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市場調查報告書

嵌入式芯片包裝的全球市場:行業分析,市場規模,市場份額,增長率,趨勢和預測(2020-2030年)

Embedded Die Packaging Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2020-2030

出版商 Transparency Market Research 商品編碼 974866
出版日期 內容資訊 英文 178 Pages
商品交期: 最快1-2個工作天內
價格
嵌入式芯片包裝的全球市場:行業分析,市場規模,市場份額,增長率,趨勢和預測(2020-2030年) Embedded Die Packaging Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2020-2030
出版日期: 2020年10月30日內容資訊: 英文 178 Pages
簡介

該報告調查和分析了全球嵌入式芯片包裝市場,並提供了系統的信息,例如行業分析,市場規模和預測,按細分市場分析,按地區市場分析以及競爭情況。

目錄

第1章序言

第2章先決條件和調查方法

第3章執行摘要

第4章市場概述

  • 簡介
  • 市場動態
    • 生長因素
    • 抑制因素
    • 市場機會
  • 主要趨勢分析
  • 法規和政策
  • 2018-2030年全球市場分析與預測
    • 市場收入預測(100萬美元)
  • 波特的五力分析
  • 價值鏈分析
  • 市場前景

第5章,2018-2030年全球嵌入式封裝板市場分析與預測

  • 嵌入式板的概述和定義
  • 按應用程序對嵌入式軟件包的技術要求
  • 2018-2030年嵌入式封裝基板市場規模(百萬美元)預測
  • 嵌入包領導者採用的策略,創新,最新趨勢,產品詳細信息
  • 嵌入式封裝在整個封裝基板中的全球滲透(2018-2030)

第6章按平台進行的市場分析和預測

  • 概述和定義
  • 市場規模(百萬美元)預測,按平台,2018-2030
    • IC封裝板
    • 剛性PCB
    • 柔性PCB
  • 平台比較矩陣
  • 平台的市場吸引力

第7章按應用進行市場分析和預測

  • 概述和定義
  • 市場規模(百萬美元)預測,按應用分列,2018-2030
    • 智能手機,平板電腦
    • 醫用植入物,可穿戴設備
    • 工業傳感裝置
    • 工業控制裝置
    • 工業稱重裝置
    • 軍事通信和電力設備
    • 飛機
    • 安全裝置
    • 汽車模塊
    • 通信和計算設備
    • 其他(安全攝像機,訪問控制等)
  • 應用程序比較矩陣
  • 通過應用吸引市場

第8章最終用途行業的市場分析和預測

  • 概述和定義
  • 2018-2030年按最終用途行業預測的市場規模(100萬美元)
    • 家用電器
    • IT/通訊
    • 醫療
    • 航空航天/國防
    • 行業
    • 其他
  • 最終用途行業比較表
  • 最終用途行業的市場吸引力

第9章區域市場分析和預測

  • 主要發現
  • 市場規模(百萬美元)預測,按地區,2018-2030
    • 北美
    • 歐洲
    • 亞太地區
    • 中東/非洲
    • 南美洲
  • 按地區劃分的市場吸引力

第10章北美市場分析和預測

  • 主要發現
  • 主要趨勢
  • 市場規模(百萬美元)預測,按平台,2018-2030
    • IC封裝板
    • 剛性PCB
    • 柔性PCB
  • 市場規模(百萬美元)預測,按應用分列,2018-2030
    • 智能手機,平板電腦
    • 醫用植入物,可穿戴設備
    • 工業傳感裝置
    • 工業控制裝置
    • 工業稱重裝置
    • 軍事通信和電力設備
    • 飛機
    • 安全裝置
    • 汽車模塊
    • 通信和計算設備
    • 其他(安全攝像機,訪問控制等)
  • 2018-2030年按最終用途行業預測的市場規模(100萬美元)
    • 家用電器
    • IT/通訊
    • 醫療
    • 航空航天/國防
    • 行業
    • 其他
  • 2018-2030年按國家和次區域劃分的市場規模(百萬美元)預測
    • 美國
    • 加拿大
    • 北美
  • 市場吸引力分析
    • 按平台
    • 按應用
    • 最終用途行業
    • 按國家

