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市場調查報告書

3D積體電路 (3D IC):未來市場機會

Future Opportunites for 3D Integrated Circuits

出版商 Frost & Sullivan 商品編碼 410405
出版日期 內容資訊 英文 68 Pages
商品交期: 最快1-2個工作天內
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3D積體電路 (3D IC):未來市場機會 Future Opportunites for 3D Integrated Circuits
出版日期: 2016年12月27日 內容資訊: 英文 68 Pages
簡介

本報告提供3D積體電路 (3D IC) 技術的未來展望調查,3D IC概要,技術的成長推動因素、阻礙要素分析,3D集積的各種實行技術概要,專利、資金籌措相關分析,直通矽晶穿孔 (TSV) 技術趨勢,3D IC的產品及用途,技術藍圖,成長機會分析等彙整資料。

第1章 摘要整理

第2章 技術、市場環境

  • 3D IC:簡介
  • 主要市場成長推動
  • 主要的市場成長的阻礙要素
  • 技術性推動因素、課題等

第3章 3D IC的技術概要

  • 3D IC封裝技術可垂直整合
  • 3D單片集積
  • 3D集積:晶粒的單一化
  • 3D集積:堆疊
  • 3D集積:綁定技術
  • 3D集積:TSV
  • 3D集積:晶圓類型

第4章 專利、資金籌措分析

  • 亞太地區、北美地區:積極著重3D IC技術的R&D
  • 對TSV的研究:全球的著重的主題
  • 技術、市場領導者與資金籌措趨勢

第5章 TSV互連技術的3D集積

  • TSV技術概要
  • TSV的3D IC:3D集積技術的下個領域
  • 核心TSV互連加工技術的互連鑽孔、晶圓薄化&堆疊
  • 主要革新簡介:Allvia Inc.
  • 主要革新簡介:Amkor Technologies
  • 主要革新簡介:Novati Technologies
  • 主要革新簡介:Aveni
  • 主要革新簡介:STATS ChipPAC
  • 主要企業

第6章 3D IC產品及用途狀況

  • 記憶體、MEMS系統、影像感測器:主要產品
  • CE產品、ICT、航太:主要的引進區域
  • 產品、用途影響矩陣

第7章 策略性分析

  • 集積技術發展藍圖
  • 成長機會
  • 策略性規劃的主要課題

第8章 主要專利

第9章 主要聯繫處

第10章 關於FROST & SULLIVAN

目錄
Product Code: D77D

3D Stacked Memory and 3D MEMS Driving Opportunities in Consumer Electronics and Communication Markets

3D Integrated Circuit technology enables the development of high performing microchips with small form factor and low-power consumption capability. With the growing demand for miniaturization in industries like consumer electronics and information and communication technology, 3D ICs are actively being considered as the ideal solution. The key requirements of modern day electronic devices are enhanced storage capability, low power requirements, efficient thermal management components, high-speed data transmission, high-speed data processing, high brightness lighting, connected and smart devices. These requirements from the consumer end of the supply chain are the key driving forces behind growth in 3D IC technology and its inherent market.

A notable feature of the 3D IC market ecosystem is that the vendor side of the supply chain is highly fragmented. This is mainly because of the numerous options available for 3D Integration. Also, the business models adopted by 3D IC fabrication companies are constantly evolving. The core technology is constantly being updated to the next-generation technology, foundries transitioning to end-to-end product developers, fabless designers venturing into software-based 3D designing and so on.

This technology and innovation report highlights through silicon vias (TSV) as the key technology in 3D IC technology. The report discusses the market and technological drivers and restraints for the 3D IC market and identifies the various technologies enabling 3D integration. TSV interconnect technology is analyzed exhaustively by evaluating key participants and their strategies in the TSV-enabled 3D integration sector. An Integrated Technology Roadmap (ITR) is developed by tracking the developments in the 3D integration technology. The ITR outlines the various industries that has been and is expected to witness moderate to high impact of these innovative products presently and in the in future. The growth opportunities for 3D IC are exhaustively analyzed through the ITR lens.

