表紙
市場調查報告書
商品編碼
1064896

銅焊線市場(2021年∼2027年)

Copper Wire Bonding Market 2021-2027

出版日期: | 出版商: Orion Market Research Pvt Ltd | 英文 108 Pages | 商品交期: 2-3個工作天內

價格
  • 全貌
  • 簡介
  • 目錄
簡介

全球銅焊線的市場規模,在預測期間內預計以可觀的年複合成長率成長。牽引這個市場的主要原因,有黃金成本的上升,及汽車產業和家電產業中銅焊線的採用取得進展等。

本報告提供銅焊線市場調查,市場概要,市場的推動因素與阻礙因素的分析,市場機會,各產品類型,各用途,各地區的市場分析,主要企業的簡介等系統性資訊。

目錄

第1章 報告概要

第2章 市場概要與洞察

  • 調查範圍
  • 分析師的洞察和目前市場趨勢

第3章 市場決策要素

  • 促進因素
  • 阻礙因素
  • 市場機會

第4章 市場細分化

  • 全球銅焊線市場:各產品類型
    • 0um∼20um
    • 20um∼30um
    • 30um∼50um
    • 50um以上
  • 全球銅焊線市場:各用途
    • 半導體包裝
    • PCB
    • 其他

第5章 地區分析

  • 北美
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 義大利
    • 西班牙
    • 法國
    • 其他歐洲
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 其他亞太地區
  • 其他地區

第6章 企業簡介

  • Cirrus Logic LLC
  • Fairchild Semiconductor
  • Freescale Semiconductor
  • Fujitsu
  • Infineon Technologies
  • Integrated Silicon Solution
  • Kemet
  • Maxim Inc.
  • Micron Technology
  • Quick-Pak
目錄
Product Code: OMR2024392

Global Copper Wire Bonding Market Size, Share & Trends Analysis Report By Type (0-20 um, 20-30 um, 30-50 um, Above 50 um) By Application (Semiconductor Packaging, PCB, Others) Forecast (2021-2027)

The global copper wire bonding market is anticipated to grow at a considerable CAGR during the forecast period. The growing gold costs, as well as the rising adoption of copper wire bonding in the automotive and consumer electronics industries, are propelling the global copper wire bonding market. With rising market rivalry, both regional and global competitors are working on developing new items to maintain and strengthen their market position. To obtain an advantage over their competitors, major firms are focusing on merger and acquisition activity as well as technical development.

The global copper wire bonding market is segmented based on product type, component, technology, and application. Based on product type, the copper wire bonding market is segmented into 0-20 um, 20-30 um, 30-50 um, and above 50 um copper wire bonding. Based on application, the copper wire bonding market is segmented into semiconductor packaging, PCB, and others.

Geographically, the global copper wire bonding market covers the analysis of four major regions including North America (the US and Canada), Europe (UK, Germany, Italy, Spain, France, and Rest of Europe), Asia-Pacific (China, Japan, India, and Rest of Asia-Pacific), and the Rest of the World. Some of the companies operating in the global copper wire bonding market include Freescale Semiconductor, Micron Technology, Cirrus Logic, Fairchild Semiconductor, Maxim, Integrated Silicon Solution.

Market Segmentation

1. Global Copper Wire Bonding Market Research and Analysis by Type

2. Global Copper Wire Bonding Market Research and Analysis by Application

The Report Covers

  • Comprehensive research methodology of the global copper wire bonding market.
  • This report also includes a detailed and extensive market overview with key analyst insights.
  • An exhaustive analysis of macro and micro factors influencing the market guided by key recommendations.
  • Analysis of regional regulations and other government policies impacting the global copper wire bonding market.
  • Insights about market determinants that are stimulating the global copper wire bonding market.
  • Detailed and extensive market segments with the regional distribution of forecasted revenues.
  • Extensive profiles and recent developments of market players.

Table of Contents

1. Report Summary

  • 1.1. Research Methods and Tools
  • 1.2. Market Breakdown
    • 1.2.1. By Segments
    • 1.2.2. BY Region

2. Market Overview and Insights

  • 2.1. Scope of the Report
  • 2.2. Analyst Insight & Current Market Trends
    • 2.2.1. Key Findings
    • 2.2.2. Conclusion

3. Market Determinants

  • 3.1. Motivators
  • 3.2. Restraints
  • 3.3. Opportunities

4. Market Segmentation

  • 4.1. Global Copper Wire Bonding Market by Product Type
    • 4.1.1. 0-20 um Copper Wire Bonding
    • 4.1.2. 20-30 um Copper Wire Bonding
    • 4.1.3. 30-50 um Copper Wire Bonding
    • 4.1.4. Above 50 um Copper Wire Bonding
  • 4.2. Global Copper Wire Bonding Market by Application
    • 4.2.1. Semiconductor Packaging
    • 4.2.2. PCB
    • 4.2.3. Others

