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市場調查報告書

3D半導體包裝的全球市場:市場情況·市場規模·展望·趨勢·預測

3D Semiconductor Packaging Market (By Technology Type: 3D Package-On-Package/Wire-Bonded/Fan-Out Based/ Through-Silicon-Via; By Materials Type; By Industry Vertical; By Geography) Global Scenario, Market Size, Outlook, Trend and Forecast, 2015-2024

出版商 Variant Market Research LLP 商品編碼 537265
出版日期 內容資訊 英文 120 Pages
商品交期: 2-3個工作天內
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3D半導體包裝的全球市場:市場情況·市場規模·展望·趨勢·預測 3D Semiconductor Packaging Market (By Technology Type: 3D Package-On-Package/Wire-Bonded/Fan-Out Based/ Through-Silicon-Via; By Materials Type; By Industry Vertical; By Geography) Global Scenario, Market Size, Outlook, Trend and Forecast, 2015-2024
出版日期: 2017年07月11日內容資訊: 英文 120 Pages
簡介

本報告提供全球3D半導體包裝的市場調查,提供市場定義和概要,市場的各種影響因素及市場機會分析,技術類型·材料類型·用途·地區/各主要國家趨勢與市場規模的變化與預測,競爭環境,並彙整主要企業的簡介等資訊。

第1章 序章

第2章 摘要整理

第3章 市場概要

  • 市場方向性·趨勢·展望·觀點
  • 市場佔有率分析:企業的競爭情形
  • 價值鏈分析
  • 市場動態
    • 成長推進因素
    • 阻礙成長要素
    • 市場機會
  • 波特的五力分析
  • 影響分析

第4章 市場分析·預測:各技術類型

  • 3D PoP
    • 目前趨勢·分析
    • 市場規模·預測
  • 3D焊線
    • 目前趨勢·分析
    • 市場規模·預測
  • 3D扇出
    • 目前趨勢·分析
    • 市場規模·預測
  • 3D TSV
    • 目前趨勢·分析
    • 市場規模·預測
  • 其他
    • 目前趨勢·分析
    • 市場規模·預測

第5章 市場分析·預測:各材料類型

  • 接合線
    • 目前趨勢·分析
    • 市場規模·預測
  • 有機基板
    • 目前趨勢·分析
    • 市場規模·預測
  • 封裝樹脂
    • 目前趨勢·分析
    • 市場規模·預測
  • 導線架
    • 目前趨勢·分析
    • 市場規模·預測
  • 陶瓷封裝
    • 目前趨勢·分析
    • 市場規模·預測
  • 銲晶材料
    • 目前趨勢·分析
    • 市場規模·預測
  • 其他
    • 目前趨勢·分析
    • 市場規模·預測

第6章 市場分析·預測:各用途

  • 工業用
  • 電子產品
  • 醫療保健
  • IT & 通訊
  • 汽車·運輸
  • 航太·防衛
  • 其他
    • 目前趨勢·分析
    • 市場規模·預測

第7章 市場分析·預測:各地區

  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 義大利
    • 其他
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 其他
  • 其他地區
    • 中東
    • 南美
    • 非洲

第8章 企業簡介

目錄

Global 3D Semiconductor Packaging Market is estimated to reach $12 Billion by 2024; growing at a CAGR of 15.2% from 2016 to 2024. 3D semiconductor packaging is an innovative packaging technology of semiconductor chips that are manufactured by stacking and interconnecting of silicon wafers, to perform as a single device. Various features such as reduced space consumption, better overall performance, and enhanced efficiency have increased its penetration across various applications areas such as electronics, healthcare, industrial, and IT & Telecommunication, among others. Heavy spending on research & development by numerous companies and growing adoption of 3D semiconductor packaging across various industries pose an increased demand for 3D semiconductor packaging in the coming years.

Increase in number of portable electronic devices, short replacement period of electronics products, and technological superiorities over 2D packaging technology are the major factors driving the global 3D semiconductor packaging market. However, high initial capital investment may hamper the market growth. Growing trend of internet of things would provide several growth opportunities for the market in the coming years.

