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3D印刷金屬:專利形勢分析 - 2019年

3D Printed Metals: A Patent Landscape Analysis 2019

出版商 SmarTech Analysis 商品編碼 666886
出版日期 內容資訊 英文
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3D印刷金屬:專利形勢分析 - 2019年 3D Printed Metals: A Patent Landscape Analysis 2019
出版日期: 2019年07月22日內容資訊: 英文
簡介

本報告提供3D印刷金屬與其製造流程相關專利趨勢調查,專利申請人,目前受讓人,申請趨勢,引用趨勢,各地區的情形,專利品質評估等彙整資料。

第1章 3D印刷金屬:總論、建議

  • 調查範圍
  • 總論 、建議
    • 簡介
    • 專利的地理分佈
    • 主要企業

第2章 專利資料庫

第3章 調查手法

第4章 專利等級、評分的說明

第5章 技術環境分析

第6章 表&圖表

  • 目前受讓人:專利、專利申請
  • 趨勢:專利、專利申請
  • 訴訟
  • 專利引用
  • 專利、發明者評分
  • 發明者活動的程度

第7章 專利品質評估

第8章 被引用

第9章 技術關鍵字地圖

第10章 總論

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: SMP-MP-0719

Metals-based 3D printing is one of the fastest growing sectors of the 3D printing industry. SmarTech has already published widely on the growing market opportunities available in this space. Building on our extensive knowledge and understanding of this area, we are now offering an updated and revamped report on the patent landscape for 3D-printed metals. This report will be one of a series of reports on the 3D printing patent landscape.

This report includes an Excel database containing 1,381 worldwide patent references for 3D printing metals and processes used to make them. This database will be a valuable resource to anyone researching the worldwide patent landscape for 3D printing metals. It enables them to determine the top cited patents in their field, how many patents are being filed each year, what patent families are already claimed and where new patent rights may be available. SmarTech's research covers both granted patents and published applications. The information is drawn from U.S., EP, WIPO PCT, Chinese, and Japanese sources.

Companies covered in this report include: 3D Systems, Arcam, Arconic, Batelle, Boeing, Desktop Metal, EOS, ExOne, GE, HC Starck, Halliburton, HP, Honeywell, Johnson Matthey, Raytheon, Ricoh, Sciaky, Siemens, United Technologies, Velo3D and Xerox.

In addition to institutional coverage, this report identifies the leading inventors in the 3D-printed metals field, who they work for, and the value of their patented inventions. SmarTech's patent analysis also reveals the degree to which the public corporate strategy of major firms in the 3D printing metals space is backed up (or not) by patent strategy.

Table of Contents

Section 1: 3D Printed Metals: Conclusions and Recommendations

  • 1.1. Coverage of this Report
  • 1.2. Conclusions and Recommendations
    • 1.2.1. Introduction
    • 1.2.2. The Geography of 3D Printing Metals Patents
    • 1.2.3. Companies in this Sector

