
    • 8.1.1 Global Flip Chip Technologies Market Year-on-Year Growth, by regions 2016 - 2024 (%)
  • 8.2 North America
    • 8.2.1 Current Trend and Analysis
    • 8.2.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.2.3 US
      • 8.2.3.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.2.4 Canada
      • 8.2.4.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.2.5 Mexico
      • 8.2.5.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
  • 8.3 Europe
    • 8.3.1 Current Trend and Analysis
    • 8.3.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.3.3 UK
      • 8.3.3.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.3.4 Germany
      • 8.3.4.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.3.5 France
      • 8.3.5.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.3.6 Italy
      • 8.3.6.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.3.7 Rest of Europe
      • 8.3.7.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
  • 8.4 Asia-Pacific
    • 8.4.1 Current Trend and Analysis
    • 8.4.2 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.4.3 China
      • 8.4.3.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.4.4 Japan
      • 8.4.4.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.4.5 South Korea
      • 8.4.5.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.4.6 Taiwan
      • 7.4.6.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.4.7 India
      • 7.4.7.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.4.8 Rest of Asia-Pacific
      • 7.4.8.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
  • 8.5 RoW
    • 8.5.1 Current Trend and Analysis
    • 8.5.2 Market Size and Forecast
    • 8.5.3 Middle East
      • 8.5.3.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.5.4 South America
      • 8.5.4.1 Market Size and Forecast, 2015 - 2024 ($ Billion)
    • 8.5.5 Africa
      • 8.5.5.1 Market Size and Forecast, 2015 - 2024 ($ Billion)

Chapter 9 Company Profiles

  • 9.1 Samsung Electronics Co.
  • 9.2 ASE group
  • 9.3 Powertech Technology Inc.
  • 9.4 United Microelectronics Corporation
  • 9.5 Intel Corporation
  • 9.6 Amkor Technology, Inc.
  • 9.7 TSMC
  • 9.8 Jiangsu Changjiang Electronics Technology Co., Ltd.
  • 9.9 Texas Instruments, Inc.
  • 9.10 Siliconware Precision Industries Co., Ltd.

List of Figures

  • FIG. 1 MARKET SEGMENTATION: GLOBAL FLIP CHIP TECHNOLOGIES MARKET
  • FIG. 2 GLOBAL FLIP CHIP TECHNOLOGIES MARKET YEAR ON YEAR GROWTH, 2016 - 2024 (%)
  • FIG. 3 MARKET SHARE ANALYSIS, 2016 (%)
  • FIG. 4 GLOBAL FLIP CHIP TECHNOLOGIES MARKET SHARE AND FORECAST, BY BUMPING TECHNOLOGY 2016 Vs 2024 (VALUE %)
  • FIG. 5 COPPER PILLAR MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 6 SOLDER BUMPING MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 7 GOLD BUMPING MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 8 OTHER BUMPING TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 9 GLOBAL FLIP CHIP TECHNOLOGIES MARKET SHARE AND FORECAST, BY PACKAGING TECHNOLOGY 2016 Vs 2024 (VALUE %)
  • FIG. 10 3D IC MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 11 2.5D IC MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 12 2D IC MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 13 GLOBAL FLIP CHIP TECHNOLOGIES MARKET SHARE AND FORECAST, BY PACKAGING TYPE 2016 Vs 2024 (VALUE %)
  • FIG. 14 FLIP CHIP SIP PACKAGE MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 15 FLIP CHIP PGA PACKAGE MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 16 FLIP CHIP BGA PACKAGE MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 17 FLIP CHIP LGA PACKAGE MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 18 WAFER LEVEL PACKAGING-CSPNL MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 19 GLOBAL FLIP CHIP TECHNOLOGIES MARKET SHARE AND FORECAST, BY INDUSTRY VERTICAL 2016 Vs 2024 (VALUE %)
  • FIG. 20 ELECTRONICS MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 21 INDUSTRIAL MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 22 AUTOMOTIVE & TRANSPORT MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 23 HEALTHCARE MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 24 IT & TELECOMMUNICATION MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 25 AEROSPACE AND DEFENCE MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 26 OTHER INDUSTRY VERTICALS MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 27 GLOBAL FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST BY GEOGRAPHY, 2016 Vs 2024 (REVENUE, CAGR %)
  • FIG. 28 GLOBAL FLIP CHIP TECHNOLOGIES MARKET YEAR ON YEAR GROWTH, BY REGIONS 2016 - 2024 (%)
  • FIG. 29 NORTH AMERICA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 30 NORTH AMERICA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST BY COUNTRY, 2015 - 2024 ($ BILLION)
  • FIG. 31 U.S. FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG.32 CANADA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 33 MEXICO FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 34 EUROPE FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024, ($ BILLION)
  • FIG. 35 EUROPE FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 BY COUNTRY, ($ BILLION)
  • FIG. 36 GERMANY FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 37 FRANCE FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 38 ITALY FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 39 REST OF EUROPE FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 40 ASIA-PACIFIC FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024, ($ BILLION)
  • FIG. 41 ASIA-PACIFIC FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 BY COUNTRY ($ BILLION)
  • FIG. 42 CHINA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 43 JAPAN FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 44 SOUTH KOREA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 45 TAIWAN FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 46 INDIA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 47 REST OF ASIA-PACIFIC FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 48 REST OF THE WORLD FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 49 REST OF THE WORLD FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 BY COUNTRY ($ BILLION)
  • FIG. 50 SOUTH AMERICA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 51 MIDDLE EAST FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)
  • FIG. 52 AFRICA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, 2015 - 2024 ($ BILLION)

