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市場調查報告書

競爭情報簡報-全球數據中心芯片市場:英特爾的解調依賴於執行,但競爭對手在新工藝技術方面做得更多

Competitive Intelligence Briefing - Data Center Chips: Intel's Comeback Hinges on Execution, as Rivals Make Further Inroads with New Process Technologies

出版商 MTN Consulting, LLC 商品編碼 1023002
出版日期 內容資訊 英文 23 Pages
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價格
競爭情報簡報-全球數據中心芯片市場:英特爾的解調依賴於執行,但競爭對手在新工藝技術方面做得更多 Competitive Intelligence Briefing - Data Center Chips: Intel's Comeback Hinges on Execution, as Rivals Make Further Inroads with New Process Technologies
出版日期: 2021年08月12日內容資訊: 英文 23 Pages
簡介

概述

在利潤豐厚的數據中心芯片市場,由於供應鏈短缺和 CCOVID-19 感染的蔓延,市場競爭正在加劇。這其中的核心是英特爾和AMD的較量,隨著英特爾推遲發佈最新的10nm數據中心CPU "Ice Lake" ,AMD似乎佔據了優勢。此外,英特爾已將下一代 CPU "Sapphire Rapids Xeon" 的發佈推遲至 1Q22。這些代價高昂的延誤迫使英特爾提高製造和研發能力,在亞利桑那州的兩家芯片工廠投資 200 億美元,在以色列的芯片研發中心投資 6 億美元,這是一個時間表。儘管存在這些障礙,英特爾在數據中心芯片市場上佔有壓倒性的超過 90% 的份額。但由於被AMD吃掉,其市場份額正在緩慢下降。 AMD 出現的主要原因之一是其製造策略。 AMD 已將其負擔轉移到了台積電等擁有先進工藝技術的專業代工廠。因此,明年 AMD 將發佈先進的 5nm EPYC Genoa 芯片,而 Intel 仍將提供 10nm(或 Intel 7)Sapphire Rapids Xeon 芯片。

來自文中的插圖

本報告分析了全球數據中心芯片市場的最新競爭趨勢,對產品和技術、市場基本結構和商業模式、當前技術發展水平和未來路線圖以及主要因素進行了概述。為您提供當前投資發展趨勢、企業未來前景、行業結構調整動向、重點初創企業概況與前景等信息。

分析範圍

本報告中提及的公司/組織名單:

  • Alibaba
  • Alphabet (Google Cloud Platform, or GCP)
  • Amazon (Amazon Web Services, or AWS)
  • AMD
  • Ampere Computing
  • Analog Devices
  • Annapurna Labs
  • Arm Holdings
  • Cerebras Systems
  • Cisco Systems
  • Enflame
  • Facebook
  • Fujitsu Limited
  • Fungible
  • GSK
  • Habana Labs
  • HPE
  • Intel
  • Juniper Networks
  • Lawrence Livermore National Laboratory
  • Los Alamos National Laboratory
  • Marvell Technology
  • Micron
  • Microsoft (Azure)
  • Nutanix
  • Nvidia
  • Qualcomm
  • Quanta Computer
  • RIKEN
  • Samsung Electronics
  • Shenzhen Baoan Bay Tencent Cloud Computing
  • SiFive
  • SK Hynix
  • Softbank Vision Fund
  • Swiss National Supercomputing Centre
  • Tachyum
  • Tencent
  • Tokyo Electron Devices
  • TSMC
  • Xilinx

目錄

  • 總結 (p3)
  • 執行摘要 (p4-5)
  • 數據中心架構 (p6-7)
  • 數據中心服務器佈局 (p8)
  • 商業模式(第 9-10 頁)
  • 芯片製造商戰略和數據中心路線圖:英特爾、AMD、英偉達 (p11-15)
  • 主要產品分析:Xeon/EPYC/Altra (ARM) (p16-17)
  • 投資/創新/人力資源:英特爾、AMD、英偉達 (p18-19)
  • WNO(網絡規模網絡運營商)向後整合的影響 (p20)
  • 尖端行業值得關注的初創企業 (p21-22)
  • 附錄 (p23)
目錄
Product Code: GNI-12082021-1