第11章對歐洲市場的分析和預測

第12章亞太市場分析和預測

第13章中東/非洲/市場分析和預測

第14章南美市場分析和預測

第15章競爭情況

  • 市場進入競爭矩陣
  • 按公司分列的市場收入佔有率分析(%)(2019)

第16章公司概況概述(詳細信息,財務,SWOT分析,策略)

  • ASE Group
    • 概述
    • 金融
    • SWOT分析
    • 策略
  • AT&S
    • 概述
    • 金融
    • SWOT分析
    • 策略
  • 富士通
    • 概述
    • 金融
    • SWOT分析
    • 策略
  • General Electric
    • 概述
    • 金融
    • SWOT分析
    • 策略
  • Infineon Technologies
    • 概述
    • 金融
    • SWOT分析
    • 策略
  • Microsemi Corporation
    • 概述
    • 金融
    • SWOT分析
    • 策略
  • STMicroelectronics
    • 概述
    • 金融
    • SWOT分析
    • 策略
  • TDK
    • 概述
    • 金融
    • SWOT分析
    • 策略
  • Texas Instruments
    • 概述
    • 金融
    • SWOT分析
    • 策略
  • 東芝
    • 概述
    • 金融
    • SWOT分析
    • 策略

第17章摘要

目錄
Product Code: TMRGL62343

Title:
Embedded Die Packaging Market (Platform: IC Package Substrate, Rigid PCB, and Flexible PCB; Application: Smartphone & Tablets, Medical Implants and Wearable Devices, Industrial Sensing Devices, Industrial Controlling Devices, Industrial Metering Devices, Military Communication & Power Devices, Aircraft, Security Devices, Automotive Modules, Communication & Computing Devices, and Others; and End-use Industry: Consumer Electronics, IT & Telecommunication, Healthcare, Aerospace & Defense, Automotive, Industrial, and Others) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2020-2030.

Embedded Die Packaging Market - Scope of the Report

A new study on the global embedded die packaging market is published by Transparency Market Research (TMR). It presents detailed information on key market dynamics, including drivers, trends, and challenges for the global embedded die packaging market as well as its structure. TMR's study offers valuable information on the global embedded die packaging market in order to illustrate how the market is expected to expand during the forecast period i.e. 2020-2030.

Key indicators of market growth, which include value chain analysis and compound annual growth rate (CAGR), have been elucidated in TMR's study in a comprehensive manner. This data can help readers interpret the quantitative growth aspects of the global embedded die packaging market.

An extensive analysis of business strategies adopted by leading market players has also been featured in TMR's study on the global embedded die packaging market. This can help readers understand key factors responsible for growth of the global embedded die packaging market. In this study, readers can also find specific data on avenues for qualitative and quantitative growth of the global embedded die packaging market. This data would guide market players in making apt decisions in the near future.

Embedded Die Packaging Market - Segmentation

TMR's study of the global embedded die packaging market segments the market based on platform, application, end-use industry, and region. Changing market trends and other crucial market dynamics associated with segments of the global embedded die packaging market have been discussed in detail in TMR's study.

Key Questions Answered in TMR's Study on Embedded Die Packaging Market

What would be the Y-o-Y growth trend of the global embedded die packaging market between 2020 and 2030?

What is the influence of changing trends in the platform segment on the global embedded die packaging market?

Would Asia Pacific continue to be the most dominant regional market for providers of embedded die packaging over the next few years?

Which factors would hinder the global embedded die packaging market during the forecast period?

Which are the leading companies operating in the global embedded die packaging market?

Research Methodology

A unique research methodology has been utilized by TMR to conduct comprehensive research on the global embedded die packaging market and arrive at conclusions on future growth prospects for the market. This research methodology is a combination of primary and secondary research, which helps analysts warrant the accuracy and reliability of the conclusions drawn.

