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LEDinside:Micro LED新一代顯示器(2019年) :主要技術報告

LEDinside: 2019 Micro LED Next Generation Display Key Technology Report

出版商 TrendForce 商品編碼 752366
出版日期 內容資訊 英文
商品交期: 最快1-2個工作天內
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LEDinside:Micro LED新一代顯示器(2019年) :主要技術報告 LEDinside: 2019 Micro LED Next Generation Display Key Technology Report
出版日期: 2019年01月31日內容資訊: 英文
簡介

本報告調查了全球Micro LED市場,並統整了市場及產品概要、市場發展變化、市場規模變化與預測應用產品與開發趨勢、專利趨勢、主要技術區分別的瓶頸及問題分析、主要企業的技術開發趨勢等。

第1章 Micro LED:定義、市場規模

  • 產品定義
  • 市場規模分析、預測
  • 出貨數分析
  • 普及率分析

第2章 Micro LED應用產品、開發趨勢

  • Micro LED產品概要
  • 頭戴式裝置
  • 穿戴式裝置
  • 手環式裝置
  • IT裝置
  • IT顯示器
  • 汽車顯示器
  • TV
  • LED顯示器

第3章 Micro LED專利分析

第4章 Micro LED技術瓶頸與解決方案

  • 技術概要
  • 製造流程
  • LED分子束磊晶、晶片製造流程
  • 轉移技術/邦定技術/驅動、背板技術

第5章 分子束磊晶技術:瓶頸與挑戰

  • 解決方案
  • 磊晶晶圓結構、發光原理
  • 分子束磊晶發光層材料、視感效果度
  • leak問題
  • 機器技術分類
  • 機器技術比較
  • 磊晶晶圓:主要技術分類
  • 適用分析等

第6章 晶片製造流程技術:瓶頸、課題分析

  • LED晶片小型化
  • LED晶片製造流程
  • 橫向晶片、覆晶技術、垂直晶片在結構上的差異
  • 小型LED晶片(包含藍寶石基板)Craving技術
  • 小型LED晶片(不包含藍寶石基板)Craving技術
  • 雷射剝蝕
  • 結構性脆弱與絕緣層
  • Transfer Head的設計
  • 傳統型LED與Micro LED晶片生產過程的差異

第7章 Mass Transfer技術:瓶頸、課題分析

  • Mass Transfer技術分類
  • 薄膜Mass Transfer技術分類
  • Pick and Place技術
  • 對UPH的影響因素
  • Apple (LuxVue)
  • Samsung
  • X:Celeprint
  • ITRI
  • MikroMesa
  • AUO
  • VueReal
  • Rohinni
  • eLux
  • PlayNitride
  • 索尼
  • QMAT
  • Uniqarta
  • OPTOVATE
  • KIMM
  • Micro LED與Mass Transfer技術的7種主要課題
  • 適用分析等

第8章 檢查技術:瓶頸、課題分析

  • Micro LED技術瓶頸&解決方案:概要 - 檢查技術
  • PL檢查技術
  • 數位相機光電檢查
  • 接觸型光電檢查
  • 非接觸型光電檢查技術
  • 非接觸EL檢查技術
  • 紫外線照射型光電檢查
  • 各種技術比較等

第9章 修復技術:瓶頸、課題分析

  • Micro LED技術瓶頸&解決方案:概要 - 修復技術
  • 紫外線照射
  • 雷射焊接
  • 選擇性Pick
  • 選擇性雷射
  • Back up電路設計解決方案等

第10章 全彩技術解決方案:瓶頸、課題分析

  • 全彩技術解決方案的各種類型
  • RGB晶片的上色技術
  • 色轉換
  • 量子點色轉換技術、用途
  • QW色轉換技術
  • 適用分析等

第11章 邦定技術:瓶頸、課題分析

  • 技術性分類
  • SMT解決方案
  • 共晶波峰焊
  • 異方性導電膠(ACF)解決方案
  • 異方性導電膠水(SAP)解決方案
  • 晶圓邦定技術解決方案
  • 晶圓邦定困難的分析
  • Micro TUBE解決方案
  • 可行性分析等

