全球印刷電路板 (PCB) 產業分析
Global PCB Industry Report, 2015-2020
|出版日期||內容資訊||英文 191 Pages
|全球印刷電路板 (PCB) 產業分析 Global PCB Industry Report, 2015-2020|
|出版日期: 2016年08月26日||內容資訊: 英文 191 Pages||
全球印刷電路板 (PCB) 市場，2014年達到570億美元的規模 (與前一年同期比較減少4.4％) 。市場縮小的原因，是日元、歐元、新台幣對美金貶值，及行動電話、PC市場低迷等。整體低迷情形目前預計將繼續，不過，汽車用PCB的需求擴大，及配合iPhone 7S/8開發、銷售的基板型HDI (高密度實裝線路)的開發等，今後也能看到成長趨勢。
本報告提供全球印刷電路板 (以下PCB) 產業相關分析，全球整體及主要國家的產量的變化和未來趨勢，相關市場 (下游工程:行動電話、太陽能發電面板等)的趨勢與其影響，全球整體/中國國內的大供應商的排行榜，主要供應商簡介等的調查評估。
‘Global PCB Industry Report, 2015-2020’ highlights the followings:
Global PCB market was valued at USD57 billion in 2015, a 4.4% decline from 2014, largely due to: 1) depreciation of Japanese yen, euro, and NTD against the dollar; 2) stagnation in saturated mobile phone market, continuous decline in PC market, and a plunge in tablet PC market. The sluggish demand from downstream markets has extended to 2016 and it is expected there will be no substitute for smartphone to drive PCB market until the year 2020. Global PCB industry is projected to keep shrinking in 2016 with a market size of USD55.3 billion (a 3.0% contraction).
Automotive PCB market is the biggest highlight. Global automotive PCB market size was USD5.28 billion in 2015 and is expected to grow by 8.3% to USD5.72 billion in 2016 and by 8.2% to USD6.19 billion in 2017, primarily because of impetus of millimeter-wave radar to RF board, of connected vehicle to multi-layer board, and of chassis electronization to metal substrate.
The biggest change in PCB industry in 2017 will be wider application of substrate like. According to Apple's suppliers, iPhone 7S/8 to be launched in 2017 will see some substantial upgradings in specification with substrate-like HDI replacing commonly-used HDI so as to massively import System in Package (SiP) technology with the aim of modularizing sub-system.
Compared with traditional HDI, the biggest change in the specification of substrate-like HDI is the line space/width on circuit board which moves toward fine pitch in order to work properly with SiP technology. Particularly, the line space/width must be miniaturized below 35 micrometers. In such case, traditional PCB HDI process cannot meet technical requirements on fine pitch, and large sums of money are needed to upgrade manufacturing equipment and re-explore production processes. By contrast, IC substrate vendors can easily produce such PCB, showing overwhelming superiority.
According to Apple's suppliers, for iPhone 7S/8 to be launched in 2017, the original one large traditional HDI board will be disassembled into four small substrate-like HDI boards, thus not only speeding up import of SiP technology but also freeing up more space for larger battery capacity. Apple has asked suppliers to send samples in the third quarter, attracting IC substrate vendors including Ibiden, Kinsus, and Unimicron to scramble for orders. However, it now seems that Kinsus, a key SiP board supplier for Apple, has the best chance of winning substrate-like HDI order, and ASE Group is likely to grab SiP packaging & testing order.
Global Top10 HDI Vendors in 2015 by Revenue
Source: Global PCB Industry Report, 2015-2020 by ResearchInChina.