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光連接模組：市場佔有率分析、產業趨勢與統計、成長預測（2024-2029）

Optical Interconnect - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計2024年光連接模組市場規模為171.4億美元，預計2029年將達到318億美元，在預測期間（2024-2029年）複合年成長率為13.15%。

光互連 - 市場

由於 COVID-19 對各行業的負面感染疾病，3M 等公司現在正在製造醫療產品，以協助世界各地的各個相關人員對抗新型冠狀病毒 (COVID-19)。 3M 在世界各地（包括美國、亞洲和歐洲）的製造工廠將 N95 口罩的產量加倍，達到每年 11 億隻。這減少了光互連電纜的產量。

然而，隨著在家工作能力變得絕對必要，Nexcom（台灣）等市場參與者正計劃幫助世界各地的通訊供應商和資料中心虛擬和擴展其容量。為了滿足當前網路對更高速度的需求，NC 220FMS3 模組提供了一個 PCIe3.0 x16 介面和兩個 QSFP28 端口，每個端口都支援 100Gb/s 乙太網路連接。此模組提供高速連接，無資料包遺失。 100 G 光收發器（提供 100 Gb/s 乙太網路）、其外形尺寸類型和標準將根據成本和功耗進行開發。這些被認為是互連市場發展的主要驅動力，並潛在地帶動互連市場的光連接模組需求。

主要亮點

  • 此外，直接調變VCSEL陣列、平行光纖帶和檢測器陣列廣泛應用於解決光學背板容量問題。未來，光連接模組的新趨勢預計將帶來更強大的功能，包括光域中的交叉連接交換器和資料封包路由等功能。
  • 對通訊頻寬的需求不斷成長預計將推動市場發展。隨著不同類型的通訊及其付加實體中大量新服務的出現，對頻寬的需求正以前所未有的速度成長。與電氣互連相比，光連接模組能夠提供更多頻寬，並在運算效能方面提供顯著優勢。
  • 在光學方面，相信未來10年，跨晶片通訊所需的能量將接近0.5 pJ b1以下，而晶片外通訊技術等通訊所需的能量將接近0.1 pJ b1。隨著頻寬的增加，以經濟實惠的方式移動資料的能力有望降低未來多核心處理器系統的功耗和總體成本。
  • 自2020年初以來，Ciena、Infinera、華為和諾基亞等供應商一直在突破現代光學技術的界限。華為CloudFabric EVN二層DCI解決方案提供擴充性、高效的二層互連，支援跨IP WAN擴充多達32個資料中心。與華為類似，Ciena 和 Infinera 等競爭廠商也正在開發支援 800G 的連貫解決方案，為下一代光學 DCI 平台提供支援。
  • 到 2020 年第二季度，數百萬人轉為在家工作，視訊消費量（佔全球資料流量的 60%）達到歷史最高水準。關鍵服務受到影響，Wi-Fi網路基地台面臨擁塞。 FWA 有其局限性，會對互連點造成壓力。
  • 這些場景將促使工業和企業部門的投資大幅增加，以及雲端運算活動的激增。所有這些因素，再加上用於擴展資料中心功能的技術，促使了資料中心市場的巨大繁榮。預計此類趨勢將進一步刺激所研究市場的成長。

光連接模組市場趨勢

資料通訊預計將推動光連接模組的需求

  • 光互連的主要應用之一是在資料通訊網路中，例如資料中心網路、無線接取網路網路和有線接取網路。目前的資料中心網路是基於電子分封交換，雲端運算的發展促使網路流量快速成長。光連接模組已成為實現高吞吐量、低延遲和低功耗的有前景的替代方案。
  • 據 IEEE Communications 稱，全光纖網路可為資料中心節省高達 75% 的能源。使用高能源效率、高頻寬、低延遲的互連至關重要，特別是在企業使用的大型資料中心，人們對在這些資料中心部署光互連表現出濃厚的興趣。
  • 目前，光技術在資料中心中僅用於點對點鏈路，類似於舊通訊網路（不透明網路）中使用的點對點光鏈路。然而，光開關互連仍處於研究階段。

