The Array IC Packaging Market - 2013 Edition
|出版商||New Venture Research||商品編碼||289103|
|出版日期||內容資訊||英文 110 Pages
|陣列IC封裝市場 The Array IC Packaging Market - 2013 Edition|
|出版日期: 2013年10月30日||內容資訊: 英文 110 Pages||
Small form factor, high speed and performance, and high bandwidth capability with low battery consumption are desired traits for many packaging solutions for integrated circuits (ICs). High demand for handheld and high performance electronic devices is the driving factor behind the IC packaging needs.
IC packages with an array layout, as opposed to a perimeter layout, allow for more I/O density in a smaller form factor, meeting the needs outlined above. Thus demand for array IC packages is on the rise, as additional I/O connections are fit beneath the package than traditional leadframe packages, providing them with form factor benefits. BGA and FBGA package solutions also reach into I/O levels which are unreachable by traditional leadframe packages, as the substrate can be enlarged to fit a large number of solder balls, land pads, or columns beneath it to attach to the PCB.
This new report, The Array IC Packaging Market - 2013 Edition, encompasses the array IC packages BGA, LGA, CGA, FBGA, FLGA, Fan-in QFN, WLP and Fan-out WLPs. Array IC packages can accommodate additional I/O connections beneath the package to connect to the printed circuit board (PCB) when compared to leadframe packages with only a single row of interconnections around the periphery of the package.
Chapter 4 of this report covers BGAs and FBGAs solutions. BGAs and FBGAs do not have to have solder balls beneath the package substrate as the package can have just land pads or columns instead of balls for the second level interconnection, which connects the package to the printed circuit board. Forecasts in terms of units and revenue are provided for BGA, LGA, CGA, FBGA, and FLGA package solutions including a wide range of I/O counts of 3-18, 20-32, 34-100, 102-304, 308-999, and 1,000 and up.
Chapter 5 examines the Quad Flatpack No-lead, or QFN market, with emphasis on the Fan-in QFN. The Fan-in QFN has additional rows on this leadframe package, turning it into a leadframe version of an array IC package, and one that can reach even further into the market which would otherwise be covered by the larger QFP, but with a smaller form factor. Additional rows are "Fanned-in" from the traditional perimeter-style leadframe, making this chip scale package unique.
Chapter 6 contains information on Wafer-Level Packages, or WLPs, which are the smallest package solution on the market, being die sized. This unique package is formed while the die is still part of an uncut wafer, the only package to be created or assembled in this manner. WLPs are array packages by nature, but since all the solder balls or bumps then must fit beneath the die itself, this limits the number of I/O which is on these packages.
The solution to this is the Reconfigured or Fan-out Wafer- Level Packages (Fan-out WLPs), for which the available surface available for I/O interface to the PCB is expanded beyond the perimeter of the die by virtue of a backside overmold. All these processes are done on an uncut wafer, so that manufacturing efficiencies are maximized.
The Array IC Packaging Market - 2013 Edition will provide you with an effective and economical tool for assessing the future of this market.