市場調查報告書

軟性電子產品用材料的革新

Innovations in Materials for Flexible Electronics (TechVision)

出版商 Frost & Sullivan 商品編碼 375812
出版日期 內容資訊 英文 67 Pages
商品交期: 最快1-2個工作天內
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軟性電子產品用材料的革新 Innovations in Materials for Flexible Electronics (TechVision)
出版日期: 2016年09月30日內容資訊: 英文 67 Pages
簡介

本報告提供影響軟性電子產品產業,現有及新興基板材料的相關分析,各基板材料的考察,主要相關利益者的倡議,影響軟性電子產品產業的基板材料的評估,技術開發情形,及未來技術趨勢分析等。

第1章 摘要整理

第2章 技術概述

  • 軟性電子產品概要
  • 軟性電子產品的應用區分
  • 軟式電路板:技術概要
  • 對軟式電路板材料的終端用戶必要條件
  • 現在所使用的基板材料:聚合物基板廣泛使用,其次是金屬基板

第3章 軟性電子產品基板所使用的材料

  • 玻璃基板:技術概要
  • 玻璃基板:主要的革新
  • 金屬基板:技術概要
  • 金屬基板:主要的革新
  • 聚合物基板:技術概要
  • 聚合物基板概要
  • 聚合物基板:主要的革新
  • 終端用戶差距分析
  • 新的基板材料
  • 新的材料:主要的革新

第4章 產業概要

  • 技術促進要素
  • 技術抑制因素
  • 技術價值鏈
  • 主要的技術相關利益者
  • 近幾年的R&D倡議

第5章 技術開發、IP趨勢

  • 全球技術開發可能性
  • 全球技術引進可能性
  • 專利趨勢:各國圖表
  • 專利趨勢:全基板材料到目前為止的圖表
  • 專利趨勢:聚合物基板材料到目前為止的圖表

第6章 軟性電子產品材料的技術基準

  • 軟式電路板材料的機會策略評估 (OSE)
  • OSE電網的考察:材料開發者的機會擴大

第7章 技術藍圖

  • 技術藍圖 - 未來趨勢的評估:技術開發情形
  • 技術藍圖 - 說明:高性能PI基板及生物適合性基板為主要的革新

第8章 主要專利

  • 主要的專利:USPTO
  • 主要的專利:EPO
  • 主要的專利:WIPO

第9章 主要的契約

第10章 附錄

第11章 關於Frost&Sullivan

目錄
Product Code: D6DE

Analysis of Current and Emerging Materials Used for Flexible Electronic Substrates

Flexible electronics are highly popular owing to their high usage convenience, novel display attributes, high reliability, and lightweight. These devices find high potential for adoption in a range of high-end application sectors, which includes consumer electronics, automotive, healthcare, energy, defense, and textiles. However, flexible electronics need to address several key challenges in their performance before they can satisfy high mass volume demand. Flexible substrate materials used for the development of flex circuits have been identified as key enabling components that determine the performance of flexible electronics. Flexible substrate materials that provide high device efficiency, optimal production costs, superior display attributes, and long lifetime need to be developed and further enhanced to pave the path for next-generation flexible electronics. This research study provides an analysis of the existing and emerging substrate materials that influence the flexible electronics industry. This includes glass, metal, polymers, paper, stretchable, and hybrid substrates to name the key ones. The research service also provides insights into each substrate materials and highlights the key stakeholder initiatives, while assessing the substrate material impact on the flexible electronics industry. The technology development scenario in the form of a technology roadmap maps the future direction expected from each flexible substrate material.

Table of Contents

1.0. EXECUTIVE SUMMARY

  • 1.1. Research Scope
  • 1.2. Research Process and Methodology
  • 1.3. Key Findings: Low-cost and Highly Optically Transparent Substrates Will Lead Adoption in Future

2.0. TECHNOLOGY SNAPSHOT

  • 2.1. Flexible Electronics - An Overview: An Emerging Product Concept Designed to Meet Consumer Demand for Novel Properties in Devices
  • 2.2. Flexible Electronics - Application Segmentation: High Promise in the Consumer Electronics Sector
  • 2.3. Flexible Substrates-Technology Snapshot: Enabling Technologies that Determine the Performance of Flexible Electronics
  • 2.4. End User Requirements for Flexible Substrate Materials: Need for Stable Substrates that Facilitate High Performance of Devices
  • 2.5. Currently Used Substrate Materials: Polymer Substrates Are Widely Adopted Followed by Metal Substrates