Section 2: Patent Database

Section 3: Search Methodology

Section 4: Explanation of Patent Grades and Scores

Section 5: Technology Landscape Analysis

Section 6: Charts and Graphs

  • 6.1. Current Assignee: Patents and Applications
    • 6.1.1. Current Assignee U.S. Patents (Top 20)
    • 6.1.2. Current Assignee U.S. Applications (Top 20)
    • 6.1.3. Original Assignee European Patents (Top 20)
    • 6.1.4. Original Assignee European Applications (Top 10)
    • 6.1.5. Original Assignee WIPO Publications
    • 6.1.6. Original Assignee China Patents
    • 6.1.7. Original Assignee China Applications
    • 6.1.8. Original Assignee Japan Patents
  • 6.2. Trends: Patents and Applications
    • 6.2.1. Trends: U.S. Patents
    • 6.2.2. Trends: U.S. Applications
    • 6.2.3. Trends: European Patents
    • 6.2.4. Trends: European Applications
    • 6.2.5. Trends: WIPO Publications
    • 6.2.6. Trends: China Patents
    • 6.2.7. Trends: China Applications
    • 6.2.8. Trends: Japan Patents
  • 6.3. Litigation Involving Patents Covered by This Report
  • 6.4. Patent Citation
    • 6.4.1. Current Assignee Domestic Citation Count U.S. Patents (Top 10)
    • 6.4.2. Current Assignee Domestic Cited-By US Patents (Top 10)
    • 6.4.3. Original Assignee Domestic Citation Count China Patents (Top 20)
    • 6.4.4. Current Assignee Domestic Cited-By China Patents (Top 20)
  • 6.5. Patent and Inventor Scores
    • 6.5.1. Current Assignee Patent Score U.S. (Top 10)
    • 6.5.2. Current Assignee Inventor Score U.S. (Top 10)
    • 6.5.3. Inventor Patent Score U.S. (Top 10)
    • 6.5.4. Original Assignee Patent Score EP (Top 20)
    • 6.5.5. Inventor Patent Score EP (Top 20)
    • 6.5.6. Original Assignee Patent Score China (Top 20)
    • 6.5.7. Original Assignee Inventor Score China (Top 20)
    • 6.5.8. Inventor Patent Score Japan (Top 10)
  • 6.6. Degree of Inventor Activity
    • 6.6.1. Inventor by Current Assignee U.S. Patents (Top 10)
    • 6.6.2. Inventor by Current Assignee U.S. Applications (Top 10)
    • 6.6.3. Inventor U.S. Patents (Top 20)
    • 6.6.4. Inventor U.S. Applications (Top 20)
    • 6.6.5. Inventor by Original Assignee European Patents (Top 10)
    • 6.6.6. Inventor by Original Assignee European Applications (Top 10)
    • 6.6.7. Inventor European Patents (Top 20)
    • 6.6.8. Inventor European Applications (Top 20)
    • 6.6.9. Inventor by Original Assignee WIPO Publications
    • 6.6.10. Inventor: WIPO Publications
    • 6.6.11. Inventor by Original Assignee China Patents (Top 10)
    • 6.6.12. Inventor: China Applications (Top 10)
    • 6.6.13. Inventor by Original Assignee Japan (Top 10)
    • 6.6.14. Inventor Japan (Top 10)

Section 7: Patent Quality Evaluation

Section 8: Forward Citation

Section 9: Technology Keyword Maps

Section 10: Closing Commentary

  • About SmarTech Analysis

List of Exhibits and PowerPoint Presentations

  • PScores are the representation of the letter grades in the following numerical format
  • Referencing PowerPoints Folder
  • [Presentation 1: TECHNOLOGY LANDSCAPE REPORT]
  • This report and the accompanying Excel database cover the following patents and applications:
  • Top 10 Plaintiffs in 3D Metal Printing Sector
  • List of most recent infringement cases filed in [3D Printing Metals] sector. Click patent numbers to review patent details in full-text.
  • Patent Quality Evaluations by Company [ Referencing PowerPoints folder.]
    • 3D SYSTEMS
    • AHMR GmbH
    • Airbus Defence
    • Arcam
    • Arconic
    • BAM Bundesanstalt
    • Battelle Memorial Institute
    • Boeing
    • California Institute of Technology
    • CC3D LLC
    • Cobra Golf Inc
    • Daido Steel Co Ltd
    • Dartmouth College
    • Delvan Inc
    • Desktop Metal
    • DuPuy Synthes Products Inc
    • EADS Deutschland GmbH
    • Endress & Hauser GmbH
    • EOS
    • A. Raymond et Cie
    • ExOne
    • General Electric Co
    • Georgia Tech Research Corp
    • Glassimetal Technology Inc
    • GM Global Technology Operations
    • HC Starck Inc
    • Halliburton Energy Services
    • Hamilton Sundstrand
    • HP
    • Hilco Patent Acquisition 56 LLC
    • Honeywell International
    • Illinois Tool Works
    • Individual Inventor: Deborah Duen Ling Chung
    • Individual Inventor: Ronald Jones
    • Individual Inventor: William George Struve
    • JIANGSU BOQIAN NEW MATERIALS CO. LTD
    • Johnson Matthey PLC
    • Kennametal Inc
    • Made in Space
    • Massachusetts Institute of Technology
    • MTU Aero Engines
    • Nanocore Technologies
    • Norsk Titanium
    • Raytheon
    • Ricoh
    • Sciaky
    • Siemens Energy Inc
    • Solidica Inc
    • South China University
    • Tekna Plasma Systems Inc
    • Texas A&M University
    • Tundra Composites
    • United Technologies
    • University of Texas System
    • University of Queensland
    • Velo3D Inc
    • Washington State University
    • Xerox
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