Secondary research sources referred to by analysts during production of the report on the global embedded die packaging market include statistics from company annual reports, SEC filings, company websites, World Bank database, investor presentations, regulatory databases, government publications, and market white papers. Analysts have also interviewed senior managers, product portfolio managers, CEOs, VPs, and market intelligence managers, who have contributed to production of TMR's study on the global embedded die packaging market as a primary research source.

These primary and secondary sources provided exclusive information during interviews, which served as a validation from leading players operating in the global embedded die packaging market. Access to an extensive internal repository as well as external proprietary databases allowed this report to address specific details and questions about the global embedded die packaging market with accuracy. The study also uses a top-down approach to assess the numbers for each segment and a bottom-up approach to counter-validate them. This has helped in making TMR's estimates on future prospects for the global embedded die packaging market more reliable and accurate.

Table of Contents

1. Preface

  • 1.1. Market Definition and Scope
  • 1.2. Market Segmentation
  • 1.3. Key Research Objectives
  • 1.4. Research Highlights

2. Assumptions and Research Methodology

3. Executive Summary: Global Embedded Die Packaging Market

4. Market Overview

  • 4.1. Introduction
  • 4.2. Market Dynamics
    • 4.2.1. Drivers
    • 4.2.2. Restraints
    • 4.2.3. Opportunities
  • 4.3. Key Trends Analysis
  • 4.4. Regulations and Policies
  • 4.5. Global Pacific Embedded Die Packaging Market Analysis and Forecast, 2018 - 2030
    • 4.5.1. Market Revenue Projections (US$ Mn)
  • 4.6. Porter's Five Forces Analysis - Global Embedded Die Packaging Market
  • 4.7. Value Chain Analysis - Global Embedded Die Packaging Market
  • 4.8. Market Outlook

5. Global Embedded Package Substrate Market Analysis and Forecast, 2018 - 2030

  • 5.1. Overview & Definitions of Embedded Substrate
  • 5.2. Technical Requirement for Embedded Package by Application
  • 5.3. Embedded Package Substrate Market Size (US$ Mn) Forecast, 2018 - 2030
  • 5.4. Key Players in Embedded Package - Strategy Adopted, Technology Innovation, Recent Developments, Product Details
  • 5.5. Penetration of Global Embedded Package in Total Packaged Substrate (2018-2030)

6. Global Embedded Die Packaging Market Analysis and Forecast, By Platform

  • 6.1. Overview & Definitions
  • 6.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030
    • 6.2.1. IC Package Substrate
    • 6.2.2. Rigid PCB
    • 6.2.3. Flexible PCB
  • 6.3. Platform Comparison Matrix
  • 6.4. Market Attractiveness By Platform

7. Global Embedded Die Packaging Market Analysis and Forecast, By Application

  • 7.1. Overview & Definition
  • 7.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030
    • 7.2.1. Smartphone & Tablets
    • 7.2.2. Medical Implants and Wearable Devices
    • 7.2.3. Industrial Sensing Devices
    • 7.2.4. Industrial Controlling Devices
    • 7.2.5. Industrial Metering Devices
    • 7.2.6. Military Communication & Power Devices
    • 7.2.7. Aircrafts
    • 7.2.8. Security Devices
    • 7.2.9. Automotive Modules
    • 7.2.10. Communication & Computing Devices
    • 7.2.11. Others (Security Cameras, Access Control, Etc.)
  • 7.3. Application Comparison Matrix
  • 7.4. Market Attractiveness By Application

8. Global Embedded Die Packaging Market Analysis and Forecast, By End-use Industry

  • 8.1. Overview & Definition
  • 8.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 - 2030
    • 8.2.1. Consumer Electronics
    • 8.2.2. IT & Telecommunication
    • 8.2.3. Healthcare
    • 8.2.4. Aerospace & Defense
    • 8.2.5. Automotive
    • 8.2.6. Industrial
    • 8.2.7. Others
  • 8.3. End-use Industry Comparison Matrix
  • 8.4. Market Attractiveness By End-use Industry