第12章 驅動計畫:瓶頸、課題分析

  • 驅動計畫類型
  • Driver IC的重要
  • Switch Mode Driver的各種類型
  • active vs passive matrix驅動比較
  • 顯示器驅動計畫
  • 薄膜電晶體
  • OLED驅動計畫
  • Micro LED驅動計畫
  • OLED vs Micro LED:Power Module比較等

第13章 背板技術:瓶頸、課題分析

  • 顯示器背板構造
  • 背板材料各種類型
  • 積體電路背板:玻璃基板、畫素變換零件的動作原理
  • 積體電路背板:玻璃基板、畫素變換零件的特徵
  • 積體電路背板:玻璃基板畫素變換零件的製造流程
  • 積體電路背板:玻璃基板畫素變換零件的解析度比較
  • 積體電路背板:玻璃基板畫素變換零件的消費電力比較
  • 積體電路背板:玻璃基板畫素變換零件的漏出量比較
  • 積體電路背板:柔性印刷電路板、畫素變換零件的特徵
  • 積體電路背板:柔性印刷電路板的製造流程
  • 積體電路背板:柔性印刷電路板材料特徵
  • 積體電路背板:矽基板構造
  • 積體電路背板:矽基板製造流程
  • 積體電路背板:矽基板材料特徵
  • 非積體電路背板:PCB基板比較
  • 非積體電路背板:PCB製造課題
  • 非積體電路背板:PCB尺寸限制
  • 背板技術比較
  • 適用分析等

第14章 Micro LED供應鏈、企業別技術開發分析

目錄

Analysis and Prediction of Micro LED Market Value

The market value of Micro LED doesn't include mass transfer and other cost but includes LED epitaxyand chip.

Due to the high unit price of wafer used in Micro LED Display, it will contribute to the market value in the short term although there are only a few quantities. As the technology matures, the wafer price has gradually declined. It is estimated that the price will drop to 29% of CAGR in 2018-2023.

Remark:

This report makes further classification for different application fields.

  • Head mounted display (HMD) includes AR/VR product application.
  • IT display contains NB and MNT.
  • Mobile display embeds in smart phone and tablet.
  • TV display and Micro LED will be self-emitting display modes. As for Mini LED, it is mainly used for backlight. Both of them wil lcompete with OLED TV in the high-end market.
  • Video Wall with size larger than 100" are mainly used in commercial display areas. Currently, Micro LED display application is represented by the CLEDS solution of SONY.

Overview Analysis

At present, there are six bottlenecks, including epitaxyand chip, transfer, full color, power drive, backplane, and inspection and repairing technologies.

Table of Contents

Chapter 1: Definition and Market Scale of Micro LED

  • Product Definition of Micro LED
  • Analysis and Prediction of Micro LED Market Value
  • Analysis and Prediction of Micro LED Output Volume
  • Estimation of Micro LED Display Penetration Rate

Chapter 2: Micro LED Applications and Technology Development

  • Micro LED Product Overview
  • Micro LED Product Specifications Overview
  • Micro LED Applications-Specifications of Head Mounted Device
  • Micro LED Applications-Cost of Head Mounted Device
  • Micro LED Applications-Shipment Volume of Head Mounted Device
  • Micro LED Applications-Specifications of Wearable Device
  • Micro LED Applications-Cost of Wearable Device
  • Micro LED Applications-Shipment Volume of Wearable Device
  • Micro LED Applications-Specifications of Handheld Device
  • Micro LED Application-Cost of Handheld Device
  • Micro LED Application-Shipment Volume of Handheld Device
  • Micro LED Application-Specifications of IT Device
  • Micro LED Application-Cost of IT Display
  • Micro LED Application-Shipment Volume of IT Device
  • Micro LED Application-Specification of Automotive Display
  • Micro LED Application-Cost of Automotive Display
  • Micro LED Application-Shipment Volume of Automotive Display
  • Micro LED Application-Specifications of TV
  • Micro LED Application-Cost of TV
  • Micro LED Application-Shipment Volume of TV
  • Micro LED Application-Specifications of LED Display
  • Micro LED Application-Cost of LED Display
  • Micro LED Application-Shipment Volume of LED Display

