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表紙
市場調查報告書

無源電子元器件的全球市場展望:2021-2026

Passive Electronic Components: World Market Outlook: 2021-2026

出版商 Paumanok Publications, Inc. 商品編碼 996948
出版日期 內容資訊 英文 300 Pages; 152 Tables & Graphs
商品交期: 最快1-2個工作天內
價格
無源電子元器件的全球市場展望:2021-2026 Passive Electronic Components: World Market Outlook: 2021-2026
出版日期: 2021年03月25日內容資訊: 英文 300 Pages; 152 Tables & Graphs
簡介

本報告調查了全球無源電子元件市場,並提供了14種亞型和53種無源電子元件配置的詳細全球和區域市場調查。

電容器:

MLCC陶瓷,鋁,鉭,DC膜,AC膜,碳超級電容器。

  • 鋁,軸向引線Al203:
  • 碳,EDLC超級電容器(碳):
  • 鋁,SMD V芯片(Al203):
  • 鋁,有機H芯片(Al203):
  • 鋁,逕向引線(Al203):
  • 鋁,嵌入式(Al203):
  • 大罐鋁(Al203):
  • 陶瓷,0402 MLCC(芯片(0402 BaTI02):
  • 陶瓷,0603 MLCC(芯片(0603 BaTI02):
  • 陶瓷,0805 MLCC(芯片(0805 BaTI02):
  • 陶瓷,1206 MLCC(芯片(1206 BaTI02):
  • 陶瓷,1210-1225 MLCC(芯片(1210-1225 BaTI02):
  • 陶瓷,高CV MLCC(帶有熱水,醇鹽或溶膠-凝膠的各種尺寸的BaTI02芯片):
  • 陶瓷特殊電容器:
  • 鉭,模製芯片盒(錳陰極):
  • 鉭,B型芯片外殼(錳陰極):
  • 鉭,C型芯片保護殼(錳陰極):
  • 鉭,D型芯片外殼(錳陰極):
  • 鉭,模製E/X模殼(錳陰極):
  • 鉭,模製芯片盒(聚合物陰極):
  • 鉭,B型芯片外殼(聚合物陰極):
  • 鉭,C型芯片外殼(聚合物陰極):
  • 鉭,D型芯片外殼(聚合物陰極):
  • 鉭,模製E/X模殼(聚合物陰極):
  • 塑料膜;軸向簧片塑料膜(聚對苯二甲酸乙二酯塑料膜電介質):
  • 塑料薄膜:薄膜芯片(PPS,PEN,PET薄膜):
  • 塑料膜:徑向簧片塑料膜(PET塑料膜):
  • 塑料膜:抑制膜(Snaba/X和Y):

註冊:

厚膜芯片,網絡,陣列,鎳鉻合金金屬膜,氧化錫,繞組,薄膜,碳膜;

  • 厚膜芯片寄存器(0201外殼尺寸Ru02 96%氧化鋁厚膜)
  • 厚膜芯片寄存器(0402外殼尺寸Ru02 96%氧化鋁厚膜)
  • 厚膜芯片寄存器(0603外殼尺寸Ru02 96%氧化鋁厚膜)
  • 厚膜芯片寄存器(0805外殼尺寸Ru02 96%氧化鋁厚膜)
  • 厚膜芯片寄存器(96%氧化鋁上的1206外殼尺寸Ru02厚膜)
  • 厚膜芯片寄存器(1210-2512外殼尺寸Ru02 96%氧化鋁厚膜)
  • 碳膜套準器,軸向和徑向引線:
  • 金屬葉:(軸向,逕向和SMD成分鎳+鉻金屬葉):
  • 氧化錫:(也稱為銻10電阻器,耐火和高壓寄存器:
  • 鎳鉻合金薄膜(陶瓷芯上的鎳+鍍鉻金屬薄膜):
  • 電源繞組(鎳+鉻絲纏繞在陶瓷芯上):
  • 電阻器網絡,多芯片陣列網絡:
  • 電阻器網絡,塗層SIP網絡
  • 註冊網絡,SMD DIP網絡:
  • 註冊網絡,模製DIP網絡
  • 註冊網絡,模製SIP網絡
  • 薄膜芯片0402芯片:鎳+鉻或鉭+氮化物薄膜
  • 薄膜芯片0603芯片:鎳+鉻或鉭+氮化物薄膜
  • 薄膜芯片0805芯片:鎳+鉻或鉭+氮化物薄膜:
  • 薄膜芯片1206芯片:鎳+鉻或鉭+氮化物薄膜:
  • 薄膜芯片1210-2512芯片:鎳+鉻或鉭+氮化物薄膜

