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市場調查報告書

全球和中國的先進包裝產業:2019年∼2025年

Global and China Advanced Packaging Industry Report, 2019-2025

出版商 ResearchInChina 商品編碼 134082
出版日期 內容資訊 英文 134 Pages
商品交期: 最快1-2個工作天內
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全球和中國的先進包裝產業:2019年∼2025年 Global and China Advanced Packaging Industry Report, 2019-2025
出版日期: 2019年05月27日內容資訊: 英文 134 Pages
簡介

全球先進包裝產業的銷售量,預計從2018年的約256億美元,2025年到428億美元擴大,2018年∼2025年以7.6%的年複合成長率 (CAGR) 成長。

本報告提供全球和中國的先進包裝產業調查分析,半導體產業,上游、下游工程產業,封裝技術趨勢,先進包裝產業,主要供應商等相關的系統性資訊。

第1章 全球半導體產業

  • 概要
  • 供應鏈
  • 半導體包裝的介紹

第2章 IC封裝產業的上游、下游工程

  • 半導體產業:各地區
  • 晶圓製造產業
  • DRAM產業
  • NAND快閃記憶體
  • 行動電話市場
  • PC市場
  • 平板電腦市場

第3章 包裝、檢驗技術趨勢

  • Wide I/O,HMC記憶體
  • 埋入零組件基板
  • 埋入追蹤基板
  • 手機用IC封裝
  • SIP包裝
  • 2.5D包裝
  • TSV (3D) 包裝

第4章 包裝、檢驗產業

  • 市場規模
  • 中階包裝、檢驗產業
  • 包裝設備的市場規模
  • 競爭格局

第5章 包裝設備供應商

  • ASM Pacific
  • Kulicke & Soffa
  • BESI
  • Advantest
  • 日立先端科技
  • Teradyne
  • DISCO
  • TOWA
  • Hanmi
  • PFSA
  • SUSS MicroTec
  • Cohu Semiconductor Equipment Group
  • 新川
  • 東京精密
  • Ultratech

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄

The global semiconductor packaging and testing market is enlarging with the prevalence of consumer electronics, automotive semiconductors and the Internet of Things (IoT), with its size edging up 2.5% year on year to $54.3 billion in 2018, of which the advanced packaging sales rose by 6.6% to approximately $25.6 billion in 2018, a figure projected to be $42.8 billion in 2025, at a CAGR of 7.6% or so between 2018 and 2025. To better meet the domestic and foreign demand for advanced packaging technology, Chinese packaging and testing companies have quickened their pace of deployments in 3D, SIP and WLCSP where they put more in research and development, which thus sends the market size of mid- and high-end packaging to $5.88 billion, or 30% of the total.

Foreign companies led by ASMPacific Technology (ASMP), US-based Alltech, Germany's TPT and Austrian vendor FK, are the main suppliers of wire bonder, a key device for semiconductor packaging, among which ASMP boasts the biggest share, or 25% of the global market in the back-end-of-line (BEOL) process. America's Teradyne and Japan-based Advantest are the two major vendors of sorter and tester, two kinds of semiconductor testing equipment, commanding 48% and 39% of the global market, separately.

The packaging and testing market in Mainland China has been ballooning to the second largest around the globe, as local players independently develop advanced packaging technology and acquire foreign firms, for example, Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) acquired STATS ChipPAC based in Singapore, making itself the world's third-ranking packaging and testing plant only second to ASE Group and Amkor; Tianshui Huatian Technology Co., Ltd. acquired Flip Chip International, LLC (FCI), an American company; Tongfu Microelectronics Co., Ltd. has also been on the global top ten packaging and testing plants list after acquiring AMD's packaging and testing subsidiary. All of which is a proof that global packaging and testing operations are gathering around Mainland China.

Global and China Advanced Packaging Industry Report, 2019-2025 highlights the following:

Global semiconductor industry (development course, market size, competitive pattern, packaging industry at a glance, etc.);

IC packaging upstream and downstream industries: (wafer, memory, collector, PC, etc.) (market size, output & sales, competitive pattern, etc.);

Packaging technology trends (SIP, 2.5D, 3D, WLCSP, etc.);

Advanced packaging industry (market size, competitive pattern, development trend, etc.);

15 key foreign and Chinese vendors (ASMP, Kulicke & Soffa, Advantest, etc.) (profile, operation, R&D, manufacturing base distribution, technical characteristics, etc.).