Chapter 3: Micro LED Patent Analysis

  • 2000-2018 Micro LED Patent Layout-Patent Family Analysis
  • 2000-2018 Micro LED Patent Layout-Region Analysis
  • 2000-2018 Micro LED Patent Layout-Technology Analysis
  • 2000-2018 Micro LED Patent Layout-Manufacturer Analysis
  • 2001-2018 Micro LED Patent Layout-Mass Transfer Technology Patent Family Analysis
  • Mass Transfer Technology-Patent Technology Overview
  • Mass Transfer Technology-Patent Technology Classification
  • 2001-2018 Micro LED Patent Layout-Mass Transfer Technology Patent Family Analysis
  • Mass Transfer Technology-Brand Manufacturer Technology Layout Analysis
  • Mass Transfer Technology-Start-up and Research Institution Technology Layout Analysis

Chapter 4: Micro LED Technology Bottleneck and Solution

  • Micro LED Industry Technology Overview Analysis
  • Micro LED Technology Bottleneck and Solution Overview-Manufacturing Process
  • Micro LED Technology Bottleneck and Solution Overview-LED Epitaxy and Chip Manufacturing Process
  • Micro LED Technology Bottleneck and Solution Overview-Transfer Technology/Bonding Technology/Drive and Backplane Technology

Chapter 5: EpitaxyTechnology Bottleneck and Challenge Analysis

  • Epitaxy Technology-Solution
  • Epitaxy Technology-Epitaxial Wafer Structure and Light Emitting Principle
  • Epitaxy Technology-Epitaxy Emissive Layer Material and Luminous Efficacy
  • EpitaxyTechnology-The Leakage Problem of Chip Miniaturization Causes the Drop of Luminous Efficacy
  • EpitaxyTechnology-Equipment Technology Classification
  • EpitaxyTechnology-Equipment Technology Comparison
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Wavelength Uniformity
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Defect Control
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Increase of Utilization of Epitaxial Wafer
  • Epitaxy Technology-Applicability Analysis

Chapter 6: Chip Manufacturing Process Technology Bottleneck and Challenge Analysis

  • Chip Manufacturing Process Technology-Development of LED Chip Miniaturization
  • Chip Manufacturing Process Technology-LED Chip Production Process
  • Chip Manufacturing Process Technology-Structural Differences between Lateral Chip, Flip Chip and Vertical Chip
  • Chip Manufacturing Process Technology-Miniaturized LED Chip (Including Sapphire Substrate) Scribing Technology
  • Chip Manufacturing Process Technology-Miniaturized LED Chip (Excluding Sapphire Substrate) Scribing Technology
  • Chip Manufacturing Process Technology-Laser Ablation
  • Chip Manufacturing Process Technology-Structural Weakening and Insulating Layer
  • Chip Manufacturing Process Technology-Design of Structural Weakening
  • Chip Manufacturing Process Technology-Design of Transfer Head
  • Chip Manufacturing Process Technology-Differences between Traditional LED and Micro LED Chip Manufacturing Processes

