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市場調查報告書

陣列IC封裝市場

The Array IC Packaging Market - 2013 Edition

出版商 New Venture Research 商品編碼 289103
出版日期 內容資訊 英文 110 Pages
商品交期: 最快1-2個工作天內
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陣列IC封裝市場 The Array IC Packaging Market - 2013 Edition
出版日期: 2013年10月30日 內容資訊: 英文 110 Pages
簡介

本報告提供陣列IC封裝市場相關調查、產業概要、產業的經濟狀況,及市場預測的摘要,為您概述為以下內容。

第1章 簡介

第2章 摘要整理

第3章 產業現狀

  • 經濟概要
  • 產業概要

第4章 BGA/LGA/CGA 及 FBGA/FLGA包裝解決方案

  • 包裝類型、I/O點數
  • 新產品推出:京瓷, SLC Technologies 及 IBM
  • BGA, LGA, CGA, FBGA的預測及FLGA包裝解決方案

第5章 四方扁平封裝(QFP)及扇入QFN包裝

  • 概要
  • 產品介紹
  • 市場預測

第6章 晶圓層級的包裝及扇出WLP

  • WLP或覆晶式組裝?
  • 層級
  • WLP的優點
  • 適用底部填充的晶圓
  • 晶圓試驗
  • 對PCB的合規性
  • 課題、解決方案
  • WLP的降低成本
  • 目前應用
  • WLP的多用途性
  • 扇出WLP的課題
  • 新產品推出
    • Deca Technologies
    • J-Devices Corporation
    • NANIUM S.A.
    • STATS ChipPAC Ltd.
    • Teramikros, Inc.

附錄A:網站地址指南

附錄B:用語

圖表

目錄

An Extension of the Most Comprehensive Report Available On The Global IC Packaging Industry

Small form factor, high speed and performance, and high bandwidth capability with low battery consumption are desired traits for many packaging solutions for integrated circuits (ICs). High demand for handheld and high performance electronic devices is the driving factor behind the IC packaging needs.

IC packages with an array layout, as opposed to a perimeter layout, allow for more I/O density in a smaller form factor, meeting the needs outlined above. Thus demand for array IC packages is on the rise, as additional I/O connections are fit beneath the package than traditional leadframe packages, providing them with form factor benefits. BGA and FBGA package solutions also reach into I/O levels which are unreachable by traditional leadframe packages, as the substrate can be enlarged to fit a large number of solder balls, land pads, or columns beneath it to attach to the PCB.

This new report, The Array IC Packaging Market - 2013 Edition, encompasses the array IC packages BGA, LGA, CGA, FBGA, FLGA, Fan-in QFN, WLP and Fan-out WLPs. Array IC packages can accommodate additional I/O connections beneath the package to connect to the printed circuit board (PCB) when compared to leadframe packages with only a single row of interconnections around the periphery of the package.

This enables:

  • A smaller footprint on the PCB
  • Shorter traces through the package to the PCB,
  • thus higher speed and improved performance
  • Higher bandwidth capability
  • Less power consumption, particularly important in
  • battery-operated devices

Chapter 4 of this report covers BGAs and FBGAs solutions. BGAs and FBGAs do not have to have solder balls beneath the package substrate as the package can have just land pads or columns instead of balls for the second level interconnection, which connects the package to the printed circuit board. Forecasts in terms of units and revenue are provided for BGA, LGA, CGA, FBGA, and FLGA package solutions including a wide range of I/O counts of 3-18, 20-32, 34-100, 102-304, 308-999, and 1,000 and up.

Chapter 5 examines the Quad Flatpack No-lead, or QFN market, with emphasis on the Fan-in QFN. The Fan-in QFN has additional rows on this leadframe package, turning it into a leadframe version of an array IC package, and one that can reach even further into the market which would otherwise be covered by the larger QFP, but with a smaller form factor. Additional rows are "Fanned-in" from the traditional perimeter-style leadframe, making this chip scale package unique.

Chapter 6 contains information on Wafer-Level Packages, or WLPs, which are the smallest package solution on the market, being die sized. This unique package is formed while the die is still part of an uncut wafer, the only package to be created or assembled in this manner. WLPs are array packages by nature, but since all the solder balls or bumps then must fit beneath the die itself, this limits the number of I/O which is on these packages.

The solution to this is the Reconfigured or Fan-out Wafer- Level Packages (Fan-out WLPs), for which the available surface available for I/O interface to the PCB is expanded beyond the perimeter of the die by virtue of a backside overmold. All these processes are done on an uncut wafer, so that manufacturing efficiencies are maximized.

The Array IC Packaging Market - 2013 Edition will provide you with an effective and economical tool for assessing the future of this market.

