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市場調查報告書

金屬結合積層製造 (AM) 市場展望:金屬黏著劑噴塗成型及BMD方式

Bound Metal Additive Manufacturing Market Outlook - Metal Binder Jetting and Bound Metal Deposition

出版商 SmarTech Analysis 商品編碼 918426
出版日期 內容資訊 英文
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金屬結合積層製造 (AM) 市場展望:金屬黏著劑噴塗成型及BMD方式 Bound Metal Additive Manufacturing Market Outlook - Metal Binder Jetting and Bound Metal Deposition
出版日期: 2019年11月18日內容資訊: 英文
簡介

本報告提供新興金屬結合印刷市場區隔的分析,急速發展的金屬積層製造市場最新的市場展望,從硬體設備及至相關材料、生產的機會,跨金屬結合印刷全體的資料庫的成長預測。

第1章 簡介、調查背景

第2章 主要調查結果的簡報、結合金屬技術的展望

  • BMD vs. 金屬黏著劑噴塗成型技術比較與展望
  • 利用案例的促進及應用的預測
  • 金屬結合印刷材料供應鏈的機會
  • 金屬結合印刷的競爭情形的摘要

第3章 金屬結合AM相關第3機會:燒結爐

目錄

SmarTech Analysis is pleased to present its latest market outlook for the rapidly evolving metal additive manufacturing market featuring analysis of the emerging bound metal printing segment. This analysis includes an extensive market tracking and forecast database spanning the entirety of the bound metal printing opportunity, from hardware, to relevant materials, to production opportunities.

Bound metal additive technologies use special liquid and polymer binders to fuse metal powder into a green state geometric shape for subsequent sintering to achieve final properties, leveraging decades old metallurgical processes widely utilized across industry. These technologies include both the highly industrial metal binder jetting, and the innovative and accessible bound metal deposition process, both of which are covered individually in the report.

Users of this new resource will receive market data covering hardware, material, and part production metrics and forecasts, as well as a brief written analysis of the current and expected future market dynamics governing the expansion of bound metal 3D printing. Hardware metrics include shipments, installations, and resulting revenues from the sale of both bound metal deposition and binder jetting technologies by region and market, with existing vendor market shares estimated in each. Material opportunities tracked and projected include shipment and revenues of metal powder and metal powder-based materials, by metal family, market, and region. Finally, part production opportunities include part production volumes and resulting market value of parts by functional role, market, and specific applications.

The written study also examines the possibilities associated with ancillary hardware to support the bound metal process chain, primarily the potential boon to makers of industrial sintering furnaces which will be required to properly complete printed parts using these advanced technologies.

This analysis and the included resources will allow stakeholders in the rapidly expanding bound metal AM market to properly assess specific detailed opportunities which will emerge over the coming years as the metal additive market matures to include these new processes.

Table of Contents

Section One: Introduction and Background to this Report

  • 1.1. About this Report and Accompanying Database
  • 1.2. Review of Methodology Employed
    • 1.2.1. Description of the Underlying Data and Method
  • 1.3. Summary of Findings

Section Two: Presentation of Key Findings and Market Outlook for Bound Metal Technologies

  • 2.1. Comparing Bound Metal Deposition vs. Metal Binder Jetting Technologies and Outlooks
  • 2.2. Driving Use Cases and Expected Applications
  • 2.3. Opportunities in the Supply Chain for Bound Metal Printing Materials
  • 2.4. Summary of the Competitive Landscape in Bound Metal Printing

Section Three: Tertiary Opportunities Related to Bound Metal AM - Sintering Furnaces

  • 3.1. Description of Analysis and Assumptions
  • 3.2. Discussion and Presentation of Ancillary Furnace Opportunities to Support Bound Metal AM
  • About SmarTech Analysis
  • About the Analyst

List of Exhibits

  • Exhibit 1-1: Global Projected Bound Metal Printing Market Opportunities and Impact ($USM), by Category
  • Exhibit 2-1: Global Bound Metal Printing Unit Sales, by Technology Type, 2014-2029(e)
  • Exhibit 2-2: Global Bound Metal Printing Revenues ($USM), by Technology Type, 2014-2029(e)
  • Exhibit 2-3: Global Production Volume of Bound Metal Printing AM Parts, all Processes and Materials, 2014-2029(e)
  • Exhibit 2-4: Global Estimated Market Value [$USM] of Bound Metal Printing AM Parts, all Processes and Materials, 2014-2029(e)
  • Exhibit 2-5: Total Projected Bound Metal Printing Hardware Revenues ($USM) by Competitor/Competitor Group, 2019 and 2020(e)
  • Exhibit 2-6: Total Projected Bound Metal Printing Hardware Installations by Competitor/Competitor Group, 2019 and 2020(e)
  • Exhibit 3-1: Global Projected Opportunity for Bound Metal Printing Ancillary Equipment Sales ($USM), by 3D Printing Process Type, 2019-2029(e)
  • Exhibit 3-2: Global Projected Opportunity for Bound Metal Deposition Ancillary Equipment Sales ($USM), by Industry, 2019-2029(e)