封面
市場調查報告書
商品編碼
989461

外延設備市場的增長,趨勢,COVID-19的影響和預測(2021-2026)

Epitaxy Equipment Market - Growth, Trends, and Forecasts (2022 - 2027)

出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

價格

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

在預測期2021-2026年,外延設備市場預計將以20%的複合年增長率增長。預計市場增長將歸因於新LED設備的不斷推出及其在電力行業中的廣泛使用。

此外,它越來越多地用於諸如衛星通信之類的無線通信中。 AIXTRON SE為Sumitomo Electric Device Innovations提供了8x6英吋晶圓配置,以擴大SiC上的GaN射頻(RF)器件的生產能力,以支持快速擴展的5G移動網絡的增長,並提供了AIX G5 +工具。

替代非矽基襯底(例如GaAs,GaN,SiC和InP)的增長為市場開闢了新途徑。另外,在電力電子市場中越來越多地採用諸如SiC襯底之類的寬帶隙材料。運輸,可再生能源,電機驅動和電力應用中的電力需要降低功耗。

新的冠狀病毒的爆發將對2020年下半年的矽晶片銷售產生負面影響,還將影響2021年的價格談判。中國的小直徑矽晶圓廠受到2月份利用率下降30%至50%的影響。但是,到3月底,中國矽晶片製造商的利用率已恢復到80%左右。鑑於中國的複蘇,如果全球市場宣佈採取適當的刺激措施,則市場預計將呈V形復甦。

該報告調查了外延設備市場,並提供了該市場的概述,以及按技術,應用和地區劃分的趨勢,以及進入該市場的公司的概況。

目錄

第1章簡介

第2章調查方法

第3章執行摘要

第4章市場動態

  • 市場概況
  • 市場驅動力
    • 不斷推出破壞性的LED設備
    • 擴大電力使用是增長因素
  • 市場限制
    • 與設計有關的複雜性
  • 搬運工五力分析
    • 新進入者的威脅
    • 買方/消費者買方的議價能力
    • 供應商的談判能力
    • 替代產品威脅
    • 競爭對手之間的敵對關係
  • 產業價值鏈分析
  • 評估Covid-19對行業的影響

第5章市場細分

  • 技術
    • MOCVD
    • HTCVD
    • MBE
  • 按應用
    • 光子學
    • 半導體
    • 寬帶隙材料
    • 其他
  • 按地區
    • 北美
    • 歐洲
    • 亞太地區
    • 其他地區

第6章競爭情況

  • 公司簡介
    • II-VI Incorporated
    • Applied Materials, Inc.
    • Intelligent Epitaxy Technology, Inc.
    • DOWA Electronics Materials Co., Ltd.
    • Optowell Co.,Ltd
    • Aixtron SE
    • NuFlare Technology, Inc. (Toshiba Electronic Devices and Storage Corporation)
    • Siltronic AG
    • Tokyo Electron Limited

第7章 投資分析

第8章 市場機會與動向

簡介目錄
Product Code: 69679

The Epitaxy Equipment Market is expected to grow at a CAGR of 20% during the forecast period 2021 - 2026. The growth of the market can be attributed to the continuous introduction of new LED devices and their growing applications in power industry.

Key Highlights

  • Further, they are being increasingly used in wireless applications like satellite communication. AIXTRON SE provided Sumitomo Electric Device Innovations, Inc.with an AIX G5+ tool with 8x6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC radio frequency (RF) devices for aiding the growth of rapidly expanding 5G mobile networks.
  • The growth of alternative non-silicon-based substrates such as GaAs, GaN, SiC and InP are creating new avenues for the market. Moreover, wide-bandgap materials like SiC substrates are being increasingly deployed in the power electronics market. Power consumption reduction is necessary for electrification of transportation, renewable energy, motor drives and power supply applications.
  • The outbreak of the novel coronavirus, is expected to negatively affect silicon wafer sales in the second half of 2020 with possible effects on price negotiations in 2021. China's small-diameter silicon wafer facilities have been affected as utilization dropped between 30 percent and 50 percent in February. By the end of March, however the utilization rate at Chinese silicon wafer manufacturers has recovered to around 80 percent. Taking into account the Chinese recovery, we project a V-shaped recovery for the market, if proper stimulus packages are announced by the markets across the globe.