Report Highlights

  • Industry Overview
  • The Economic State of the Industry
  • Summary of Market Forecasts, 2012-2017
    • BGA/LGA/CGA and FBGA/FLGA Package Solutions
    • Quad Flatpack No-Lead and Fan-in QFN Packages
    • Wafer-Level Packages and Fan-out WLPs

Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: State of the Industry

  • Economic Overview
  • Industry Overview

Chapter 4: BGA/LGA/CGA and FBGA/Package Solutions, 2012 - 2017

Package Types:

  • BGA/LBGA
  • BGA/LGA/CGA
  • BGA/LGA
  • BGA/LGA/CGA
  • Total BGA/LGA/CGA
  • FBGA/FLGA
  • FBGA/FLGA
  • FBGA/FLGA
  • FBGA/FLGA
  • FBGA/FLGA
  • FBGA/FLGA
  • Total FBGA/FLGA

I/O Count:

  • 34-100
  • 104-304
  • 308-999
  • +1000
  • 4-18
  • 20-32
  • 34-100
  • 104-304
  • 308-999
  • +1000
  • New Product Introductions
  • Kyocera, SLC Technologies and IBM
  • Forecasts for BGA, LGA, CGA, FBGA and
  • FLGA Package Solutions

Chapter 5: Quad Flat Pack and Fan-in QFN Packages

  • Overview
  • Product Introductions
  • Market Forecasts for QFN Fan-in QFN Packages

Chapter 6: Wafer-Level Packages and Fan-out

  • WLPs
  • WLP or Flip Chip on Board?
  • The Layers
  • Benefits of WLP
  • Wafer Applied Underfill
  • Wafer Testing
  • Compliance to the PCB
  • Issues and Solutions
  • Cost Reduction for WLPs
  • Current Applications
  • Versatility of the WLP
  • Fan-out WLP Challenges
  • New Product Introductions
    • Deca Technologies
    • J-Devices Corporation
    • NANIUM S.A.
    • STATS ChipPAC Ltd.
    • Teramikros, Inc.

Appendix A: Web Address Guide

Appendix B: Glossary of Terms

List of Tables

  • Table 4-1: BGA / LGA 34-100 I/O Package Units, 2012-2017
  • Table 4-2: BGA / LGA / CGA 104-304 I/O Package Units, 2012-2017
  • Table 4-3: BGA / LGA 308-999 I/O Package Units, 2012-2017
  • Table 4-4: BGA / LGA 1,000+ I/O Package Units, 2012-2017
  • Table 4-5: BGA / LGA / CGR Package Units, 2012-2017
  • Table 4-6: FBGA / FLGA 4-18 I/O Package Units, 2012-2017
  • Table 4-7: FBGA / FLGA 20-32 I/O Package Units, 2012-2017
  • Table 4-8: FBGA / FLGA 34-100 I/O Package Units, 2012-2017
  • Table 4-9: FBGA / FLGA 104-304 I/O Package Units, 2012-2017
  • Table 4-10: FBGA / FLGA 308-999 I/O Package Units, 2012-2017
  • Table 4-11: FBGA / FLGA 1,000 + I/O Package Units, 2012-2017
  • Figure 4-12: FBGA / FLGA 1,000 + I/O Units by Percent, 2012
  • Table 4-13: FBGA / FLGA Package Units, 2012-2017
  • Table 5-1: Fan-in QFN/QFP Units, 2012-2017
  • Table 5-2: Fan-in QFN Units, 2012-2017
  • Table 6-1: WLP Forecast, 2012-2017
  • Table 6-2: Fan-out WLP Forecast, 2012-2017

List of Figures

  • Figure 4-1: CSP on Test Card
  • Figure 4-2: BGA / LGA 34-100 I/O Units, 2012
  • Figure 4-3: BGA / LGA / CGA 104-304 I/O Units, 2012
  • Figure 4-4: BGA / LGA 308-999 I/O Units, 2012
  • Figure 4-5: BGA / LGA 1.000+ I/O Units, 2012
  • Figure 4-6: BGA / LGA / CGR Units, 2012 vs. 2017
  • Figure 4-7: FBGA / FLGA 4-18 I/O Units, 2012
  • Figure 4-8: FBGA / FLGA 20-32 I/O Units, 2012
  • Figure 4-9: FBGA / FLGA 34-100 I/O Units, 2012
  • Figure 4-10: FBGA / FLGA 104-304 I/O Units, 2012
  • Figure 4-11: FBGA / FLGA 308-999 I/O Units, 2012
  • Figure 4-12: FBGA / FLGA 1,000 + I/O Units, 2012
  • Figure 5-1: QFN and Fan-in QFN Units
  • Figure 5-2: QFN and Fan-in QFN Revenue
  • Figure 6-1: Process Steps of Redistribution
  • Figure 6-2: Adaptive Patting Process Flow
  • Figure 6-3: Adaptive Pattern Design
  • Figure 6-4: Fan-out Package With Adaptive Pattern
  • Figure 6-5: WFOP Final Package
  • Figure 6-6: WFOP Package Drawing
  • Figure 6-7: WFOP Solder Ball Attachment
  • Figure 6-8: 3-D Stacked Version of the WFOP
  • Figure 6-9: Two Layer RDL Stack-up
  • Figure 6-10: WLP and Fan-out WLP Unit Growth
  • Figure 6-11: WLP and Fan-out WLP Revenue Growth
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