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市場調查報告書

銅的積層製造(AM)市場 - 數據與預測:2020年

Copper Additive Manufacturing 2020-Market Database and Outlook

出版商 SmarTech Analysis 商品編碼 935989
出版日期 內容資訊 英文
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銅的積層製造(AM)市場 - 數據與預測:2020年 Copper Additive Manufacturing 2020-Market Database and Outlook
出版日期: 2020年05月07日內容資訊: 英文
簡介

本報告針對銅的積層製造 (AM) 市場進行調查分析、提供概要、技術情況、市場情況、主要企業等整體情報。

目錄

第1章 調查概要

第2章 銅的積層製造(AM)介紹

第3章 使用銅作為材料的積層製造(AM)技術情況

  • 為了讓AM系統使用需要適應藍與綠的波長能源
  • 擴大適用AM技術的銅粉、合金
  • 適合銅列印的代替金屬積層製造流程

第4章 使用銅作為材料的積層製造(AM)市場情況

  • 高週波淬火流程使用的感應線圈
  • 熱管理的火箭、其他航空宇宙零件
  • 工業的熱管理用途
  • 塑膠成形、金屬鑄造流程用的刀具備有異形水路
  • 有抗菌特性的醫療機器

第5章 未來機會與銅積層製造市場方向性

  • 金屬列印技術的進步預測
  • 對特殊金屬列印產生影響的模組式金屬積層製造系統架構動向
  • 銅列印採用的金屬積層製造服務供應商角色

第6章 銅積層製造市場與預測數據提示、討論

  • 積層製造市場的銅粉出貨
  • 銅列印的積層製造硬體機會

附錄A:銅積層製造創新企業

目錄
Product Code: SMP-AMC-0520

As one piece of a two-part market analysis package from SmarTech Analysis, this report supplements a companion database of historical and forecasted market data and opportunities in copper additive manufacturing (AM). The report is based on SmarTech's methodology for market modeling and forecasting of the AM industry, which have become a strategic source for comprehensive AM market metrics and sizing. The report also includes the direction of chief market features and dynamics that become a part of our market models in order to shape the output market metrics and projected opportunities for copper AM.

A small number of charts are included in order to better elucidate significant tendencies, with varied added references made to the companion database as a means of providing context to the numerical data. Our market and trend analysis deliberately maintains a level that can deliver well-defined and succinct descriptions of the current market and opportunities and how we anticipate them to progress over the course of time.

Together with the supplementary database, this report package is meant to act as a comprehensive, measureable guide to copper AM opportunities, which have shown to be important driving forces behind the metal AM market. This package will be a useful tool for preparing and gauging commercial activities and success for stakeholders with an interest or existing participation in copper AM, including metal material producers, AM hardware manufacturers, and developers of associated end-to-end tools in software and component processing.

Metal powder feedstocks for AM technology serve as the primary focus of this report. While there are other materials that represent opportunities for the metal AM market, particularly metal wire materials for directed energy deposition (DED), SmarTech expects powder-based metal 3D printing to represent the majority of primary opportunities in AM. Other feedstocks bear little to no relevance for the copper segment in particular at this time. In turn, the data exhibited here and in the companion database are linked to powder-based copper materials and AM solutions.

Table of Contents

Chapter One: About this Report

  • 1.1. Methodology
  • 1.2. Plan and Objective of This Report

Chapter Two: Introduction to Additive Manufacturing with Copper

Chapter Three: Technical Status of Additive Manufacturing with Copper Materials

  • 3.1. Adaptations of Blue and Green Wavelength Energy Sources for Use in AM Systems
  • 3.2. Expansion of Copper Powders and Alloys Suited to Additive Manufacturing Technologies
  • 3.3. Alternative Metal AM Processes Suited to Copper Printing
    • 3.3.1. Kinetic Metal AM Processes Suited to Copper Printing
    • 3.3.2. Bound Metal Deposition AM Processes Suited to Copper Printing

Chapter Four: Market Status of Additive Manufacturing with Copper Materials

  • 4.1. Induction Coils for Induction Hardening Processes
  • 4.2. Rocketry and Other Aerospace Components for Thermal Management
  • 4.3. Applications for Thermal Management in Industry
  • 4.4. Tooling Inserts with Conformal Cooling Channels for Plastic Molding and Metal Casting Processes
  • 4.5. Medical Devices with Antimicrobial Properties

Chapter Five: Future Opportunities and Copper AM Market Direction

  • 5.1. Predicted Advancements in Bound Metal Printing Technologies
  • 5.2. Trends in Modular Metal AM System Architecture Expected to Influence Specialty Metal Printing
  • 5.3. The Role of Metal AM Service Providers in Adoption of Copper Printing

Chapter Six: Presentation and Discussion of Copper Additive Manufacturing Market and Forecast Data

  • 6.1. Shipments of Copper Powders to Additive Manufacturing Markets
    • 6.1.1. Alloys and Pure Copper - Future Opportunities
    • 6.1.2. Associated Powder Revenues from Copper AM
  • 6.2. Opportunities for AM Hardware for Printing in Copper

Appendix A: Influencing and Innovating Companies in Copper AM

  • A.1. Additive Manufacturing System Providers
    • A.1.1. EOS
    • A.1.2. ExOne
    • A.1.3. Trumpf
    • A.1.4. Formalloy
  • A.2. Metal Powder Producers
    • A.2.1. Sandvik
    • A.2.2. Heraeus
    • A.2.3. Praxair Surface Technologies
  • About SmarTech Analysis
  • About the Analyst
  • Acronyms and Abbreviations Used In this Report

List of Exhibits

  • Exhibit 2-1: Global Metal AM Powder Shipments (kg) by Metal Group, all Markets and Technologies, 2014-2029(e)
  • Exhibit 2-2: Global Metal AM Powder Revenues ($USM) by Metal Group, all Markets and Technologies, 2014-2029(e)