9. Global Embedded Die Packaging Market Analysis and Forecast, by Region

  • 9.1. Key Findings
  • 9.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, by Region, 2018 - 2030
    • 9.2.1. North America
    • 9.2.2. Europe
    • 9.2.3. Asia Pacific
    • 9.2.4. Middle East & Africa
    • 9.2.5. South America
  • 9.3. Market Attractiveness by Region

10. North America Embedded Die Packaging Market Analysis and Forecast

  • 10.1. Key Findings
  • 10.2. Key Trends
  • 10.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030
    • 10.3.1. IC Package Substrate
    • 10.3.2. Rigid PCB
    • 10.3.3. Flexible PCB
  • 10.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030
    • 10.4.1. Smartphone & Tablets
    • 10.4.2. Medical Implants and Wearable Devices
    • 10.4.3. Industrial Sensing Devices
    • 10.4.4. Industrial Controlling Devices
    • 10.4.5. Industrial Metering Devices
    • 10.4.6. Military Communication & Power Devices
    • 10.4.7. Aircrafts
    • 10.4.8. Security Devices
    • 10.4.9. Automotive Modules
    • 10.4.10. Communication & Computing Devices
    • 10.4.11. Others (Security Cameras, Access Control, Etc.)
  • 10.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 - 2030
    • 10.5.1. Consumer Electronics
    • 10.5.2. IT & Telecommunication
    • 10.5.3. Healthcare
    • 10.5.4. Aerospace & Defense
    • 10.5.5. Automotive
    • 10.5.6. Industrial
    • 10.5.7. Others
  • 10.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 - 2030
    • 10.6.1. U.S.
    • 10.6.2. Canada
    • 10.6.3. Rest of North America
  • 10.7. Market Attractiveness Analysis
    • 10.7.1. By Platform
    • 10.7.2. By Application
    • 10.7.3. By End-use Industry
    • 10.7.4. By Country

11. Europe Embedded Die Packaging Market Analysis and Forecast

  • 11.1. Key Findings
  • 11.2. Key Trends
  • 11.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030
    • 11.3.1. IC Package Substrate
    • 11.3.2. Rigid PCB
    • 11.3.3. Flexible PCB
  • 11.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030
    • 11.4.1. Smartphone & Tablets
    • 11.4.2. Medical Implants and Wearable Devices
    • 11.4.3. Industrial Sensing Devices
    • 11.4.4. Industrial Controlling Devices
    • 11.4.5. Industrial Metering Devices
    • 11.4.6. Military Communication & Power Devices
    • 11.4.7. Aircrafts
    • 11.4.8. Security Devices
    • 11.4.9. Automotive Modules
    • 11.4.10. Communication & Computing Devices
    • 11.4.11. Others (Security Cameras, Access Control, Etc.)
  • 11.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 - 2030
    • 11.5.1. Consumer Electronics
    • 11.5.2. IT & Telecommunication
    • 11.5.3. Healthcare
    • 11.5.4. Aerospace & Defense
    • 11.5.5. Automotive
    • 11.5.6. Industrial
    • 11.5.7. Others
  • 11.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 - 2030
    • 11.6.1. Germany
    • 11.6.2. U.K.
    • 11.6.3. France
    • 11.6.4. Rest of Europe
  • 11.7. Market Attractiveness Analysis
    • 11.7.1. By Platform
    • 11.7.2. By End-use Industry
    • 11.7.3. By Application
    • 11.7.4. By Country