3.0. MATERIALS USED FOR FLEXIBLE ELECTRONIC SUBSTRATES

  • 3.1. Glass Substrates - Technology Snapshot: Highly Stable but Unsuitable for Mass Processing
  • 3.2. Glass Substrates - Key Innovations: Large Volume Production of Ultrathin Glass
  • 3.3. Metal Substrates-Technology Snapshot: High Impermeability and Lightweight Attributes
  • 3.4. Metal Substrates - Key Innovations: Developments Include Flexible Solar Cells and OLEDs
  • 3.5. Polymer Substrates - Technology Snapshot: Low Cost and Variations in Performance Properties
  • 3.6. Overview of Polymer Substrates: PET and PEN Are the Most Widely Used Polymer Materials
  • 3.7. Overview of Polymer Substrates: PI is Showing Promise in Adoption for Flexible Substrates
  • 3.8. Overview of Polymer Substrates: PC Films Are Used in High Durability Applications
  • 3.9. Polymer Substrates - Key Innovations: Applications Focused on Organic Electronics
  • 3.10. End-user Gap Analysis: Unmet End-user Requirements Creates Demand for Novel Substrate Materials
  • 3.11. Emerging Substrate Materials: Biocompatible and Stretchable Substrate Materials Are Being Developed
  • 3.12. Emerging Materials - Key Innovations: Low-cost Substrate Materials with High Optical Performance

4.0. INDUSTRY OVERVIEW

  • 4.1. Technology Drivers: Superior Printability and Lightweight Properties Drive Adoption
  • 4.2. Technology Restraints: High Competition from Rigid Substrates and Lack of Materials That Provide Long Operation Lifetime Hinders Adoption
  • 4.3. Technology Value Chain: Highly Integrated Industry with Increasing Contribution from Coating Developers
  • 4.4. Key Technology Stakeholders: Technology Developers Are Spread across North America, Europe, and Asia-Pacific
  • 4.5. Recent R&D Initiatives: Government Funding Contributes Significantly to Technology Development

5.0. TECHNOLOGY DEVELOPMENT AND IP TRENDS

  • 5.1. Global Technology Development Potential: North America Leads in Technology Development
  • 5.2. Global Technology Adoption Potential: Mass Volume Production Methods Facilitate High Adoption in North America
  • 5.3. Patent Trends - Country-wise Charts: US Leads Number of Granted Patents
  • 5.4. Patent Trends - Historical Charts for All Substrate Materials: Main Focus Among Granted Patents Is on Polymer Substrates
  • 5.5. Patent Trends - Historical Charts for Polymer Substrate Materials: Highest Innovations on PET Substrates, Followed by PI

6.0. TECHNOLOGY BENCHMARKING OF MATERIALS FOR FLEXIBLE ELECTRONICS

  • 6.1. Opportunity Strategy Evaluation (OSE) of Flexible Substrate Materials
  • 6.2. Insights from the OSE Grid: Increasing Opportunities for Material Developers

7.0. TECHNOLOGY ROADMAP

  • 7.1. Technology Roadmap - Assessment of Future Trends: Technology Development Scenario 2016-2020
  • 7.2. Technology Roadmap - Explanation: High Performance PI Substrates and Biocompatible Substrates Are Key Innovations Expected in 2020

8.0. KEY PATENTS

  • 8.1. Key Patents - USPTO
  • 8.2. Key Patents - EPO
  • 8.3. Key Patents - WIPO

9.0. KEY CONTACTS

  • 9.1. Key Contacts

10.0. APPENDIX

  • 10.1. Appendix A - OSE Grid: Definition of Criteria Used for Evaluation
  • 10.2. Appendix A - OSE Grid: Explanation of Quadrant Placement in the Matrix
  • 10.3. Appendix A - OSE Grid: Criteria-based Evaluation of Currently Used Substrate Materials
  • 10.4. Appendix A - OSE Grid: Criteria-based Evaluation of Emerging Substrate Materials
  • Legal Disclaimer

11.0. THE FROST & SULLIVAN STORY

  • 11.1. The Frost & Sullivan Story
  • 11.2. Value Proposition: Future of Your Company and Career
  • 11.3. Global Perspective
  • 11.4. Industry Convergence
  • 11.5. 360° Research Perspective
  • 11.6. Implementation Excellence
  • 11.7. Our Blue Ocean Strategy
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