The global 3D semiconductor packaging market is bifurcated by technology, material type and industry vertical. By technology, the market is further segmented into 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via, and others. By material type, the market is categorized into bonding wire, organic substrate, encapsulation resin, leadframe, ceramic package, die attach material, and others. By industry vertical, the market is segregated into industrial, electronics, healthcare, IT & telecommunication, automotive & transport, aerospace & defense, and others.

Based on geography, the global 3D semiconductor packaging market is segmented into North America, Europe, Asia-Pacific and (RoW). The U.S., Mexico and Canada are covered under North America wherein Europe covers UK, France, Germany, Italy, and others. Asia-Pacific covers China, India, Japan, South Korea, and others. Rest of the World (RoW) covers South America, Middle East and Africa.

Major companies operating in the 3D semiconductor packaging market are Siliconware Precision Industries Co., Amkor Technology, ASE group, Ltd., SUSS MicroTec AG., International Business Machines Corporation (IBM), Jiangsu Changjiang Electronics Technology Co. Ltd., Qualcomm Technologies, Inc., Intel Corporation, STMicroelectronics, and Taiwan Semiconductor Manufacturing Company, among others.

The key takeaways from the report

  • The report will provide detailed analysis of 3D Semiconductor Packaging Market with respect to major segments such as technology type, materials type, and industry vertical type
  • The report will include the qualitative and quantitative analysis with market estimation over 2015-2024 and compound annual growth rate (CAGR) between 2016 and 2024
  • Comprehensive analysis of market dynamics including factors and opportunities of the global 3D Semiconductor Packaging Market
  • An exhaustive regional analysis of 3D Semiconductor Packaging Market from 2015 to 2024 will be included in the report
  • Profile of the key players in the 3D Semiconductor Packaging Market, will be provided, which include key financials, product & services, new developments and business strategies

Scope of 3D Semiconductor Packaging Market

Technology Type Segments

  • 3D package-on-package
  • 3D wire-bonded
  • 3D fan-out based
  • 3D through-silicon-via
  • Others

Materials Type Segments

  • Bonding wire
  • Organic substrate
  • Encapsulation resin
  • Leadframe
  • Ceramic package
  • Die attach material
  • Others

Industry Vertical Type Segments

  • Industrial
  • Electronics
  • Healthcare
  • IT & telecommunication
  • Automotive & transport
  • Aerospace & defense
  • Others

Geographical Segments

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Others
  • Asia-Pacific
    • India
    • China
    • Japan
    • South Korea
    • Others
  • RoW
    • South America
    • Middle East
    • Africa

Table of Contents

Chapter 1 Prefix

  • 1.1 Market Scope
  • 1.2 Report Description
  • 1.3 Research Methodology
    • 1.3.1 Primary Research
    • 1.3.2 Secondary Research
    • 1.3.3 In-house Data Modeling

Chapter 2 Executive Summary

Chapter 3 Market Outline

  • 3.1 Market Inclination, Trend, Outlook and Viewpoint
  • 3.2 Market Share Analysis: Company's Competitive Scenario
  • 3.3 Value Chain Analysis
  • 3.4 Market Dynamics
    • 3.4.1 Drivers
      • 3.4.1.1 Impact Analysis
    • 3.4.2 Restraints
      • 3.4.2.1 Impact Analysis
    • 3.4.3 Opportunities
  • 3.5 Porter's five forces analysis
    • 3.5.1 Factors Impact Analysis

Chapter 4 3D Semiconductor Packaging Market by Technology Type: Market Size and Forecast, 2015 - 2024

  • 4.1 3D package-on-package
    • 4.1.1 Current Trend and Analysis
    • 4.1.2 Market Size and Forecast
  • 4.2 3D wire-bonded
    • 4.2.1 Current Trend and Analysis
    • 4.2.2 Market Size and Forecast
  • 4.3 3D fan-out based
    • 4.3.1 Current Trend and Analysis
    • 4.3.2 Market Size and Forecast
  • 4.4 3D through-silicon-via
    • 4.4.1 Current Trend and Analysis
    • 4.4.2 Market Size and Forecast
  • 4.5 Others
    • 4.5.1 Current Trend and Analysis
    • 4.5.2 Market Size and Forecast