12. Asia Pacific Embedded Die Packaging Market Analysis and Forecast

  • 12.1. Key Findings
  • 12.2. Key Trends
  • 12.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030
    • 12.3.1. IC Package Substrate
    • 12.3.2. Rigid PCB
    • 12.3.3. Flexible PCB
  • 12.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030
    • 12.4.1. Smartphone & Tablets
    • 12.4.2. Medical Implants and Wearable Devices
    • 12.4.3. Industrial Sensing Devices
    • 12.4.4. Industrial Controlling Devices
    • 12.4.5. Industrial Metering Devices
    • 12.4.6. Military Communication & Power Devices
    • 12.4.7. Aircrafts
    • 12.4.8. Security Devices
    • 12.4.9. Automotive Modules
    • 12.4.10. Communication & Computing Devices
    • 12.4.11. Others (Security Cameras, Access Control, Etc.)
  • 12.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 - 2030
    • 12.5.1. Consumer Electronics
    • 12.5.2. IT & Telecommunication
    • 12.5.3. Healthcare
    • 12.5.4. Aerospace & Defense
    • 12.5.5. Automotive
    • 12.5.6. Industrial
    • 12.5.7. Others
  • 12.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 - 2030
    • 12.6.1. China
    • 12.6.2. Japan
    • 12.6.3. India
    • 12.6.4. Australia
    • 12.6.5. Rest of Asia Pacific
  • 12.7. Market Attractiveness Analysis
    • 12.7.1. By Platform
    • 12.7.2. By Application
    • 12.7.3. By End-use Industry
    • 12.7.4. By Country

13. Middle East & Africa Embedded Die Packaging Market Analysis and Forecast

  • 13.1. Key Findings
  • 13.2. Key Trends
  • 13.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030
    • 13.3.1. IC Package Substrate
    • 13.3.2. Rigid PCB
    • 13.3.3. Flexible PCB
  • 13.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030
    • 13.4.1. Smartphone & Tablets
    • 13.4.2. Medical Implants and Wearable Devices
    • 13.4.3. Industrial Sensing Devices
    • 13.4.4. Industrial Controlling Devices
    • 13.4.5. Industrial Metering Devices
    • 13.4.6. Military Communication & Power Devices
    • 13.4.7. Aircrafts
    • 13.4.8. Security Devices
    • 13.4.9. Automotive Modules
    • 13.4.10. Communication & Computing Devices
    • 13.4.11. Others (Security Cameras, Access Control, Etc.)
  • 13.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 - 2030
    • 13.5.1. Consumer Electronics
    • 13.5.2. IT & Telecommunication
    • 13.5.3. Healthcare
    • 13.5.4. Aerospace & Defense
    • 13.5.5. Automotive
    • 13.5.6. Industrial
    • 13.5.7. Others
  • 13.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 - 2030
    • 13.6.1. GCC
    • 13.6.2. South Africa
    • 13.6.3. Rest of Middle East & Africa
  • 13.7. Market Attractiveness Analysis
    • 13.7.1. By Platform
    • 13.7.2. By Application
    • 13.7.3. By End-use Industry
    • 13.7.4. By Country

14. South America Embedded Die Packaging Market Analysis and Forecast

  • 14.1. Key Findings
  • 14.2. Key Trends
  • 14.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030
    • 14.3.1. IC Package Substrate
    • 14.3.2. Rigid PCB
    • 14.3.3. Flexible PCB
  • 14.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030
    • 14.4.1. Smartphone & Tablets
    • 14.4.2. Medical Implants and Wearable Devices
    • 14.4.3. Industrial Sensing Devices
    • 14.4.4. Industrial Controlling Devices
    • 14.4.5. Industrial Metering Devices
    • 14.4.6. Military Communication & Power Devices
    • 14.4.7. Aircrafts
    • 14.4.8. Security Devices
    • 14.4.9. Automotive Modules
    • 14.4.10. Communication & Computing Devices
    • 14.4.11. Others (Security Cameras, Access Control, Etc.)
  • 14.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 - 2030
    • 14.5.1. Consumer Electronics
    • 14.5.2. IT & Telecommunication
    • 14.5.3. Healthcare
    • 14.5.4. Aerospace & Defense
    • 14.5.5. Automotive
    • 14.5.6. Industrial
    • 14.5.7. Others
  • 14.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 - 2030
    • 14.6.1. GCC
    • 14.6.2. South Africa
    • 14.6.3. Rest of Middle East & Africa
  • 14.7. Market Attractiveness Analysis
    • 14.7.1. By Platform
    • 14.7.2. By Application
    • 14.7.3. By End-use Industry
    • 14.7.4. By Country