List of Tables

  • TABLE 1 GLOBAL FLIP CHIP TECHNOLOGIES MARKET SNAPSHOT
  • TABLE 2 GLOBAL FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY REGION, 2015 - 2024 ($ BILLION)
  • TABLE 3 DRIVER OF THE GLOBAL FLIP CHIP TECHNOLOGIES MARKET: IMPACT ANALYSIS
  • TABLE 4 RESTRAINTS OF THE GLOBAL FLIP CHIP TECHNOLOGIES MARKET: IMPACT ANALYSIS
  • TABLE 5 COPPER PILLAR MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 6 SOLDER BUMPING MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 7 GOLD BUMPING MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 8 OTHER BUMPING TECHNOLOGIES MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 9 3D IC MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 10 2.5D IC MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 11 2D IC MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 12 FLIP CHIP SIP PACKAGE MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 13 FLIP CHIP PGA PACKAGE MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 14 FLIP CHIP BGA PACKAGE MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 15 FLIP CHIP LGA PACKAGE MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 16 WAFER LEVEL PACKAGING-CSPNL MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 17 ELECTRONICS MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 18 INDUSTRIAL MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 19 AUTOMOTIVE & TRANSPORT MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 20 HEALTHCARE MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 21 IT & TELECOMMUNICATION MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 22 AEROSPACE AND DEFENCE MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 23 OTHER INDUSTRY VERTICALS MARKET SIZE AND FORECAST, BY REGIONS, 2015 - 2024 ($ BILLION)
  • TABLE 24 NORTH AMERICA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY BUMPING TECHNOLOGY, 2015 - 2024 ($ BILLION)
  • TABLE 25 NORTH AMERICA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY PACKAGING TECHNOLOGY, 2015 - 2024 ($ BILLION)
  • TABLE 26 NORTH AMERICA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY PACKAGING TYPE, 2015 - 2024 ($ BILLION)
  • TABLE 27 NORTH AMERICA FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY INDUSTRY VERTICAL, 2015 - 2024 ($ BILLION)
  • TABLE 28 EUROPE FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY BUMPING TECHNOLOGY, 2015 - 2024 ($ BILLION)
  • TABLE 29 EUROPE FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY PACKAGING TECHNOLOGY, 2015 - 2024 ($ BILLION)
  • TABLE 30 EUROPE FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY PACKAGING TYPE, 2015 - 2024 ($ BILLION)
  • TABLE 31 EUROPE FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY INDUSTRY VERTICAL, 2015 - 2024 ($ BILLION)
  • TABLE 32 ASIA-PACIFIC FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY BUMPING TECHNOLOGY, 2015 - 2024 ($ BILLION)
  • TABLE 33 ASIA-PACIFIC FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY PACKAGING TECHNOLOGY, 2015 - 2024 ($ BILLION)
  • TABLE 34 ASIA-PACIFIC FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY PACKAGING TYPE, 2015 - 2024 ($ BILLION)
  • TABLE 35 ASIA-PACIFIC FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY INDUSTRY VERTICAL, 2015 - 2024 ($ BILLION)
  • TABLE 36 REST OF THE WORLD FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY BUMPING TECHNOLOGY, 2015 - 2024 ($ BILLION)
  • TABLE 37 REST OF THE WORLD FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY PACKAGING TECHNOLOGY, 2015 - 2024 ($ BILLION)
  • TABLE 38 REST OF THE WORLD FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY PACKAGING TYPE, 2015 - 2024 ($ BILLION)
  • TABLE 39 REST OF THE WORLD FLIP CHIP TECHNOLOGIES MARKET SIZE AND FORECAST, BY INDUSTRY VERTICAL, 2015 - 2024 ($ BILLION)
  • TABLE 40 SAMSUNG ELECTRONICS CO.: COMPANY SNAPSHOT
  • TABLE 41 ASE GROUP: COMPANY SNAPSHOT
  • TABLE 42 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
  • TABLE 43 UNITED MICROELECTRONICS CORPORATION: COMPANY SNAPSHOT
  • TABLE 44 INTEL CORPORATION: COMPANY SNAPSHOT
  • TABLE 45 AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT
  • TABLE 46 TSMC: COMPANY SNAPSHOT
  • TABLE 47 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.: COMPANY SNAPSHOT
  • TABLE 48 TEXAS INSTRUMENTS, INC.: COMPANY SNAPSHOT
  • TABLE 49 SILICONWARE PRECISION INDUSTRIES CO., LTD.: COMPANY SNAPSHOT
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