電感器:

水平繞組電感器;繞片式線圈電感器,鐵氧體磁珠和磁珠陣列。多層芯片電感器,軸向和徑向引線電感器,鐵氧體磁芯,薄膜電感器芯片

  • 軸向和徑向鉛微電感器:
  • 貼片線圈:
  • 鐵氧體磁珠:

成分:

  • 鎳(用於電極粉和焊膏)
  • 銅(用於端接粉和糊劑):
  • 鋁(用於電容器箔;氧化鋁基材):
  • 鋅(氧化鋅):
  • 鈀(電極粉和焊膏):
  • 釕(用於耐墨水):
  • 鉭礦石,粉末和金屬絲(用於鉭陽極):
  • 銀(用於電極和終端):
  • 原油(用於塑料):

世界市場:

報告創建對每個被動組件的未來價格,價格和數量的預測,以及過去10年需求週期的歷史記錄,以及從2021年到2026年按類型劃分的被動組件的價值。和價格

  • 無源元件的消耗和按類型和配置的消耗:電容器,寄存器,電感器-FY-2021-2026預測
  • 按類型和配置劃分的無源電子元件的平均單價:電容器,寄存器,電感器-FY-2021-2026的預測
  • 無源電子元器件及其原材料的53種亞型的120個月交貨時間數據 全球
  • 類型和地區的無源電子元件的銷售:2021-2026 按
  • 類型和最終用途細分市場的無源電子元件的銷售:2021-2026
  • 無源電子元件製造商按類型和配置劃分的市場份額:2021財年
  • 按類型和配置的電容器,寄存器和電感器預測:FY 2021-2026

最終用途市場:

該研究估計了最終用途市場細分的全球消費量,包括電路應用,例如:

  • 無線聽筒
  • 計算機和辦公設備市場
  • 消費音頻和視頻成像以及家庭影院終端市場
  • 工業電子和電源
  • 汽車電子組件
  • 專業和國防最終用途市場

區域市場:

在此調查中,按地區和主要消費國劃分的全球消費量,到2021年每個本地化市場的變化

  • 中國和東南亞
  • 日本
  • 歐洲
  • 美洲

製造商的市場份額:

該報告還提供了無源元件行業每個子集的詳細市場份額數據,包括以下市場份額:

  • MLCC電容器製造商: 2021年的全球市場份額
  • 鉭電容器製造商: 2021年全球市場份額
  • 鋁電解電容器製造商: 2021年全球市場份額
  • 塑料薄膜電容器製造商: 2021年全球市場份額
  • 厚膜芯片寄存器製造商: 2021年全球市場份額
  • 註冊網絡,陣列,IPD製造商: 2021年的全球市場份額
  • 鎳鉻金屬膜寄存器製造商: 2021年的全球市場份額
  • 氧化錫寄存器製造商: 2021年全球市場份額
  • 繞組寄存器製造商: 2021年全球市場份額
  • 分立電□□感製造商: 2021年全球市場份額
  • 交貨期:120個月數據: 2012年3月至2021年3月
  • 電容器:電容器從2012年3月到2021年3月的電介質,類型和配置的交貨時間
  • 寄存器按寄存器類型和配置的讀取時間(2012年3月至2021年3月)
  • 電感器:按寄存器類型和配置的讀取時間(2012年3月至2021年3月)
  • 電容器,寄存器,電感器組件的類型和配置每個的120個月交貨時間數據。
  • 預測 2021-2026

在本報告中,除了預測每個被動組件的未來價格,數量和數量外,我們還創建了過去10年以及2021年至2026年需求週期的歷史記錄,預測各種類型的無源組件的數量,數量和價格。

製造商資料:

在本報告中,所有無源組件,例如Bourns,Chilisin,Coilcraft,Inc.,KOA Corporation,Kyocera Corporation(AVX),Nippon Corporation,Nippon Chemi-Con Corporation,Panasonic Electronic Devices Company Limited,Murata Manufacturing Company Limited,等。描述主要供應商。

目錄
Product Code: ISBN #1-893211-99-1 (2021)

The study, entitled "Passive Electronic Components: World Market Outlook: 2021-2026 ISBN #1-893211-99-1 (2021)" is designed for manufacturers, distributors and end-users of passive electronic components that update their supply chain information on an annual basis and is in its 34th year of publication. This report offers a granular look at the global and regional markets for 14 sub-types and 53 configurations of passive electronic component, including:

CAPACITORS:

MLCC Ceramic, Aluminum, Tantalum, DC Film, AC Film and Carbon Supercapacitors.