15. Competition Landscape

  • 15.1. Market Player - Competition Matrix
  • 15.2. Market Revenue Share Analysis (%), By Company (2019)

16. Company Profiles (Details - Overview, Financials, SWOT Analysis, Strategy)

  • 16.1. ASE Group
    • 16.1.1. Overview
    • 16.1.2. Financials
    • 16.1.3. SWOT Analysis
    • 16.1.4. Strategy
  • 16.2. AT&S
    • 16.2.1. Overview
    • 16.2.2. Financials
    • 16.2.3. SWOT Analysis
    • 16.2.4. Strategy
  • 16.3. Fujitsu Limited
    • 16.3.1. Overview
    • 16.3.2. Financials
    • 16.3.3. SWOT Analysis
    • 16.3.4. Strategy
  • 16.4. General Electric
    • 16.4.1. Overview
    • 16.4.2. Financials
    • 16.4.3. SWOT Analysis
    • 16.4.4. Strategy
  • 16.5. Infineon Technologies
    • 16.5.1. Overview
    • 16.5.2. Financials
    • 16.5.3. SWOT Analysis
    • 16.5.4. Strategy
  • 16.6. Microsemi Corporation
    • 16.6.1. Overview
    • 16.6.2. Financials
    • 16.6.3. SWOT Analysis
    • 16.6.4. Strategy
  • 16.7. STMicroelectronics
    • 16.7.1. Overview
    • 16.7.2. Financials
    • 16.7.3. SWOT Analysis
    • 16.7.4. Strategy
  • 16.8. TDK Corporation
    • 16.8.1. Overview
    • 16.8.2. Financials
    • 16.8.3. SWOT Analysis
    • 16.8.4. Strategy
  • 16.9. Texas Instruments
    • 16.9.1. Overview
    • 16.9.2. Financials
    • 16.9.3. SWOT Analysis
    • 16.9.4. Strategy
  • 16.10. Toshiba Corporation
    • 16.10.1. Overview
    • 16.10.2. Financials
    • 16.10.3. SWOT Analysis
    • 16.10.4. Strategy

17. Key Takeaways

List of Tables

  • Table 01: Global Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018-2030
  • Table 02: Global Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018-2030
  • Table 03: Global Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018-2030
  • Table 04: Global Embedded Die Packaging Market Revenue (US$ Mn), by Region, 2018-2030
  • Table 05: North America Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018-2030
  • Table 06: North America Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018-2030
  • Table 07: North America Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018-2030
  • Table 08: North America Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018-2030
  • Table 09: Europe Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018-2030
  • Table 10: Europe Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018-2030
  • Table 11: Europe Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018-2030
  • Table 12: Europe Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018-2030
  • Table 13: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018-2030
  • Table 14: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018-2030
  • Table 15: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018-2030
  • Table 16: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018-2030
  • Table 17: Middle East & Africa (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018-2030
  • Table 18: Middle East & Africa (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018-2030
  • Table 19: Middle East & Africa (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018-2030
  • Table 20: Middle East & Africa (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018-2030
  • Table 21: South America Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018-2030
  • Table 22: South America Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018-2030
  • Table 23: South America Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018-2030
  • Table 24: South America Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018-2030

