金屬結合積層製造 (AM) 市場展望:金屬黏著劑噴塗成型及BMD方式
Bound Metal Additive Manufacturing Market Outlook - Metal Binder Jetting and Bound Metal Deposition
|金屬結合積層製造 (AM) 市場展望:金屬黏著劑噴塗成型及BMD方式 Bound Metal Additive Manufacturing Market Outlook - Metal Binder Jetting and Bound Metal Deposition|
|出版日期: 2019年11月18日||內容資訊: 英文||
SmarTech Analysis is pleased to present its latest market outlook for the rapidly evolving metal additive manufacturing market featuring analysis of the emerging bound metal printing segment. This analysis includes an extensive market tracking and forecast database spanning the entirety of the bound metal printing opportunity, from hardware, to relevant materials, to production opportunities.
Bound metal additive technologies use special liquid and polymer binders to fuse metal powder into a green state geometric shape for subsequent sintering to achieve final properties, leveraging decades old metallurgical processes widely utilized across industry. These technologies include both the highly industrial metal binder jetting, and the innovative and accessible bound metal deposition process, both of which are covered individually in the report.
Users of this new resource will receive market data covering hardware, material, and part production metrics and forecasts, as well as a brief written analysis of the current and expected future market dynamics governing the expansion of bound metal 3D printing. Hardware metrics include shipments, installations, and resulting revenues from the sale of both bound metal deposition and binder jetting technologies by region and market, with existing vendor market shares estimated in each. Material opportunities tracked and projected include shipment and revenues of metal powder and metal powder-based materials, by metal family, market, and region. Finally, part production opportunities include part production volumes and resulting market value of parts by functional role, market, and specific applications.
The written study also examines the possibilities associated with ancillary hardware to support the bound metal process chain, primarily the potential boon to makers of industrial sintering furnaces which will be required to properly complete printed parts using these advanced technologies.
This analysis and the included resources will allow stakeholders in the rapidly expanding bound metal AM market to properly assess specific detailed opportunities which will emerge over the coming years as the metal additive market matures to include these new processes.