5. Regional Analysis

  • 5.1. North America
    • 5.1.1. United States
    • 5.1.2. Canada
  • 5.2. Europe
    • 5.2.1. UK
    • 5.2.2. Germany
    • 5.2.3. Italy
    • 5.2.4. Spain
    • 5.2.5. France
    • 5.2.6. Rest of Europe
  • 5.3. Asia-Pacific
    • 5.3.1. China
    • 5.3.2. India
    • 5.3.3. Japan
    • 5.3.4. Rest of Asia-Pacific
  • 5.4. Rest of the World

6. Company Profiles

  • 6.1. Cirrus Logic LLC
  • 6.2. Fairchild Semiconductor
  • 6.3. Freescale Semiconductor
  • 6.4. Fujitsu
  • 6.5. Infineon Technologies
  • 6.6. Integrated Silicon Solution
  • 6.7. Kemet
  • 6.8. Maxim Inc.
  • 6.9. Micron Technology
  • 6.10. Quick-Pak

LIST OF TABLES

  • 1. GLOBALCOPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY PRODUCT TYPE, 2020-2027 ($ MILLION)
  • 2. GLOBAL 0-20 UM COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY REGION, 2020-2027 ($ MILLION)
  • 3. GLOBAL 20-30 UM COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY REGION, 2020-2027 ($ MILLION)
  • 4. GLOBAL 30-50 UM COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY REGION, 2020-2027 ($ MILLION)
  • 5. GLOBAL MORE THAN 50 UM COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY REGION, 2020-2027 ($ MILLION)
  • 6. GLOBAL COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY APPLICATION, 2020-2027 ($ MILLION)
  • 7. GLOBALCOPPER WIRE BONDING FOR SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2020-2027 ($ MILLION)
  • 8. GLOBAL COPPER WIRE BONDING FOR PCB MARKET RESEARCH AND ANALYSIS BY REGION, 2020-2027 ($ MILLION)
  • 9. GLOBAL COPPER WIRE BONDING FOR OTHER APPLICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2020-2027 ($ MILLION)
  • 10. GLOBAL COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY GEOGRAPHY, 2020-2027 ($ MILLION)
  • 11. NORTH AMERICAN COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2020-2027 ($ MILLION)
  • 12. NORTH AMERICAN COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY PRODUCT TYPE, 2020-2027 ($ MILLION)
  • 13. NORTH AMERICAN COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY APPLICATION, 2020-2027 ($ MILLION)
  • 14. EUROPEAN COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2020-2027 ($ MILLION)
  • 15. EUROPEAN COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY PRODUCT TYPE, 2020-2027 ($ MILLION)
  • 16. EUROPEAN COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY APPLICATION, 2020-2027 ($ MILLION)
  • 17. ASIA-PACIFIC COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2020-2027 ($ MILLION)
  • 18. ASIA-PACIFIC COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY PRODUCT TYPE, 2020-2027 ($ MILLION)
  • 19. ASIA-PACIFIC COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY APPLICATION, 2020-2027 ($ MILLION)
  • 20. REST OF THE WORLD COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY PRODUCT TYPE, 2020-2027 ($ MILLION)
  • 21. REST OF THE WORLD COPPER WIRE BONDING MARKET RESEARCH AND ANALYSIS BY APPLICATION, 2020-2027 ($ MILLION)

LIST OF FIGURES

  • 1. GLOBAL COPPER WIRE BONDING MARKET SHARE BY PRODUCT TYPE, 2020 VS 2027 (%)
  • 2. GLOBAL COPPER WIRE BONDING MARKET SHARE BY APPLICATION, 2020 VS 2027 (%)
  • 3. GLOBAL COPPER WIRE BONDING MARKET SHARE BY GEOGRAPHY, 2020 VS 2027 (%)
  • 4. US COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 5. CANADA COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 6. UK COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 7. FRANCE COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 8. GERMANY COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 9. ITALY COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 10. SPAIN COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 11. REST OF EUROPE COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 12. INDIA COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 13. CHINA COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 14. JAPAN COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 15. REST OF ASIA-PACIFIC COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)
  • 16. REST OF THE WORLD COPPER WIRE BONDING MARKET SIZE, 2020-2027 ($ MILLION)