Table of Contents

1. Global Semiconductor Industry

  • 1.1 Overview
  • 1.2 Supply Chain
  • 1.3 Semiconductor Packaging Introduction

2. Upstream & Downstream of IC Packaging Industry

  • 2.1 Semiconductor Industry by Location
  • 2.2 Wafer Foundry Industry
    • 2.2.1 Market Size
    • 2.2.2 Competitive Pattern
    • 2.2.3 China's Wafer Market
  • 2.3 DRAM Industry
    • 2.3.1 Status Quo
    • 2.3.2 Market Share of DRAM Vendors
    • 2.3.3 Market Share of Mobile DRAM Vendors
  • 2.4 NAND Flash
  • 2.5 Mobile Phone Market
  • 2.6 PC Market
  • 2.7 Tablet PC Market

3. Packaging & Testing Technology Trend

  • 3.1 WIDE IO/HMC MEMORY
  • 3.2 Embedded Component Substrate
  • 3.3 Embedded Trace Substrate
  • 3.4 IC Packaging for Handset
    • 3.4.1 Status Quo
    • 3.4.2 PoP Packaging
    • 3.4.3 FOWLP
  • 3.5 SIP Packaging
    • 3.5.1 Murata
    • 3.5.2 USI (Taiwan)
  • 3.6 2.5D Packaging (SI/GLASS/ORGANIC INTERPOSER)
    • 3.6.1 Introduction
    • 3.6.2 Application
    • 3.6.3 2.5D Interposer Market Size
    • 3.6.4 Suppliers
  • 3.7 TSV (3D) Packaging
    • 3.7.1 Equipment

4. Packaging & Testing Industry

  • 4.1 Market Size
  • 4.2 Middle-end Packaging &Testing Industry
  • 4.3 Market Size of Packaging Equipment
  • 4.4 Competitive Pattern
    • 4.4.1 Market Share of Packaging Equipment
    • 4.4.2 Ranking of Packaging Equipment Vendors

5. Packaging Equipment Vendors

  • 5.1 ASM Pacific
  • 5.2 Kulicke & Soffa
  • 5.3 BESI
  • 5.4 Advantest
  • 5.5 Hitachi High-Technologies
  • 5.6 Teradyne
  • 5.7 DISCO
  • 5.8 TOWA
  • 5.9 Hanmi
  • 5.10 PFSA
  • 5.11 SUSS MicroTec
  • 5.12 Cohu Semiconductor Equipment Group
  • 5.13 Shinkawa
  • 5.14 Tokyo Seimitsu
  • 5.15 Ultratech