Chapter 5 3D Semiconductor Packaging Market by Materials Type: Market Size and Forecast, 2015 - 2024

  • 5.1 Bonding wire
    • 5.1.1 Current Trend and Analysis
    • 5.1.2 Market Size and Forecast
  • 5.2 Organic substrate
    • 5.2.1 Current Trend and Analysis
    • 5.2.2 Market Size and Forecast
  • 5.3 Encapsulation resin
    • 5.3.1 Current Trend and Analysis
    • 5.3.2 Market Size and Forecast
  • 5.4 Leadframe
    • 5.4.1 Current Trend and Analysis
    • 5.4.2 Market Size and Forecast
  • 5.5 Ceramic package
    • 5.5.1 Current Trend and Analysis
    • 5.5.2 Market Size and Forecast
  • 5.6 Die attach material
    • 5.6.1 Current Trend and Analysis
    • 5.6.2 Market Size and Forecast
  • 5.7 Other Material Type
    • 5.7.1 Current Trend and Analysis
    • 5.7.2 Market Size and Forecast

Chapter 6 3D Semiconductor Packaging Market by Industry Vertical Type: Market Size and Forecast, 2015 - 2024

  • 6.1 Industrial
    • 6.1.1 Current Trend and Analysis
    • 6.1.2 Market Size and Forecast
  • 6.2 Electronics
    • 6.2.1 Current Trend and Analysis
    • 6.2.2 Market Size and Forecast
  • 6.3 Healthcare
    • 6.3.1 Current Trend and Analysis
    • 6.3.2 Market Size and Forecast
  • 6.4 IT & telecommunication
    • 6.4.1 Current Trend and Analysis
    • 6.4.2 Market Size and Forecast
  • 6.5 Automotive & transport
    • 6.5.1 Current Trend and Analysis
    • 6.5.2 Market Size and Forecast
  • 6.6 Aerospace & defense
    • 6.6.1 Current Trend and Analysis
    • 6.6.2 Market Size and Forecast
  • 6.7 Others
    • 6.7.1 Current Trend and Analysis
    • 6.7.2 Market Size and Forecast

Chapter 7 3D Semiconductor Packaging Market by Geography: Market Size and Forecast, 2015 - 2024

  • 7.1 North America
    • 7.1.1 Current Trend and Analysis
    • 7.1.2 Market Size and Forecast
    • 7.1.3 US
    • 7.1.4 Canada
    • 7.1.5 Mexico
  • 7.2 Europe
    • 7.2.1 Current Trend and Analysis
    • 7.2.2 Market Size and Forecast
    • 7.2.3 Germany
    • 7.2.4 France
    • 7.2.5 United Kingdom
    • 7.2.6 Italy
    • 7.2.7 Others
  • 7.3 Asia-Pacific
    • 7.3.1 Current Trend and Analysis
    • 7.3.2 Market Size and Forecast
    • 7.3.3 China
    • 7.3.4 India
    • 7.3.5 Japan
    • 7.3.6 South Korea
    • 7.3.7 Others
  • 7.4 RoW
    • 7.4.1 Current Trend and Analysis
    • 7.4.2 Market Size and Forecast
    • 7.4.3 Middle East
    • 7.4.4 South America
    • 7.4.5 Africa

Chapter 8 Company Profiles

  • 8.1 Siliconware Precision Industries Co.
  • 8.2 Amkor Technology
  • 8.3 SUSS MicroTec AG.
  • 8.4 Intel Corporation
  • 8.5 Qualcomm Technologies, Inc.,
  • 8.6 STMicroelectronics
  • 8.7 ASE group, Ltd.,
  • 8.8 Jiangsu Changjiang Electronics Technology Co. Ltd.,
  • 8.9 International Business Machines Corporation (IBM)
  • 8.10 Taiwan Semiconductor Manufacturing Company
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