Table of Contents

1.0. EXECUTIVE SUMMARY

  • 1.1. Research Scope
  • 1.2. Research Methodology
  • 1.3. Research Methodology Explained
  • 1.4. 3D Integration Technology Categorization
  • 1.5. Key Findings - Significance, R&D Focus Areas, and Applications
  • 1.6. Key Findings - Global Challenges and Scenario, Industry Initiatives

2.0. TECHNOLOGICAL AND MARKET LANDSCAPE

  • 2.1. Three-dimensional Integrated Circuits - An Introduction
  • 2.2. High Bargaining Power of Suppliers and Threat of New Entrants Impacting Attractiveness of 3D IC Industry
  • 2.3. Continuing Demand for Smartphones and Expected Increase in Cost Currently Driving Opportunities in 3D ICs
  • 2.4. Key Drivers Explained
  • 2.5. High Cost and Technological and Process Challenges Currently Limiting Opportunities for 3D ICs
  • 2.6. Key Market Restraints Explained
  • 2.7. Technological Drivers and Challenges
  • 2.8. Technological Drivers
  • 2.9. Technological Challenges

3.0. TECHNOLOGY SNAPSHOT OF 3D INTEGRATED CIRCUITS

  • 3.1. 3D IC Packaging Techniques Enable Vertical Integration
  • 3.2. 3D Monolithic Integration
  • 3.3. 3D Integration - Die Singulation
  • 3.4. 3D Integration - Stacking Orientation
  • 3.5. 3D Integration - Bonding Technique
  • 3.6. 3D Integration - Through Silicon Vias
  • 3.7. 3D Integration - Wafer Type

4.0. PATENT AND FUNDING ANALYSIS

  • 4.1. APAC and NA Actively Focusing on R&D in 3D Integration Technology
  • 4.2. Research on Through Silicon Via is Actively Pursued Across the Globe
  • 4.3. Pursuit of Technological and Market Leadership Outlines Funding Trends

5.0. 3D INTEGRATION WITH TSV INTERCONNECT TECHNOLOGY

  • 5.1. Introduction to TSV Technology
  • 5.2. 3D IC Enabled with TSV is the Next Frontier in 3D Integration Technology
  • 5.3. Interconnect Drilling, Wafer Thinning and Stacking form Core TSV Interconnect Process Technology
  • 5.4. Key Innovation Profile - Allvia Inc.
  • 5.5. Key Innovation Profile - Amkor Technologies
  • 5.6. Key Innovation Profile - Novati Technologies
  • 5.7. Key Innovation Profile - Aveni
  • 5.8. Key Innovation Profile - STATS ChipPAC
  • 5.9. Key Players in 3D IC Industry

6.0. 3D IC PRODUCT AND APPLICATION LANDSCAPE

  • 6.1. Memory, Microelectromechanical Systems, and Image Sensors are Key Products Enabled with 3D IC
  • 6.2. Consumer Electronics, ICT, and Aerospace are Major Application Areas of 3D IC
  • 6.3. Product - Application Impact Matrix
  • 6.4. Impact of Products on Application Areas Explained

7.0. STRATEGIC INSIGHTS ON 3D ICINDUSTRY

  • 7.1. Integrated Technology Roadmap
  • 7.2. Integrated Technology Roadmap Explained - 3D Integration Enabled Products Driving Futuristic Innovations in Major industries
  • 7.3. Growth Opportunities
  • 7.4. Key Questions for Strategic Planning

8.0. KEY PATENTS

  • 8.1. Key Patents
  • 8.1. Key Patents (continued)

9.0. KEY INDUSTRY CONTACTS

  • 9.1. Industry Contacts
  • Legal Disclaimer

10.0. THE FROST & SULLIVAN STORY

  • 10.1. The Frost & Sullivan Story
  • 10.2. Value Proposition: Future of Your Company & Career
  • 10.3. Global Perspective
  • 10.4. Industry Convergence
  • 10.5. 360° Research Perspective
  • 10.6. Implementation Excellence
  • 10.7. Our Blue Ocean Strategy
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