Selected Charts

  • Semiconductor Industry Growth versus Worldwide GDP Growth
  • Revenue of Global Semiconductor Industry, 2016-2018
  • Global Semiconductor Market Structure by Product, 2015-2018
  • Market Size Growth of Global Semiconductor Market by Product, 2015-2018
  • Semiconductor Outsourced Supply Chain
  • Semiconductor Company Systems
  • Semiconductor Outsourced Supply Chain Example
  • Major Functions of Packaging
  • Top 25 Semiconductor Sales Leaders, 2018
  • Top 10 IC Manufacturers in China, 2017-2018
  • Global Foundry Market Size, 2008-2018
  • Global Wafer Advanced Packaging Output, 2015-2025E
  • Foundry Revenue of Advanced Nodes, 2012-2018
  • Global Foundry Capacity by Node, 2012-2018
  • Global Foundry Revenue by Node, 2012-2018
  • Global Ranking by Foundry, 2013
  • Distribution of 12-inch Foundries in Mainland China
  • Capacity of 12-inch Foundries in Mainland China
  • Global DRAM and NAND Market Size, 2008-2018
  • DRAM Supply/Demand, 2015-2018
  • DRAM Tech Migration Roadmap
  • DRAM CAPEX, 2013-2018
  • Revenue Ranking for Branded DRAM Vendor, 2017-2018
  • DRAM Market Share, 2017-2018
  • Mobile DRAM Market Share, 2016-2018
  • Mobile DRAM Market Share, 2018
  • Revenue Ranking for Branded Mobile DRAM Vendors, 2017-2018
  • Market Share of Branded NAND Flash Vendors, 2018
  • NAND Supply/Demand, 2016-2018
  • NAND Tech Migration Roadmap
  • Average IC Cost of Mobile Phone, 2013-2018
  • Global Mobile Phone Shipments, 2012-2018
  • Global 3G/4G Mobile Phone Shipments by Region, 2012-2018
  • Worldwide Smartphone Sales to End Users by Vendor in 2018
  • Worldwide Smartphone Sales to End Users by Operating System in 2018
  • Worldwide Mobile Phone Sales to End Users by Vendor in 2018
  • Global PC-used CPU and Discrete GPU Shipments, 2012-2018
  • Global Notebook Computer Shipments, 2012-2018
  • Global Major Notebook Computer ODM Shipments, 2016-2018
  • Global Tablet PC Shipments, 2013-2018
  • Market Share of Major Tablet PC Brands, 2018
  • Output of Global Tablet PC Vendors, 2017-2018
  • Advantages of WIDE IO
  • SK Hynix WIDE IO2 Roadmap
  • HMC Architecture
  • HMC Benefits
  • Advantages of Embedded Passive/Active Substrate
  • Embedded Component Substrate Process
  • Comparison of Embedded Active & Passive Components
  • Roadmap of Embedded Passive Substrate
  • Structure Roadmap of Embedded Active Substrate
  • FOWLP and PLP Process Comparison
  • WHY Embedded Trace?
  • Embedded Trace Package Features
  • Apple iPad 4 LTE A1459 IC Package Type List
  • iPhone X IC Package Type
  • iPhone X IC BOM and Package Type
  • PoP Package Development Trend
  • Market Share of Major SiP Packaging Vendors, 2018
  • Murata Sales and Operation Margin, FY2013-FY2018
  • Murata Sales by Region, FY2013-FY2018
  • Sales, New Orders and Backlog of Murata, 2013-2018
  • Operating Income and Net Income of Murata, 2015-2018
  • Murata Sales by Product, FY2015-FY2018
  • Murata Sales by Application, FY2016-FY2018
  • Revenue and Gross Margin of USI (Taiwan), 2013-2018
  • Quarterly Revenue and Gross Margin of USI (Taiwan), 2016-2018
  • Quarterly Revenue of USI (Taiwan) by Product, 2016-2018
  • Revenue and Operating Margin of USI, 2016-2018
  • Revenue of USI by Application, 2016-2018
  • Output of USI by Product, 2016-2018
  • 2.5D Interposer Manufacturing Revenue
  • Breakdown by Interposer Bulk Material, 2013-2018
  • TSV Application
  • TSV Equipment Suppliers
  • TSV Packaging Equipment Distribution, 2013-2018
  • Global Semiconductor Equipment Sales, 2015-2025E
  • Global Semiconductor Packaging & Testing Equipment Sales, 2015-2025E
  • Share of IC Package Added Value, 1990-2020E
  • Global IC Packaging Shipment by Type, 2018
  • IC Packaging & Testing Industry Sales in China, 2015-2025E
  • Distribution of Global Top 10 Packaging Vendors, 2018
  • Advanced Packaging Market Size in China, 2015-2025E
  • Middle-End Packaging & Testing Process
  • Chinese Packaging & Testing Companies Recently With More Efforts in R&D of Advanced Packaging Technology for a Faster Progress in Deployment
  • Market Size of Die Level Packaging Equipment, 2015-2018
  • Semi Equipment Book-to-bill, 2015-2018
  • Breakdown of Die Packaging Level Equipment by Product, 2017-2018
  • Wire Bonder Vendor Market Share, 2018
  • Flip-chip Bonder Vendor Market Share, 2018
  • Die Bonder Vendor Market Share, 2018
  • Test Handler Vendor Market Share, 2018
  • Ranking of Top 16 Major Global Packaging Equipment Vendors by Revenue, 2017-2018
  • Comparison between Chinese and Foreign Companies in Packaging & Testing Link
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