Chapter 7: Mass Transfer Technology Bottleneck and Challenge Analysis

  • Mass Transfer Technology-Transfer Technology Classification
  • Mass Transfer Technology-Thin Film Transfer Technology Classification
  • Mass Transfer Technology-Thin Film Transfer Technology-Pick & Place Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Non-selective Pick Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Selective Pick Technology will Increase Wafer Utilization
  • Mass Transfer Technology-Thin Film Transfer Technology-Selective Pick Technology in Repair Application
  • Mass Transfer Technology-Thin Film Transfer Technology-Factors that Affect UPH
  • Mass Transfer Technology-Thin Film Transfer Technology-Solution of Increasing UPH for Large Transfer Head
  • Mass Transfer Technology-Thin Film Transfer Technology-Higher Transfer Head Accuracy Requirement
  • Mass Transfer Technology-Thin Film Transfer Technology-Comparison between Transfer Times and Wafer Utilization
  • Mass Transfer Technology-Thin Film Transfer Technology-Comparison between Cycle Time and UPH
  • Mass Transfer Technology-Thin Film Transfer Technology: Apple (LuxVue)
    • Electrostatic Adsorption + Phase Change Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: Samsung
    • Chip Transfer and Flip
  • Mass Transfer Technology-Thin Film Transfer Technology-Van der Waals Force Introduction
  • Mass Transfer Technology-Thin Film Transfer Technology: X-Celeprint
    • Van der Waals Force
  • Mass Transfer Technology-Thin Film Transfer Technology: ITRI
    • Electromagnetic Adsorption
  • Mass Transfer Technology-Thin Film Transfer Technology: MikroMesa
    • Adhesion and Reaction Force
  • Mass Transfer Technology-Thin Film Transfer Technology: AUO
    • Electrostatic Adsorption and Reaction Force
  • Mass Transfer Technology-Thin Film Transfer Technology: VueReal
    • Solid Printing
  • Mass Transfer Technology-Thin Film Transfer Technology: Rohinni
    • Alignment Pin
  • Mass Transfer Technology-Thin Film Transfer Technology-Fluidic Assembly Technology
  • Mass Transfer Technology-Thin Film Transfer Technology: eLux
    • Fluidic Assembly
  • Mass Transfer Technology-Thin Film Transfer Technology: PlayNitride
    • Fluidic Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology-Laser Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology-Laser Transfer Classification
  • Mass Transfer Technology-Thin Film Transfer Technology: Sony
    • Laser Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: QMAT
    • BAR(Beam-Addressed Release) Mass Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: Uniqarta
    • Multi-Beam Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: OPTOVATE
    • Laser Lift-off (δ-LLO)Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Roll to Roll Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: KIMM
    • Roll to Roll Transfer
  • Mass Transfer Technology-Seven Major Challenges of Micro LED Mass Transfer Technology
  • Mass Transfer Technology-Transfer Yield Depends on the Control of Manufacturing Capability
  • Mass Transfer Technology-Applicability Analysis

Chapter 8: Testing Technology Bottleneck and Challenge Analysis

  • Micro LED Technology Bottleneck and Solution Overview-Testing Technology
  • Testing Technology-Testing Method
  • Testing Technology-Electrical Properties
  • Testing Technology-EL
  • Testing Technology-Light Properties
  • Testing Technology-PL
  • Testing Technology-Overview of Mass Testing Technology
  • Mass Testing Method-PL Testing Technology
  • Mass Testing Method-Digital Camera Photoelectric Testing Technology
  • Mass Testing Method-Contact Photoelectric Testing Technology
  • Mass Testing Method-Contactless Photoelectric Testing Technology
  • Mass Testing Method-Contactless EL Testing Technology
  • Mass Testing Method-Ultraviolet Irradiation Photoelectric Testing Technology
  • Mass Testing Technology Difference Comparison

Chapter 9: Repairing Technology Bottleneck and Challenge Analysis

  • Micro LED Technology Bottleneck and Solution Overview-Repairing Technology
    • Micro LED Repairing Technology Solution
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Repairing Process of Micro LED Dead Pixel
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Dead Pixel Repairing Technology Analysis
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Transfer Head Pickup Process
  • Repairing Technology Solution-Laser Welding Repairing Technology
  • Repairing Technology Solution-Selective Pick Repairing Technology
  • Repairing Technology Solution-Selective Laser Repairing Technology
  • Repairing Technology Solution-Backup Circuit Design Solution
    • Micro LED Active Defect Detection Design

Chapter 10: Full Color Technical Bottleneck and Challenge Analysis

  • Full Color Technical Solution Types
  • Full Color Technical Solution -RGB Chip Colorization Technique
  • Full Color Technical Solution -RGB's QantumPhotonic Imager on the Same Wafer
  • Full Color Technical Solution -Color Conversion Technology
  • Full Color Technical Solution -QunatumDot Color Conversion Technology and Application
  • Full Color Technical Solution -Quantum Well (QW) Color Conversion Technology
  • Full Color Technical Solution -Overview
  • Full Color Technical Solution -Applicability Analysis

Chapter 11: Bonding Technical Bottleneck and Challenge Analysis

  • Bonding Technology -Technical Classification
  • Bonding Technology -SMT Solution
  • Bonding Technology -Eutectic Wave Soldering Assembly Technical Solution
  • Bonding Technology -Anisotropic Conductive Adhesive (ACF) Solution
  • Bonding Technology -Anisotropic Solder Paste (SAP) Solution
  • Bonding Technology -Wafer Bonding Technical Solution
  • Bonding Technology -Wafer Bonding Difficulty Analysis
  • Bonding Technology -Micro TUBE Solution
  • Bonding Technology -Technical Difficulty Analysis
  • Bonding Technology -Feasibility Analysis

Chapter 12: Analysis of driving scheme bottlenecks and challenges

  • Driving Technology-driving scheme types
  • Driving Technology-the importance of driver IC
  • Driving Technology-Relationship Between V-I Characteristics and Luminance of LED
  • Driving Technology-Types of Switch Mode Driver
  • Driving Technology-Relationship between PWM and Duty Cycle
  • Driving Technology-Comparison between Active and Passive Matrix Driving
  • Driving Technology-Display Driving Scheme-Scanning Behavior and Refresh Rate
  • Driving Technology-Display Driving Scheme-Fine-pitch Display Analysis
  • Driving Technology-Thin Film Transistor-Driving Matrix of LCD displays
  • Driving Technology-Thin Film Transistor-Active Matrix (AM) V.S. Passive Matrix (PM)
  • Driving Technology-Thin Film Transistor-Analysis of Quality-affecting Factors
  • Driving Technology-OLED Driving Scheme-Photoelectric Properties of OLED
  • Driving Technology-OLED Driving Scheme-PMOLED
  • Driving Technology-OLED Driving Scheme-AMOLED
  • Driving Technology-Micro LED Driving Scheme-PM Micro LED
  • Driving Technology-Micro LED Driving Scheme-AM Micro LED
  • OLED V.S. Micro LED: Power Module Comparison

Chapter 13: Analysis of Backplane Technology Bottlenecks and Challenges

  • Backplane Technology-Structure of Display Backplane
  • Backplane Technology-Types of Backplane Material
  • Backplane Technology-Integrated Backplane: Operating Principles of Glass Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Features of Glass Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Size Development of Glass Substrate
  • Backplane Technology-Integrated Backplane: Thermal Expansion Challenges of Glass Substrate
  • Backplane Technology-Integrated Backplane: Application of Glass Substrate with Switch Components
  • Backplane Technology-Integrated Backplane: Structure of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of a-Si Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of IGZO Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of LTPS Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Resolution Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Power Consumption Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Leakage Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Features of Flexible Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Manufacturing Process of Flexible Substrate
  • Backplane Technology-Integrated Backplane: Features of Flexible Substrate Materials
  • Backplane Technology-Integrated Backplane: Structure of Silicon Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of Silicon Substrate
  • Backplane Technology-Integrated Backplane: Features of Silicon Substrate Materials
  • Backplane Technology-Non-integrated Backplane: Outward Structure of PCB
  • Backplane Technology-Non-integrated Backplane: Inward Structure of PCB
  • Backplane Technology-Non-integrated Backplane: Thermal Effect of PCB
  • Backplane Technology-Non-integrated Backplane: Comparison of PCB Substrates
  • Backplane Technology-Non-integrated Backplane: Challenges of Manufacturing PCB
  • Backplane Technology-Non-integrated Backplane: Size Limit of PCB
  • Comparison of Backplane Technologies
  • Backplane Technology-Applicability Analysis

Chapter 14: Analysis of Micro LED Supply Chain and Technology Developments by Company

  • Analysis of Major Micro LED Developers (in the Supply Chain)
  • Analysis of Product Strategies and Technology Developments by Region-Taiwan
  • Analysis of Product Strategies and Technology Developments by Region-China
  • Analysis of Product Strategies and Technology Developments by Region-Korea
  • Analysis of Product Strategies and Technology Developments by Region-Japan
  • Analysis of Product Strategies and Technology Developments by Region-EU & the US
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