  • Aluminum, Axial Leaded Al203:
  • Carbon, EDLC Supercapacitors (Carbon):
  • Aluminum, SMD V-Chip (Al203):
  • Aluminum, Organic H-Chip (Al203):
  • Aluminum, Radial Leaded (Al203):
  • Aluminum, Snap-In (Al203):
  • Aluminum, Large Can (Al203):
  • Ceramic, 0402 MLCC (Chips (0402 BaTI02):
  • Ceramic, 0603 MLCC (Chips (0603 BaTI02):
  • Ceramic, 0805 MLCC (Chips (0805 BaTI02):
  • Ceramic, 1206 MLCC (Chips (1206 BaTI02):
  • Ceramic, 1210-1225 MLCC (Chips (1210-1225 BaTI02):
  • Ceramic, High-CV MLCC (Chips All Sizes BaTI02 In Hydrothermal, alk-oxide or sol-gel):
  • Ceramic, Specialty Capacitors:
  • Tantalum, Molded Chip A Case (Manganese Cathode):
  • Tantalum, Molded Chip B Case (Manganese Cathode):
  • Tantalum, Molded Chip C Case (Manganese Cathode):
  • Tantalum, Molded Chip D Case (Manganese Cathode):
  • Tantalum, Molded Chip E/X Case (Manganese Cathode):
  • Tantalum, Molded Chip A Case (Polymer Cathode):
  • Tantalum, Molded Chip B Case (Polymer Cathode):
  • Tantalum, Molded Chip C Case (Polymer Cathode):
  • Tantalum, Molded Chip D Case (Polymer Cathode):
  • Tantalum, Molded Chip E/X Case (Polymer Cathode):
  • Plastic Film; Axial Leaded Plastic Film (Polyethylene Terephthalate Plastic Film Dielectric):
  • Plastic Film: Film Chips (PPS, PEN and PET Films):
  • Plastic Film: Radial Leaded Plastic Film (PET Plastic Film):
  • Plastic Film: Suppression Film (Snubber/X&Y):

RESISTORS:

Thick Film Chip, Network and Array; Nichrome Metal Film, Tin-Oxide, Wirewound, Thin Film, Carbon Film;

  • Thick Film Chip Resistors (0201 Case Size Ru02 Thick Film on 96% Alumina)
  • Thick Film Chip Resistors (0402 Case Size Ru02 Thick Film on 96% Alumina)
  • Thick Film Chip Resistors (0603 Case Size Ru02 Thick Film on 96% Alumina)
  • Thick Film Chip Resistors (0805 Case Size Ru02 Thick Film on 96% Alumina)
  • Thick Film Chip Resistors (1206 Case Size Ru02 Thick Film on 96% Alumina)
  • Thick Film Chip Resistors (1210-2512 Case Size Ru02 Thick Film on 96% Alumina)
  • Carbon Film Resistor, Axial and Radial Leaded:
  • Metal Foil: (Nickel + Chromium Metal Foil in Axial, Radial and SMD Configurations):
  • Tin-Oxide: (Antimony - 10 Resistive Element, also called Flameproof and High Voltage Resistors:
  • Nichrome Film (Nickel + Chromium Deposited Metal Film on Ceramic Core):
  • Power Wirewound (Nickel + Chromium Wire wound on a Ceramic Core):
  • Resistor Network, The Multichip Array Network:
  • Resistor Network, Coated SIP Network
  • Resistor Network, SMD DIP Network:
  • Resistor Network, Molded DIP Network
  • Resistor Network, Molded SIP Network
  • Thin Film Chips 0402 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films
  • Thin Film Chips 0603 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films
  • Thin Film Chips 0805 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films:
  • Thin Film Chips 1206 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films:
  • Thin Film Chips 1210-2512 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films

INDUCTORS:

Horizontal Wirewound Inductors; Wirewound Chip Coil inductors, ferrite beads and bead arrays; multilayered chip inductors, axial and radial leaded inductors, ferrite cores, thin film inductor chips.

  • Axial and Radial Leaded Micro-Inductors:
  • Chip Coils:
  • Ferrite Beads:

RAW MATERIALS:

  • Nickel (For Electrode Powder & Paste)
  • Copper (For Termination Powder & Paste):
  • Aluminum (For Capacitor Foil; Alumina Substrates):
  • Zinc (Zinx-Oxide):
  • Palladium (Electrode Powders & Pastes):
  • Ruthenium (For Resistor Inks):
  • Tantalum Ore, Powder and Wire (For Tantalum Anode):
  • Silver (For Electrodes and Terminations):
  • Crude Oil (For Plastics):

GLOBAL MARKETS:

The report makes future price, value and volume forecasts for each passive component as well as a historical record of demand cycles over the past decade and forecasts the value, volume and pricing for passive components by type from FY 2021 to 2026.