List of Figures

  • Figure 01: Global Embedded Die Packaging Market Revenue (US$ Mn) Forecast, 2018-2030
  • Figure 02: Global Embedded Die Packaging Market Revenue (US$ Mn) and Y-o-Y Forecast, 2018 - 2030
  • Figure 03: Embedded Package Substrate Market Size (US$ Mn) Forecast, 2018 - 2030
  • Figure 04: Global Embedded Die Packaging Market, by IC Package Substrate
  • Figure 05: Global Embedded Die Packaging Market, by Rigid PCB
  • Figure 06: Global Embedded Die Packaging Market, by Flexible PCB
  • Figure 07: Global Embedded Die Packaging Market Comparison Matrix, by Platform
  • Figure 08: Global Embedded Die Packaging Market Attractiveness Analysis, by Platform
  • Figure 09: Global Embedded Die Packaging Market, by Smartphone & Tablets
  • Figure 10: Global Embedded Die Packaging Market, by Medical Implants and Wearable Devices
  • Figure 11: Global Embedded Die Packaging Market, by Industrial Sensing Devices
  • Figure 12: Global Embedded Die Packaging Market, by Industrial Controlling Devices
  • Figure 13: Global Embedded Die Packaging Market, by Industrial Metering Devices
  • Figure 14: Global Embedded Die Packaging Market, by Military Communication & Power Devices
  • Figure 15: Global Embedded Die Packaging Market, by Aircrafts
  • Figure 16: Global Embedded Die Packaging Market, by Security Devices
  • Figure 17: Global Embedded Die Packaging Market, by Automotive Modules
  • Figure 18: Global Embedded Die Packaging Market, by Communication & Computing Devices
  • Figure 19: Global Embedded Die Packaging Market, by Others (Security Cameras, Access Control, Etc.)
  • Figure 20: Global Embedded Die Packaging Market Comparison Matrix, by Application
  • Figure 21: Global Embedded Die Packaging Market Attractiveness Analysis, by Application
  • Figure 22: Global Embedded Die Packaging Market, by Consumer Electronics
  • Figure 23: Global Embedded Die Packaging Market, by IT & Telecommunication
  • Figure 24: Global Embedded Die Packaging Market, by Healthcare
  • Figure 25: Global Embedded Die Packaging Market, by Aerospace & Defense
  • Figure 26: Global Embedded Die Packaging Market, by Automotive
  • Figure 27: Global Embedded Die Packaging Market, by Industrial
  • Figure 28: Global Embedded Die Packaging Market, by Others
  • Figure 29: Global Embedded Die Packaging Market Comparison Matrix, by End-use Industry
  • Figure 30: Global Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry
  • Figure 31: Global Embedded Die Packaging Market Value Share Analysis, by Region (2020E)
  • Figure 32: Global Embedded Die Packaging Market Value Share Analysis, by Region (2030F)
  • Figure 33: Global Embedded Die Packaging Market Attractiveness Analysis, by Region
  • Figure 34: North America Embedded Die Packaging Market Size (US$ Mn), 2018 - 2030
  • Figure 35: North America Embedded Die Packaging Market Value Share Analysis, by Platform (2020)
  • Figure 36: North America Embedded Die Packaging Market Value Share Analysis, by Platform (2030)
  • Figure 37: North America Embedded Die Packaging Market Value Share Analysis, by Application (2020)
  • Figure 38: North America Embedded Die Packaging Market Value Share Analysis, by Application (2030)
  • Figure 39: North America Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2020)
  • Figure 40: North America Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2030)
  • Figure 41: North America Embedded Die Packaging Market Value Share Analysis, by Country (2020)
  • Figure 42: North America Embedded Die Packaging Market Value Share Analysis, by Country (2030)
  • Figure 43: North America Embedded Die Packaging Market Attractiveness Analysis, by Platform
  • Figure 44: North America Embedded Die Packaging Market Attractiveness Analysis, by Application
  • Figure 45: North America Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry
  • Figure 46: North America Embedded Die Packaging Market Attractiveness Analysis, by Country
  • Figure 47: Europe Embedded Die Packaging Market Size (US$ Mn), 2018 - 2030
  • Figure 48: Europe Embedded Die Packaging Market Value Share Analysis, by Platform (2020)
  • Figure 49: Europe Embedded Die Packaging Market Value Share Analysis, by Platform (2030)
  • Figure 50: Europe Embedded Die Packaging Market Value Share Analysis, by Application (2020)
  • Figure 51: Europe Embedded Die Packaging Market Value Share Analysis, by Application (2030)
  • Figure 52: Europe Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2020)