Key Market Trends

Continuous Introduction of Disruptive LED Devices will Act as a Driver

  • The rise in demand for LED lights has favored the market substantially. With the growing demand for high-performance alternatives in the lighting industry, Epitaxial wafer has emerged as the best material for optimal performance.
  • The visible LED industry is diversifying its activities towards specialized UV and IR LEDs that are based on GaAs substrates. LED manufacturers are also developing new types of LEDs to continuallky create value in consumer displays, like miniLEDs and microLEDs. Apple for instance is has started adoption of its higher-end 2021 smartwatch model. MicroLEDs are also expected to be increasingly used in smartphone products, that will affect the epi-ready wafer market.
  • Further, researchers at the Sheffield University developed a new method to deposit high-brightness green InGaN microLED arrays. The new process, in which the InGaN stack is direectly grown within pre-patterned micro-hole arrays through a thin SiO2 layer is expected to aid their applications in this end user segment.

Asia - Pacific is Expected to be the Fastest Growing Market

  • According to data released by SEMI, Taiwan is expected to become the largest equipment market in the world in 2020, going ahead of Korea. China, and Korea are expected to occupy the second and third positions. The equipment market recovery is being fueled by advanced logic and foundry, multiple new projects in China, and, to some extent, growth in demand for memory chips.
  • The region has some of the worlds largest epitaxial wafer manufacturers that are expected to further expand their operations. EpiWorld , a leading China based producer for instance seeks to expand its production capacity. The company has completed production lines for 4- and 6-inch SiC epitaxial wafers for making 600V, 1,200V and 1,700V power devices.
  • Further, Government of India recently proposed launching a new scheme in line with the "Assemble In India" proposal of the 2019-20 Economic Survey to make India a hub for electronic manufacturing in the near future. India and Israel have been collaborating to facilitate development of the Indian electronics manufacturing industry and the the 11th India Israel Forum recently proposed introduction of USD 912 million capex subsidy for new equipment introduction to the industry. Such steps are expected to aid market growth in the region.

Competitive Landscape

The competitive landscape of the epitaxial equipment market is dynamic. The growing applications of the market are continually leading to new innovations and entry of new players in the market. Some of the recent developments of the market are as follows:-

  • November 2019 - AIXTRON SE, a global leader in deposition equipment to the semiconductor industry, has provided an AIX G5 WW C system to EpiWorld International Co., Ltd for the further development of next generation silicon carbide (SiC) epitaxial wafers to be used for manufacturing of power devices for automotive applications.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Continuous Introduction of Disruptive LED Devices
    • 4.2.2 Growing Use in Power Applications is Expected to Act as Driver
  • 4.3 Market Restraints
    • 4.3.1 Complexities Associated with the Design
  • 4.4 Porters Five Force Analysis
    • 4.4.1 Threat of New Entrants
    • 4.4.2 Bargaining Power of Buyers/Consumers
    • 4.4.3 Bargaining Power of Suppliers
    • 4.4.4 Threat of Substitute Products
    • 4.4.5 Intensity of Competitive Rivalry
  • 4.5 Industry Value Chain Analysis
  • 4.6 Assessment of Impact of Covid-19 on the Industry

5 MARKET SEGMENTATION

  • 5.1 Technology
    • 5.1.1 MOCVD
    • 5.1.2 HT CVD
    • 5.1.3 MBE
  • 5.2 Application
    • 5.2.1 Photonics
    • 5.2.2 Semiconductor
    • 5.2.3 Wide-bandgap Material
    • 5.2.4 Others
  • 5.3 Geography
    • 5.3.1 North America
    • 5.3.2 Europe
    • 5.3.3 Asia-Pacific
    • 5.3.4 Rest of the World

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 II-VI Incorporated
    • 6.1.2 Applied Materials, Inc.
    • 6.1.3 Intelligent Epitaxy Technology, Inc.
    • 6.1.4 DOWA Electronics Materials Co., Ltd.
    • 6.1.5 Optowell Co.,Ltd
    • 6.1.6 Aixtron SE
    • 6.1.7 NuFlare Technology, Inc. (Toshiba Electronic Devices and Storage Corporation)
    • 6.1.8 Siltronic AG
    • 6.1.9 Tokyo Electron Limited

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS