半導體組裝·包裝設備的全球市場:2022年

本報告提供全球半導體組裝·包裝設備市場相關調查分析，提供市場特徵，市場趨勢與策略，各地區分析，競爭情形等資訊。

目錄

第1章 摘要整理

第2章 半導體組裝·包裝設備市場特徵

第3章 半導體組裝·包裝設備市場趨勢與策略

第4章 COVID-19對半導體組裝·包裝設備的影響

第5章 半導體組裝·包裝設備的市場規模與成長

• 全球半導體組裝·包裝設備市場實際成果(2016年∼2021年)
  • 推動市場要素
  • 阻礙市場要素
• 全球半導體組裝·包裝設備市場預測(2021年∼2026年，2031年)
  • 推動市場要素
  • 阻礙市場要素

第6章 半導體組裝·包裝設備市場區隔

• 全球半導體組裝·包裝設備市場:各類型，實際成果與預測
• 鍍金設備
• 檢驗·切割設備
• 引線接合法設備
• 芯片焊接設備
• 全球半導體組裝·包裝設備市場:各用途，實際成果與預測
• 家電
• 醫療設備
• 汽車
• 企業儲存
• 其他的用途
• 全球半導體組裝·包裝設備市場:各終端用戶，實際成果與預測
• OSAT
• IDM

第7章 半導體組裝·包裝設備市場各地區·各國分析

• 全球半導體組裝·包裝設備市場:各地區，實際成果與預測
• 全球半導體組裝·包裝設備市場:各國，實際成果與預測

第8章 亞太地區的半導體組裝·包裝設備市場

• 亞太地區的半導體組裝·包裝設備市場概要
• 地區資訊，COVID-19影響，市場資訊，背景資訊，政府的舉措，法規，法規機關，主要的協會，徵收的稅金，公司稅結構，投資，主要企業
• 亞太地區的半導體組裝·包裝設備市場:各類型，實際成果與預測

第9章 中國的半導體組裝·包裝設備市場

• 中國的半導體組裝·包裝設備市場概要
• 中國的半導體組裝·包裝設備市場:各類型，實際成果與預測

第10章 印度的半導體組裝·包裝設備市場

• 印度的半導體組裝·包裝設備市場:各類型，實際成果與預測

第11章 日本的半導體組裝·包裝設備市場

• 日本的半導體組裝·包裝設備市場:各類型，實際成果與預測

第12章 澳洲的半導體組裝·包裝設備市場

• 澳洲的半導體組裝·包裝設備市場:各類型，實際成果與預測

第13章 印尼的半導體組裝·包裝設備市場

• 印尼的半導體組裝·包裝設備市場:各類型，實際成果與預測

第14章 韓國的半導體組裝·包裝設備市場

• 韓國的半導體組裝·包裝設備市場:各類型，實際成果與預測

第15章 西歐的半導體組裝·包裝設備市場

• 西歐的半導體組裝·包裝設備市場概要
• 西歐的半導體組裝·包裝設備市場:各類型，實際成果與預測

第16章 英國的半導體組裝·包裝設備市場

• 英國的半導體組裝·包裝設備市場:各類型，實際成果與預測

第17章 德國的半導體組裝·包裝設備市場

• 德國的半導體組裝·包裝設備市場:各類型，實際成果與預測

第18章 法國的半導體組裝·包裝設備市場

• 法國的半導體組裝·包裝設備市場:各類型，實際成果與預測

第19章 東歐的半導體組裝·包裝設備市場

• 東歐的半導體組裝·包裝設備市場概要
• 東歐的半導體組裝·包裝設備市場:各類型，實際成果與預測

第20章 俄羅斯的半導體組裝·包裝設備市場

• 俄羅斯的半導體組裝·包裝設備市場:各類型，實際成果與預測

第21章 北美的半導體組裝·包裝設備市場

• 北美的半導體組裝·包裝設備市場概要
• 北美的半導體組裝·包裝設備市場:各類型，實際成果與預測，各2031年

第22章 美國的半導體組裝·包裝設備市場

• 美國的半導體組裝·包裝設備市場概要
• 美國的半導體組裝·包裝設備市場:各類型，實際成果與預測

第23章 南美的半導體組裝·包裝設備市場

• 南美的半導體組裝·包裝設備市場概要
• 南美的半導體組裝·包裝設備市場:各類型，實際成果與預測

第24章 巴西的半導體組裝·包裝設備市場

• 巴西的半導體組裝·包裝設備市場:各類型，實際成果與預測

第25章 中東的半導體組裝·包裝設備市場

• 中東的半導體組裝·包裝設備市場概要
• 中東的半導體組裝·包裝設備市場:各類型，實際成果與預測

第26章 非洲的半導體組裝·包裝設備市場

• 非洲的半導體組裝·包裝設備市場概要
• 非洲的半導體組裝·包裝設備市場:各類型，實際成果與預測

第27章 半導體組裝·包裝設備市場競爭情形和企業簡介

• 半導體組裝·包裝設備市場競爭情形
• 半導體組裝·包裝設備市場企業簡介
  • Amkor Technology
  • Tokyo Electron Limited
  • Lam Research Corporation
  • ASML Holding N.V.
  • Applied Materials

第28章 半導體組裝·包裝設備市場上主要合併和收購

第29章 半導體組裝·包裝設備市場未來展望和潛在的分析

第30章 附錄

“Semiconductor Assembly And Packaging Equipment Global Market Report 2022” from The Business Research Company provides the strategists, marketers and senior management with the critical information they need to assess the global semiconductor assembly and packaging equipment market as it emerges from the COVID-19 shut down.

Reasons to Purchase

• Gain a truly global perspective with the most comprehensive report available on this market covering 12+ geographies.

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• Outperform competitors using forecast data and the drivers and trends shaping the market.

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• Benchmark performance against key competitors.

• Utilize the relationships between key data sets for superior strategizing.

• Suitable for supporting your internal and external presentations with reliable high quality data and analysis

• Report will be updated with the latest data and delivered to you within 3-5 working days of order.

Where is the largest and fastest growing market for the semiconductor assembly and packaging equipment ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? “The Semiconductor Assembly And Packaging Equipmen market global report” from The Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography. It places the market within the context of the wider semiconductor assembly and packaging equipment market, and compares it with other markets.

• The market characteristics section of the report defines and explains the market.

• The market size section gives the market size ($b) covering both the historic growth of the market, the impact of the COVID-19 virus and forecasting its recovery.

• Market segmentations break down market into sub markets.

• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the impact and recovery trajectory of COVID-19 for all regions, key developed countries and major emerging markets.

• Competitive landscape gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.

• The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

• The semiconductor assembly and packaging equipment market section of the report gives context. It compares the semiconductor assembly and packaging equipment market with other segments of the semiconductor assembly and packaging equipment market by size and growth, historic and forecast.

Scope

Markets Covered:

• 1) By Type: Plating Equipment; Inspection and Dicing Equipment; Wire Bonding Equipment; Die-Bonding Equipment

• 2) By Application: Consumer Electronics; Healthcare Devices; Automotive; Enterprise Storage; Other Applications

• 3) By End-User: OSATs; IDMs

• Companies Mentioned: Amkor Technology; Tokyo Electron Limited; Lam Research Corporation; ASML Holding N.V.; Applied Materials

• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA

• Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa

• Time series: Five years historic and ten years forecast.

• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,

• Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.

• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.

Executive Summary

Major players in the semiconductor assembly and packaging equipment market are: Amkor Technology, Tokyo Electron Limited, Lam Research Corporation, ASML Holding N.V, Applied Materials, KLA-Tencor, Hitachi High-Technologies Corporation, Advantest, Screen Holdings Co. Ltd, and Teradyne Inc.

The global semiconductor assembly and packaging equipment market is expected to grow from $7.99 billion in 2021 to $10.28 billion in 2022 at a compound annual growth rate (CAGR) of 28.6%. The market is expected to grow to $16.25 billion in 2026 at a compound annual growth rate (CAGR) of 12.1%.

The semiconductor assembly and packaging equipment market consists of sales of semiconductor assembly and packaging equipment by entities (organizations, sole traders, or partnerships) that are engaged in manufacturing equipment used for semiconductor assembly and packaging. Only goods and services traded between entities or sold to end consumers are included.

The main types of semiconductor assembly and packaging equipment are plating equipment, inspection and dicing equipment, wire bonding equipment, and die-bonding equipment. Wire bonding equipment refers to a wire connecting two pieces of equipment, for hazard prevention. The various applications involved are consumer electronics, healthcare devices, automotive, enterprise storage, and other applications. The various end-users included are osats, and idms.

Asia Pacific was the largest region in the semiconductor assembly and packaging equipmen market in 2021. Western Europe was the second-largest region in the semiconductor assembly and packaging equipmen market. The regions covered in this report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, and Africa.

Rising demand for consumer electronics is anticipated to contribute to the growth of the semiconductor assembly and packaging equipment market. Consumer electronics is a key segment that is entirely dependent on the semiconductor industry. According to the India Brand Equity Foundation, the Indian appliance and consumer electronics market stood at $10.93 billion in 2019 and is expected to increase at a CAGR of 9% to reach $48.37 billion by 2022. In recent years, the applications of semiconductor Integrated Circuits (ICs) in various electronic devices are continuously increasing to perform multiple functions. Therefore, growing consumer electronics is likely to intensify the demand for semiconductor assembly and packaging equipment.

The COVID-19 outbreak hindered the growth of the semiconductor assembly and packaging equipment market. Lockdowns have been imposed in many countries across the globe affecting the manufacturing and supply chains of many industries including the semiconductor industry. For instance, according to a survey on the impact of COVID-19 on the semiconductor industry released by the Global Semiconductor Alliance (GSA) in collaboration with KPMG, about 63% of respondents reported supply chain shortages attributing to COVID-19. Semiconductors and electronics manufacturing has suffered considerable losses during the coronavirus outbreak, adversely impacting the market growth during 2020.

In July 2019, Applied Materials, Inc., a US-based company engaged in providing semiconductor chips manufacturing equipment, services, and software for electronic devices acquired Kokusai Electric Corporation for $2.2 billion. This acquisition would help the company to enhance its products & services for foundry, logic, and memory customers along with further enhancing its single wafer processing system. Kokusai Electric Corporation is a Japan-based manufacturer of semiconductor manufacturing systems.

The countries covered in the semiconductor assembly and packaging equipment market are: Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, and USA.

Table of Contents

1. Executive Summary

2. Semiconductor Assembly And Packaging Equipment Market Characteristics

3. Semiconductor Assembly And Packaging Equipment Market Trends And Strategies

4. Impact Of COVID-19 On Semiconductor Assembly And Packaging Equipment

5. Semiconductor Assembly And Packaging Equipment Market Size And Growth

• 5.1. Global Semiconductor Assembly And Packaging Equipment Historic Market, 2016-2021, $ Billion
  • 5.1.1. Drivers Of The Market
  • 5.1.2. Restraints On The Market
• 5.2. Global Semiconductor Assembly And Packaging Equipment Forecast Market, 2021-2026F, 2031F, $ Billion
  • 5.2.1. Drivers Of The Market
  • 5.2.2. Restraints On the Market

6. Semiconductor Assembly And Packaging Equipment Market Segmentation

• 6.1. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion
• Plating Equipment
• Inspection and Dicing Equipment
• Wire Bonding Equipment
• Die-Bonding Equipment
• 6.2. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion
• Consumer Electronics
• Healthcare Devices
• Automotive
• Enterprise Storage
• Other Applications
• 6.3. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By end-user, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion
• OSATs
• IDMs

7. Semiconductor Assembly And Packaging Equipment Market Regional And Country Analysis

• 7.1. Global Semiconductor Assembly And Packaging Equipment Market, Split By Region, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion
• 7.2. Global Semiconductor Assembly And Packaging Equipment Market, Split By Country, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

8. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market

• 8.1. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market Overview
• Region Information, Impact Of COVID-19, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
• 8.2. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

9. China Semiconductor Assembly And Packaging Equipment Market

• 9.1. China Semiconductor Assembly And Packaging Equipment Market Overview
• 9.2. China Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F,$ Billion

10. India Semiconductor Assembly And Packaging Equipment Market

• 10.1. India Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

11. Japan Semiconductor Assembly And Packaging Equipment Market

• 11.1. Japan Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

12. Australia Semiconductor Assembly And Packaging Equipment Market

• 12.1. Australia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

13. Indonesia Semiconductor Assembly And Packaging Equipment Market

• 13.1. Indonesia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

14. South Korea Semiconductor Assembly And Packaging Equipment Market

• 14.1. South Korea Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

15. Western Europe Semiconductor Assembly And Packaging Equipment Market

• 15.1. Western Europe Semiconductor Assembly And Packaging Equipment Market Overview
• 15.2. Western Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

16. UK Semiconductor Assembly And Packaging Equipment Market

• 16.1. UK Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

17. Germany Semiconductor Assembly And Packaging Equipment Market

• 17.1. Germany Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

18. France Semiconductor Assembly And Packaging Equipment Market

• 18.3. France Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

19. Eastern Europe Semiconductor Assembly And Packaging Equipment Market

• 19.1. Eastern Europe Semiconductor Assembly And Packaging Equipment Market Overview
• 19.2. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

20. Russia Semiconductor Assembly And Packaging Equipment Market

• 20.1. Russia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

21. North America Semiconductor Assembly And Packaging Equipment Market

• 21.1. North America Semiconductor Assembly And Packaging Equipment Market Overview
• 21.2. North America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

22. USA Semiconductor Assembly And Packaging Equipment Market

• 22.1. USA Semiconductor Assembly And Packaging Equipment Market Overview
• 22.2. USA Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

23. South America Semiconductor Assembly And Packaging Equipment Market

• 23.1. South America Semiconductor Assembly And Packaging Equipment Market Overview
• 23.2. South America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

24. Brazil Semiconductor Assembly And Packaging Equipment Market

• 24.1. Brazil Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

25. Middle East Semiconductor Assembly And Packaging Equipment Market

• 25.1. Middle East Semiconductor Assembly And Packaging Equipment Market Overview
• 25.2. Middle East Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

26. Africa Semiconductor Assembly And Packaging Equipment Market

• 26.1. Africa Semiconductor Assembly And Packaging Equipment Market Overview
• 26.2. Africa Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2016-2021, 2021-2026F, 2031F, $ Billion

27. Semiconductor Assembly And Packaging Equipment Market Competitive Landscape And Company Profiles

• 27.1. Semiconductor Assembly And Packaging Equipment Market Competitive Landscape
• 27.2. Semiconductor Assembly And Packaging Equipment Market Company Profiles
  • 27.2.1. Amkor Technology
    • 27.2.1.1. Overview
    • 27.2.1.2. Products and Services
    • 27.2.1.3. Strategy
    • 27.2.1.4. Financial Performance
  • 27.2.2. Tokyo Electron Limited
    • 27.2.2.1. Overview
    • 27.2.2.2. Products and Services
    • 27.2.2.3. Strategy
    • 27.2.2.4. Financial Performance
  • 27.2.3. Lam Research Corporation
    • 27.2.3.1. Overview
    • 27.2.3.2. Products and Services
    • 27.2.3.3. Strategy
    • 27.2.3.4. Financial Performance
  • 27.2.4. ASML Holding N.V.
    • 27.2.4.1. Overview
    • 27.2.4.2. Products and Services
    • 27.2.4.3. Strategy
    • 27.2.4.4. Financial Performance
  • 27.2.5. Applied Materials
    • 27.2.5.1. Overview
    • 27.2.5.2. Products and Services
    • 27.2.5.3. Strategy
    • 27.2.5.4. Financial Performance

29. Key Mergers And Acquisitions In The Semiconductor Assembly And Packaging Equipment Market

29. Semiconductor Assembly And Packaging Equipment Market Future Outlook and Potential Analysis

30. Appendix

• 30.1. Abbreviations
• 30.2. Currencies
• 30.3. Research Inquiries
• 30.4. The Business Research Company
• 30.5. Copyright And Disclaimer