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市場調查報告書

IC裝置用傳統型暨先進封裝的全球市場:全球IC封裝產業相關綜合報告

The Worldwide Conventional and Advanced Packaging Market for IC Devices: The Most Comprehensive Report Available on the Global IC Packaging Industry

出版商 New Venture Research 商品編碼 926854
出版日期 內容資訊 英文 385 Pages
商品交期: 最快1-2個工作天內
價格
IC裝置用傳統型暨先進封裝的全球市場:全球IC封裝產業相關綜合報告 The Worldwide Conventional and Advanced Packaging Market for IC Devices: The Most Comprehensive Report Available on the Global IC Packaging Industry
出版日期: 2019年12月31日內容資訊: 英文 385 Pages
簡介

預測IC市場在2023年以前將達到4,250億美元的規模。

本報告調查了全球IC (積體電路) 市場及眾多開發給IC用的封裝設計,並提供IC裝置類型別、封裝分類別的出貨量、獲益、封裝價格預測的定量分析、先進IC封裝市場及相互連線解決方案分析及預測等。

第1章 簡介

第2章 執行摘要

第3章 IC裝置市場分析

  • 全球IC市場
  • 市場預測:裝置類型別
  • 中央處理器裝置:MPU, MCU (4-bit, 8-bit, 16-bit, 32+-bit), DSP
  • 記憶體裝置:DRAM, SRAM, Flash, ROM/EPROM, EEPROM 及其他
  • 邏輯裝置:數位雙極裝置、標準邏輯、門陣列、標準單元及PLD、顯示驅動程式及觸控螢幕、專用邏輯(消費者、電腦、通訊、汽車、多目的等)
  • 類比裝置:運算放大器、介面、電壓調節器、參考電壓、資料轉換器、特殊用途類比(消費者、電腦、通訊、汽車、產業用等)

第4章 IC封裝市場分析

  • 全球IC封裝市場
  • IC封裝家族的說明、預測

第5章 先進封裝市場

  • 先進IC封裝市場整體的預測
  • FOWLP (Fan Out Wafer Level Package)
  • multi-row QFN 封裝趨勢、預測
  • MCP (Multichip Packaging) 技術的概要
  • 堆疊型多晶片封裝市場部門
  • 封裝體系市場部門

第6章 相互連線技術、解決方案

  • 相互連線技術的概要
  • 相互連線市場的預測
  • 打線接合
  • 覆晶技術
  • 覆晶封裝市場的趨勢、預測
  • 覆晶封裝裝置市場的趨勢、預測
  • 鑿孔裸晶覆晶技術市場趨勢、預測
  • TSV (矽導通孔)

附錄:IC封裝用語集

目錄
Product Code: pkg19bro-RS

Report Highlights

Worldwide Integrated Circuit Market Forecasts, 2018-2023:

  • By Device Type and Function
  • By Packaging Type
  • By Major World Region

Worldwide IC Packaging Market Forecasts, 2018-2023:

  • By Package Type
  • By IC Type
  • By I/O Range

Advanced Packaging Market Forecasts, 2018-2023:

  • For Fan-Out WLPs
  • For Multi-Row QFNs
  • For Stacked Multi-Chip Packaging
  • For System-in-Package Solutions

Interconnection Technologies Forecasts, 2018-2023:

  • For Wire Bonding by IC Packaging Type
  • For Flip Chip by IC Device Type and Packaging Type
  • For Through-Silicon Vias

Synopsis

‘The Worldwide Conventional and Advanced Packaging Market for IC Devices, 2019 Edition, a new report from New Venture Research (NVR) ’, examines the global marketplace of integrated circuits (ICs) and the many packaging designs developed for ICs. This comprehensive report presents detailed analysis of a vast and vibrant IC market that is expected to reach $425 billion by 2023. The 385-page report provides insightful analysis of major market trends affecting the IC industry, and presents more than 170 tables quantifying both the IC devices and IC packaging markets. In addition, dozens of graphical figures provide an alternative perspective for understanding the underlying data. The report provides extensive and detailed quantitative analysis with forecasts for unit shipments, revenues and package pricing for 30 separate IC device types as well as 14 major packaging categories comprising 44 IC packaging market segments.

Also covered are advanced IC packaging market segments and interconnection solutions. Virtually every table presents year-end data for 2018, plus five-year forecasts from 2019 through 2023.

The report is arranged into six chapters. An Introductory chapter (Chapter 1) and the Executive Summary (Chapter 2) present a short overview of the report with a description of its major conclusions and methodology. The remaining chapters focus on four major topics of discussion.

Chapter 3, Integrated Circuit Device Market Analysis, starts with a top-level view of the IC devices market with tables and figures detailing the market in terms of 30 distinct IC devices, plus additional segmentation by device functions (processors, logic, memory and analog), and major world regions. The chapter then presents unit shipment and revenue forecasts of each device type in terms of the packaging types used for each.

Worldwide IC Device Revenues, by Function, 2018-2023

Chapter 4, IC Packaging Market Analysis, examines the IC packaging market in deep granular detail. Tables provide historical data and forecasts of unit shipments, revenues and package ASP for 14 packaging "families" with additional segmentation based on the number of I/Os for the packaging types. Altogether, there are 44 market segments analyzed, each in terms of the IC devices embedded in the package.