Summary

The battle is getting intense in the lucrative data center chips market amid supply chain shortages and delays caused by Covid-19 pandemic. Central to this battle is the Intel-AMD rivalry in which AMD seems to be attaining thrust, thanks to Intel's production delays in the launch of its latest 10nm data center CPU, Ice Lake. Intel also delayed the launch of the next-generation Sapphire Rapids Xeon CPU to 1Q22. The costly delays have pushed Intel to boost its manufacturing and R&D capabilities: it will spend US$20B on two chip plants in Arizona and $600M for a chip R&D center in Israel. Despite the roadblocks, Intel still commands a dominant +90% share of the data center chips market. However, that share has been declining gently with AMD eating into the pie. One of the key reasons for AMD's rise is its manufacturing strategy - it has transferred that burden to specialized foundries such as TSMC which boasts advanced process technologies. The result - AMD will be launching advanced 5nm EPYC Genoa chips next year, while Intel would still be offering 10nm (or Intel 7) Sapphire Rapids Xeon chips.

VISUALS

To spice up the competition further, GPU maker Nvidia will enter the server CPU market in 2023 with ARM-based CPU chips codenamed "Grace". The move is a response to Intel's bid to dent Nvidia's stronghold in the server GPU market. Late last year, Intel launched its first GPU for data centers, Intel Server GPU. Also impacting sales prospects for Intel, AMD and Nvidia is the booming webscale sector of network operators: large WNOs are weaning off their Intel chip dependency by developing in-house chip designing capabilities. Further, a flurry of PE/VC-backed emerging start-ups developing data center chips is entering the scene. One of the key reasons for WNOs' backward integration and start-ups disrupting the server CPU market is ARM. This pure play "design house" licenses its design architecture to both chip and tech companies for further customization and development, and it is gaining unprecedented traction in the data center space. And then there are geopolitical risks associated with semiconductors. As mentioned in our previously published report, clearly the semiconductor sector is an important element of the growing technology rivalry between the US and China.

With all these factors at play, Intel's revamped leadership has announced several action items under its "IDM 2.0" strategy, including partnering with third-party foundries while keeping (and expanding) its fabs to overcome production roadblocks, along with extending its own foundry services by getting chip designers and webscalers to build customized chips on Intel's fabs. While Intel's plan to turnaround and reclaim leadership by 2025 looks strong, all eyes will be on the execution of plans from the new leadership - given the shift in market landscape and Intel's own blemishes in the recent past.

Coverage:

Companies and organizations mentioned in this report include:

  • Alibaba
  • Alphabet (Google Cloud Platform, or GCP)
  • Amazon (Amazon Web Services, or AWS)
  • AMD
  • Ampere Computing
  • Analog Devices
  • Annapurna Labs
  • Arm Holdings
  • Cerebras Systems
  • Cisco Systems
  • Enflame
  • Facebook
  • Fujitsu Limited
  • Fungible
  • GSK
  • Habana Labs
  • HPE
  • Intel
  • Juniper Networks
  • Lawrence Livermore National Laboratory
  • Los Alamos National Laboratory
  • Marvell Technology
  • Micron
  • Microsoft (Azure)
  • Nutanix
  • Nvidia
  • Qualcomm
  • Quanta Computer
  • RIKEN
  • Samsung Electronics
  • Shenzhen Baoan Bay Tencent Cloud Computing
  • SiFive
  • SK Hynix
  • Softbank Vision Fund
  • Swiss National Supercomputing Centre
  • Tachyum
  • Tencent
  • Tokyo Electron Devices
  • TSMC
  • Xilinx

Table of Contents

  • Abstract (p3)
  • Executive Summary (p4-5)
  • Data Center Architecture (p6-7)
  • Data Center Server Layout (p8)
  • Business Model (p9-10)
  • Chipmaker Strategy & Roadmap for Data Centers: Intel, AMD, and Nvidia (p11-15)
  • Product Offerings Analysis: Xeon vs. EPYC vs. Altra (ARM) (p16-17)
  • Investments, Innovation, and Talent: Intel, AMD, and Nvidia (p18-19)
  • Impact of WNO Backward Integration (p20)
  • Chip start-ups to watch out for (p21-22)
  • Appendix (p23)

List of Tables and Figures

  • 1. Data Center Architecture
  • 2. Data Center Server Layout
  • 3. Semiconductor Value Chain
  • 4. Data Center CPU Roadmap
  • 5. Data Center GPU Roadmap
  • 6. Top-of-the-Line Data Center CPU Comparison