  • Value and Volume of Consumption for Passive Components By Type and Configuration: Capacitors, Resistors and Inductors-FY 2021-2026 Forecasts
  • Average Unit Selling prices for Passive Electronic Components by Type and Configuration: Capacitors, Resistors and Inductors-FY 2021-2026 Forecasts
  • 120 Months of Lead Time data for 53 Sub-Types of Passive Electronic Component and Their Raw Materials
  • Sales of Passive Electronic Components by Type and World Region: FY 2021-2026
  • Sales of Passive Electronic Components by Type and End-Use Market Segment: FY 2021-2026
  • Market Shares for Manufacturers of Passive Electronic Components by Type and Configuration: FY 2021
  • Forecasts for Capacitors, Resistors and Inductors by Type and Configuration: FY 2021-2026

END-USE MARKETS:

The study estimates global consumption value by end-use market segment, including circuit applications such as:

  • Wireless Handsets
  • Computer and business machine markets
  • Consumer audio and video imaging and home theatre end markets
  • Industrial electronics and power supplies
  • Automotive electronic sub-assemblies
  • Specialty and defense end-use markets;

REGIONAL MARKETS:

The study also addresses global consumption value by world region and key country of consumption And addresses changes in each of these localized markets in FY 2021.

  • China and SE Asia
  • Japan
  • Euope
  • Americas

MANUFACTURER MARKET SHARES:

The report also offers detailed market share data for each subset of the passive component industry including market shares in:

  • MLCC Capacitor Manufacturers: FY 2021 Global Market Shares
  • Tantalum Capacitor Manufacturers: FY 2021 Global Market Shares
  • Aluminum Electrolytic Capacitor Manufacturers: FY 2021 Global Market Shares
  • Plastic Film Capacitor Manufacturers: FY 2021 Global Market Shares
  • Thick Film Chip Resistor Manufacturers: FY 2021 Global Market Shares
  • Resistor Network, Array and IPD Manufacturers: FY 2021 Global Market Shares
  • Nichrome Metal Film Resistor Manufacturers: FY 2021 Global Market Shares
  • Tin-Oxide Resistor Manufacturers: FY 2021 Global Market Shares
  • Wirewound Resistor Manufacturers: FY 2021 Global Market Shares
  • Discrete Inductor Manufacturers: FY 2021 Global Market Shares
  • LEAD TIMES: 120 MONTHS OF DATA: March 2012-March 2021
  • CAPACITORS: Lead Times by Capacitor Dielectric, Type and Configuration by Month March 2012-March 2021
  • RESISTORS: Lead Times by Resistor Type and Configuration by Month March 2012-March 2021
  • INDUCTORS: Lead Times by Resistor Type and Configuration by Month March 2012-March 2021
  • 120 Months of Lead Time Data By Component Type and Configuration for Capacitors, Resistors and Inductors.
  • FORECASTS: 2021-2026

The report makes future price, value and volume forecasts for each passive component as well as a historical record of demand cycles over the past decade and forecasts the value, volume and pricing for the different types of passive component reviewed in the report from FY 2021 to 2026.

MANUFACTURER PROFILES:

All major vendors of Passive Components are discussed in this report, including Bourns, Chilisin, Coilcraft, Inc., KOA Corporation, Kyocera Corporation (AVX), Nichicon Corporation, Nippon Chemi-Con Corporation, Panasonic Electronic Devices Company Limited, Murata Manufacturing Company Limited, Rohm Company Limited, Rubycon Corporation, Samsung Electro-Mechanical, Sumida Electric Company Limited, Shenzhen Sunlord Electronics Corporation, TA-I Electronics Company Limited, Taiyo Yuden Corporation, TDK Corporation, TT Electronics PLC, Vishay Intertechnology, Inc., Walsin Technology Corp., and Yageo Corporation (KEMET).

This report was released in March 2021 and documents the impact of the current regional economic conditions on the passive component industry and the end-markets into which capacitors, resistors and inductors are sold. Detailed forecasts for value, volume and pricing for each year until 2026. Now in its 34th year of publication, this edition is 300 pages and includes 152 tables and graphs, The study covers fixed capacitors, linear resistors and discrete inductors in 11 sub-categories including 53 individual component markets. Our most popular report. Written by Dennis M Zogbi.