  • Figure 53: Europe Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2030)
  • Figure 54: Europe Embedded Die Packaging Market Value Share Analysis, by Country (2020)
  • Figure 55: Europe Embedded Die Packaging Market Value Share Analysis, by Country (2030)
  • Figure 56: Europe Embedded Die Packaging Market Attractiveness Analysis, by Platform
  • Figure 57: Europe Embedded Die Packaging Market Attractiveness Analysis, by Application
  • Figure 58: Europe Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry
  • Figure 59: Europe Embedded Die Packaging Market Attractiveness Analysis, by Country
  • Figure 60: Asia Pacific Embedded Die Packaging Market Size (US$ Mn), 2018 - 2030
  • Figure 61: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Platform (2020)
  • Figure 62: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Platform (2030)
  • Figure 63: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Application (2020)
  • Figure 64: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Application (2030)
  • Figure 65: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2020)
  • Figure 66: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2030)
  • Figure 67: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Country (2020)
  • Figure 68: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Country (2030)
  • Figure 69: Asia Pacific Embedded Die Packaging Market Attractiveness Analysis, by Platform
  • Figure 70: Asia Pacific Embedded Die Packaging Market Attractiveness Analysis, by Application
  • Figure 71: Asia Pacific Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry
  • Figure 72: Asia Pacific Embedded Die Packaging Market Attractiveness Analysis, by Country
  • Figure 73: Middle East & Africa (MEA) Embedded Die Packaging Market Size (US$ Mn), 2018 - 2030
  • Figure 74: Middle East & Africa (MEA) Embedded Die Packaging Market Value Share Analysis, by Platform (2020)
  • Figure 75: Middle East & Africa (MEA) Embedded Die Packaging Market Value Share Analysis, by Platform (2030)
  • Figure 76: Middle East & Africa (MEA) Embedded Die Packaging Market Value Share Analysis, by Application (2020)
  • Figure 77: Middle East & Africa (MEA) Embedded Die Packaging Market Value Share Analysis, by Application (2030)
  • Figure 78: Middle East & Africa (MEA) Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2020)
  • Figure 79: Middle East & Africa (MEA) Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2030)
  • Figure 80: Middle East & Africa (MEA) Embedded Die Packaging Market Value Share Analysis, by Country (2020)
  • Figure 81: Middle East & Africa (MEA) Embedded Die Packaging Market Value Share Analysis, by Country (2030)
  • Figure 82: Middle East & Africa (MEA) Embedded Die Packaging Market Attractiveness Analysis, by Platform
  • Figure 83: Middle East & Africa (MEA) Embedded Die Packaging Market Attractiveness Analysis, by Application
  • Figure 84: Middle East & Africa (MEA) Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry
  • Figure 85: Middle East & Africa (MEA) Embedded Die Packaging Market Attractiveness Analysis, by Country
  • Figure 86: South America Embedded Die Packaging Market Size (US$ Mn), 2018 - 2030
  • Figure 87: South America Embedded Die Packaging Market Value Share Analysis, by Platform (2020)
  • Figure 88: South America Embedded Die Packaging Market Value Share Analysis, by Platform (2030)
  • Figure 89: South America Embedded Die Packaging Market Value Share Analysis, by Application (2020)
  • Figure 90: South America Embedded Die Packaging Market Value Share Analysis, by Application (2030)
  • Figure 91: South America Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2020)
  • Figure 92: South America Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2030)
  • Figure 93: South America Embedded Die Packaging Market Value Share Analysis, by Country (2020)
  • Figure 94: South America Embedded Die Packaging Market Value Share Analysis, by Country (2030)
  • Figure 95: South America Embedded Die Packaging Market Attractiveness Analysis, by Platform
  • Figure 96: South America Embedded Die Packaging Market Attractiveness Analysis, by Application
  • Figure 97: South America Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry
  • Figure 98: South America Embedded Die Packaging Market Attractiveness Analysis, by Country
  • Figure 99: Global Embedded Die Packaging Market Share Analysis, by Company