市場調查報告書
商品編碼
1028568

內存封裝:按平台(引線鍵合、倒裝芯片等)、應用(TSV 封裝、DRAM 封裝等)、終端用戶(汽車、醫療設備等)、地區的全球市場規模預測 ~ 2028)

Memory Packaging Market Forecasts to 2028 - Global Analysis By Platform (Wire-Bond, Flip Chip and Others), Application (TSV Packaging, DRAM Packaging and Others), End User (Automotive, Medical Devices and Others) and By Geography

出版日期: | 出版商: Stratistics Market Research Consulting | 英文 150+ Pages | 商品交期: 2-3個工作天內

價格
  • 全貌
  • 簡介
  • 目錄
簡介

2020 年全球內存封裝市場將增長至 324.3 億美元,在預測期內以 7.5% 的複合年增長率增長,到 2028 年將達到 578.4 億美元。預計將達到。

封裝和組裝基礎設施的增長、對智能手機的需求增加以及自動駕駛的普及導致市場增長。然而,與內存小型化相關的散熱問題正在阻礙市場增長。

本報告調查了全球內存封裝市場,提供了市場概況、市場增長和障礙分析、市場機會、Covid-19 影響以及按平台、應用程序、最終用戶和區域劃分的市場。它提供了系統信息例如規模趨勢和預測、競爭條件以及主要公司的概況。

目錄

第 1 章執行摘要

第 2 章前言

第三章市場趨勢分析

  • 促進因素
  • 抑製器
  • 市場機會
  • 威脅
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • Covid-19 的影響

第四章波特五力分析

第5章按平台

  • 晶圓級芯片級封裝 (WLCSP)
  • 引線鍵合
  • 倒裝芯片
  • 引線框架
  • 矽通孔 (TSV)

第 6 章按應用

  • 3D 穿透矽通孔 (TSV) 封裝
  • 動態隨機存取存儲器 (DRAM) 封裝
  • 非與(NAND)閃存封裝
  • 非或(NOR)閃存包

最終用戶第 7 章

  • 汽車
  • 家電
  • 嵌入式系統
  • 信息技術 (IT) 和電信
  • 醫療設備
  • 軍事和航空航天

第 8 章按地區

  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 意大利
    • 法國
    • 西班牙
    • 其他歐洲
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳大利亞
    • 新西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中東和非洲
    • 沙特阿拉伯
    • 阿拉伯聯合酋長國
    • 卡塔爾
    • 南非
    • 其他中東和非洲

第 9 章主要發展

  • 合同、夥伴關係、合作、合資企業
  • 收購兼併
  • 推出新產品
  • 擴展名
  • 其他重要策略

第 10 章公司簡介

  • Apple Inc.
  • ASE Group
  • Cisco Systems Inc.
  • Dell EMC
  • Fujitsu Semiconductor Limited
  • Hana Micron Inc.
  • IBM Corporation
  • Intel Corporation
  • Micron Technology Inc.
  • Nanya Technology Corporation
  • Qualcomm Technologies Inc.
  • Samsung Electronics Co. Ltd
  • SK Hynix Inc.
  • STMicroelectronics
  • Toshiba Electronic Devices & Storage Corporation
目錄
Product Code: SMRC20884

According to Stratistics MRC, the Global Memory Packaging Market is accounted for $32.43 billion in 2020 and is expected to reach $57.84 billion by 2028 growing at a CAGR of 7.5% during the forecast period. Growth in packaging and assembly infrastructure, rising demand for smartphones and growing popularity of autonomous driving are driving the market growth. However, thermal issues due to the miniaturization of memory are hampering the growth of the market.

Memory is made of small semiconductor chips similar to processors and should be packaged into less fragile and tiny chips to be integrated with the rest of the system. There are many different memory device packaging options available, used in a wide range of packaging technologies, depending on product requirements, like performance, density, and cost.

Based on the end user, the automotive segment is going to have lucrative growth during the forecast period owing to increase in acceptance of DRAM memory. Furthermore, the growth is led by the trend of autonomous driving and in vehicle infotainment. By geography, Asia Pacific is going to have high growth during the forecast period which can be attributed to a wide range of applications in several consumer electronics, especially in tablets and smartphones.

Some of the key players profiled in the Memory Packaging Market include Apple Inc., ASE Group, Cisco Systems Inc., Dell EMC, Fujitsu Semiconductor Limited, Hana Micron Inc., IBM Corporation, Intel Corporation, Micron Technology Inc., Nanya Technology Corporation, Qualcomm Technologies Inc., Samsung Electronics Co. Ltd, SK Hynix Inc., STMicroelectronics and Toshiba Electronic Devices & Storage Corporation.