Chapter 5: Advanced Packaging Markets, provides an in-depth discussion of the technologies and market trends of advanced packaging solutions:

  • Fan-out wafer-level packaging (FOWLP)
  • Multi-row QFN packaging (MRQFN)
  • Vertically stacked multichip packages: TSOPs, QFNs, FBGAs, and WLPs
  • System-in-packages (SiPs): package-on-packages, packagein-packages and multichip modules

Chapter 6: Interconnection Technologies and Solutions, provides a comprehensive examination of wire bonding and flip chip technology, in terms of both unit shipments and revenues. The analysis of flip chip markets includes forecasts of specific devices and packaging types. The chapter also examines the market potential of through-silicon vias (TSVs) for 2.5D and 3D packaging.

‘The Worldwide Conventional and Advanced Packaging Market for IC Devices, 2019 Edition’ continues NVR's leadership position in analyzing IC device markets and IC packaging products and technologies. This report is an effective and economical tool for any company interested in competing in the semiconductor industry or who may be simply looking for an aid in assessing the present and future of this dynamic industry.

About The Author

Jerry Watkins is an independent senior analyst with more than 20 years of direct experience in the field of market research and consulting. He has worked for leading research companies such as Frost & Sullivan, Lucid Information Services, and NSI Research, both in management and as a writer. Mr. Watkins has authored many syndicated reports, previously in the telecommunications and office automation sectors and more recently in the semiconductor industry, writing on subjects that include IC packaging and merchant embedded computing. He holds two university degrees, including a B.A. in History and an M.A. in International Studies, but he feels that market research best fulfills his lifelong passion for inquiry into difficult subject matter and making it comprehensible to a wide audience. Mr. Watkins has lived and worked in Silicon Valley for most of his career.

Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Integrated Circuit Device Market Analysis

  • Worldwide Integrated Circuit Market
    • Total Market Forecasts
    • Regional Market Trends and Forecasts
  • Market Forecasts by Device Type
  • Processor Devices: MPUs, MCUs (4-bit, 8-bit, 16-bit, 32+-bit), DSPs
  • Memory Devices: DRAM, SRAM, Flash, ROM/EPROM, EEPROM and Other
  • Logic Devices: Digital Bipolar Devices, Standard Logic, Gate Arrays, Standard Cell and PLDs, Display Drivers and Touch Screen Controllers, Special-Purpose Logic (Consumer, Computers, Communications, Automotive, Multipurpose and Other)
  • Analog Devices: Amplifiers and Comparators, Interfaces, Voltage Regulators and References, Data Converters, Application-Specific Analog (Consumer, Computers, Communications, Automotive, Industrial and Other)

Chapter 4: IC Packaging Market Analysis

  • Worldwide IC Packaging Market
    • Total IC Packaging Market Forecasts
    • Package Pricing Trends
    • IC Packaging Market by I/O Count
  • IC Package Families Descriptions and Forecasts
    • Dual In-Line Packaging (DIP) Market
    • Transistor Outline Packaging (TO) Market
    • Small Outline Transistor (SOT) Packaging Market
    • Small Outline Packaging (SO) Market
    • Thin Small Outline Packaging (TSOP) Market
    • Chip Carrier (CC) Market
    • Quad Flat Pack (QFP) Market
    • Dual Flat Pack No-Lead Packaging (DFN) Market
    • Quad Flat Pack No-Lead Packaging (QFN) Market
    • Pin Grid Array Packaging (PGA) Market
    • Ball Grid Array Packaging (BGA) Market
    • Fine Pitch Ball Grid Array Packaging (FBGA) Market
    • Wafer-Level Packaging (WLP) Market
    • Direct Chip Attached (DCA) Market

Chapter 5: Advanced Packaging Markets

  • Total Advanced IC Packaging Market Forecasts
  • Fan-Out Wafer-Level Packaging
    • Conventional WLPs versus Fan-Out WLPs
    • Fan-Out WLP Market Trends and Forecasts
  • Multi-Row QFN Packaging Trends and Forecasts
  • Overview of Multichip Packaging Technology (MCP)
    • Topic covers: Types of Multichip Packages, Benefits and Shortcomings,Multichip Packaging Challenges and Solutions, Techniques for Wafer Thinning
    • MCP Total Forecasts
  • Stacked Multichip Packaging Market Segments
    • Stacked TSOP Market Trends and Forecasts
    • Stacked QFN Market Trends and Forecasts
    • FBGA Market Trends and Forecasts
    • Stacked WLP Market Trends and Forecasts
  • System-in-Package Market Segments
    • Total SiP Market Trends and Forecasts
    • Package-on-Package Market Forecasts
    • Package-in-Package Market Forecasts
    • Multichip Modules Market Forecasts
    • Stacked WLPs within SiPs Market Forecasts

Chapter 6: Interconnection Technologies and Solutions

  • Interconnection Technologies Overview
  • Interconnection Market Forecasts
  • Wire Bonding
    • Wire Bonding Methods
    • Wire Materials
    • Wire Bonding Market Trends and Forecasts
  • Flip Chip
    • The Flip Chip Process
  • Flip Chip Packaging Market Trends and Forecasts
  • Flip Chip Package Device Market Trends and Forecasts
    • Flip Chip Devices: MPUs, 32+-bit MCUs, DSPs, Gate Arrays, Standard Cell and PLDs, Special-Purpose Logic (Consumer, Computer, Communications, Automotive, Multipurpose and Other), DRAM, SRAM, Flash, Application-Specific Analog (Computer, Communications)
  • Bare Die Flip Chip Market Trends and Forecasts
  • Through-Silicon Vias
    • Forecasts of the Through-Silicon Via Market Segment

Appendix Glossary of IC Packaging Terms