Platforms Covered:

  • Wafer-Level Chip-Scale Packaging(WLCSP)
  • Wire-Bond
  • Flip-Chip
  • Lead-Frame
  • Through-Silicon Via (TSV)

Applications Covered:

  • 3D Through-Silicon Via (TSV) Packaging
  • Dynamic Random Access Memory (DRAM) Packaging
  • Not AND (NAND) Flash Packaging
  • Not OR (NOR) Flash Packaging

End Users Covered:

  • Automotive
  • Consumer Electronics
  • Embedded Systems
  • Information Technology (IT) & Telecom
  • Medical Devices
  • Military and Aerospace

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Memory Packaging Market, By Platform

  • 5.1 Introduction
  • 5.2 Wafer-Level Chip-Scale Packaging(WLCSP)
  • 5.3 Wire-Bond
  • 5.4 Flip-Chip
  • 5.5 Lead-Frame
  • 5.6 Through-Silicon Via (TSV)

6 Global Memory Packaging Market, By Application

  • 6.1 Introduction
  • 6.2 3D Through-Silicon Via (TSV) Packaging
  • 6.3 Dynamic Random Access Memory (DRAM) Packaging
  • 6.4 Not AND (NAND) Flash Packaging
  • 6.5 Not OR (NOR) Flash Packaging

7 Global Memory Packaging Market, By End User

  • 7.1 Introduction
  • 7.2 Automotive
  • 7.3 Consumer Electronics
  • 7.4 Embedded Systems
  • 7.5 Information Technology (IT) & Telecom
  • 7.6 Medical Devices
  • 7.7 Military and Aerospace

8 Global Memory Packaging Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 Apple Inc.
  • 10.2 ASE Group
  • 10.3 Cisco Systems Inc.
  • 10.4 Dell EMC
  • 10.5 Fujitsu Semiconductor Limited
  • 10.6 Hana Micron Inc.
  • 10.7 IBM Corporation
  • 10.8 Intel Corporation
  • 10.9 Micron Technology Inc.
  • 10.10 Nanya Technology Corporation
  • 10.11 Qualcomm Technologies Inc.
  • 10.12 Samsung Electronics Co. Ltd
  • 10.13 SK Hynix Inc.
  • 10.14 STMicroelectronics
  • 10.15 Toshiba Electronic Devices & Storage Corporation

List of Tables

  • Table 1 Global Memory Packaging Market Outlook, By Region (2019-2028) (US $MN)
  • Table 2 Global Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
  • Table 3 Global Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
  • Table 4 Global Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
  • Table 5 Global Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
  • Table 6 Global Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
  • Table 7 Global Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
  • Table 8 Global Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
  • Table 9 Global Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
  • Table 10 Global Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
  • Table 11 Global Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
  • Table 12 Global Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
  • Table 13 Global Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
  • Table 14 Global Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
  • Table 15 Global Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
  • Table 16 Global Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
  • Table 17 Global Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
  • Table 18 Global Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
  • Table 19 Global Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
  • Table 20 North America Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
  • Table 21 North America Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
  • Table 22 North America Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
  • Table 23 North America Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
  • Table 24 North America Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
  • Table 25 North America Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
  • Table 26 North America Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
  • Table 27 North America Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
  • Table 28 North America Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
  • Table 29 North America Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
  • Table 30 North America Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
  • Table 31 North America Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
  • Table 32 North America Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
  • Table 33 North America Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
  • Table 34 North America Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
  • Table 35 North America Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
  • Table 36 North America Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
  • Table 37 North America Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
  • Table 38 North America Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
  • Table 39 Europe Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
  • Table 40 Europe Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
  • Table 41 Europe Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
  • Table 42 Europe Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
  • Table 43 Europe Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
  • Table 44 Europe Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
  • Table 45 Europe Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
  • Table 46 Europe Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
  • Table 47 Europe Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
  • Table 48 Europe Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
  • Table 49 Europe Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
  • Table 50 Europe Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
  • Table 51 Europe Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
  • Table 52 Europe Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
  • Table 53 Europe Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
  • Table 54 Europe Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
  • Table 55 Europe Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
  • Table 56 Europe Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
  • Table 57 Europe Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
  • Table 58 Asia Pacific Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
  • Table 59 Asia Pacific Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
  • Table 60 Asia Pacific Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
  • Table 61 Asia Pacific Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
  • Table 62 Asia Pacific Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
  • Table 63 Asia Pacific Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
  • Table 64 Asia Pacific Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
  • Table 65 Asia Pacific Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
  • Table 66 Asia Pacific Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
  • Table 67 Asia Pacific Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
  • Table 68 Asia Pacific Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
  • Table 69 Asia Pacific Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
  • Table 70 Asia Pacific Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
  • Table 71 Asia Pacific Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
  • Table 72 Asia Pacific Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
  • Table 73 Asia Pacific Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
  • Table 74 Asia Pacific Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
  • Table 75 Asia Pacific Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
  • Table 76 Asia Pacific Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
  • Table 77 South America Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
  • Table 78 South America Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
  • Table 79 South America Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
  • Table 80 South America Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
  • Table 81 South America Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
  • Table 82 South America Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
  • Table 83 South America Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
  • Table 84 South America Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
  • Table 85 South America Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
  • Table 86 South America Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
  • Table 87 South America Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
  • Table 88 South America Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
  • Table 89 South America Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
  • Table 90 South America Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
  • Table 91 South America Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
  • Table 92 South America Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
  • Table 93 South America Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
  • Table 94 South America Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
  • Table 95 South America Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
  • Table 96 Middle East & Africa Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
  • Table 97 Middle East & Africa Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
  • Table 98 Middle East & Africa Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
  • Table 99 Middle East & Africa Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
  • Table 100 Middle East & Africa Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
  • Table 101 Middle East & Africa Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
  • Table 102 Middle East & Africa Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
  • Table 103 Middle East & Africa Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
  • Table 104 Middle East & Africa Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
  • Table 105 Middle East & Africa Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
  • Table 106 Middle East & Africa Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
  • Table 107 Middle East & Africa Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
  • Table 108 Middle East & Africa Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
  • Table 109 Middle East & Africa Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
  • Table 110 Middle East & Africa Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
  • Table 111 Middle East & Africa Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
  • Table 112 Middle East & Africa Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
  • Table 113 Middle East & Africa Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
  • Table 114 Middle East & Africa Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)