北美市場成長迅速

  • 網際網路的快速普及預計將促進該地區的市場成長。此外，根據思科系統公司的數據，2021 年北美的雲端流量預計約為每年 6844Exabyte，與其他地區相比是最高的。根據愛立信移動報告 2020 年 11 月版，預計到年終，北美約 4% 的行動用戶將使用 5G。因此，這種趨勢創造了市場空間，因為行動電話基地台和其他應用程式需要強大的互連來處理 5G 傳輸。
  • 北美也有許多提供光連接模組產品和解決方案的廠商，其中一些廠商熱衷於創新新的解決方案，以提高互連頻寬密度，同時功耗降低約 10 倍。例如，2020年3月，Ayar Labs宣布獲得洛克希德馬丁創投公司的策略投資。這筆資金將用於加速 Ayar Labs取得專利的單片封裝內光學 I/O (MIPO) 解決方案的商業化。需要高頻寬、低延遲和高能效短距離互連的應用。
  • 此外，資料中心內的資料移動正在成為一項關鍵功能，美國和加拿大出現了許多利用資料中心服務的新業務，機器對機器 (M2M) 流量的使用增加。為了解決這個問題，IBM重點是為資料中心提供光交換機，這是解決問題的關鍵。 IBM 正在致力於使用矽光子技術建構可重新配置的光開關。一旦實施，該光學解決方案將代表光連接模組市場的新趨勢。
  • 2020 年 6 月，全球互連與資料中心公司 Equinix 宣布同意以 7.5 億美元的全現金交易從 BCE Inc 購買由 13 個加拿大各地資料中心組成的投資組合。這 13 個資料中心站點代表 25 個貝爾資料中心設施，有可能產生約 1.05 億美元的年收益。

光連接模組行業概況

光連接模組市場本質上是分散的，其特點是存在多個主要供應商以及其他知名供應商。主要供應商越來越注重提高人們光連接模組開發課程及其優勢以及新創新和收購的認知。此外，世界各地的供應商正在透過策略聯盟和投資來尋求市場的穩定。主要企業有3M、工業。

  • 2020 年 12 月 - 康寧公司投資 4.5 億美元擴建其位於北卡羅來納州康科德市卡巴勒斯縣光纜工廠，創造 475 個新就業崗位，使其成為全球最大的工廠。
  • 2020年11月－製造基於光纖網路連結主要架構的晶片解決方案的Ayar Labs在B輪資金籌措中籌集了3,500萬美元。據該公司執行長表示，這筆資金將用於繼續產品開發和進一步商業化工作。該公司技術的關鍵應用包括發生大規模資料移動的下一代運算，包括航太和政府應用、人工智慧和高性能運算、通訊和雲端應用以及自動駕駛汽車的雷射雷達。和其他自治系統。

其他福利

  • Excel 格式的市場預測 (ME) 表
  • 3 個月分析師支持

目錄

第1章簡介

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章市場動態

  • 市場概況
  • 市場促進因素
    • 由於雲端運算、人工智慧和高效能運算的需求，通訊頻寬的需求不斷增加
    • 增加對資料中心互連和光纖通訊的投資
  • 市場限制因素
    • 光互連相關技術的實用化延遲
  • 產業價值鏈分析
  • 產業吸引力－波特五力分析
    • 新進入者的威脅
    • 買方議價能力
    • 供應商的議價能力
    • 替代產品的威脅
    • 競爭公司之間的敵意強度
  • 評估 COVID-19 對市場的影響

第5章市場區隔

  • 類型
    • 光收發器
    • 主動光纜（AOC）
    • 嵌入式光學模組（EOM）
  • 目的
    • 通訊
    • 資料通訊
  • 地區
    • 北美洲
      • 美國
      • 加拿大
    • 歐洲
      • 德國
      • 英國
      • 法國
      • 其他歐洲國家
    • 亞太地區
      • 印度
      • 中國
      • 日本
      • 其他亞太地區
    • 拉丁美洲
    • 中東和非洲

第6章 競爭形勢

  • 公司簡介
    • 3M Company
    • Sumitomo Electric Industries Ltd
    • Molex LLC
    • Amphenol Corporation
    • TE Connectivity Ltd.
    • Go!Foton Inc.
    • II-VI Incorporated
    • Corning Incorporated
    • Cisco Systems Inc.
    • Huawei Technologies Co. Ltd

第7章 投資分析

第8章市場機會及未來趨勢

簡介目錄
Product Code: 69940

The Optical Interconnect Market size is estimated at USD 17.14 billion in 2024, and is expected to reach USD 31.80 billion by 2029, growing at a CAGR of 13.15% during the forecast period (2024-2029).

Optical Interconnect - Market

Due to the adverse effects of COVID 19 across industries, players such as 3M are currently manufacturing medical products to assist various stakeholders globally, to combat Covid-19. 3M has doubled production of N95 respirators to 1.1 billion per year at its global manufacturing facilities, including in the U.S., Asia, and Europe. This has led to reduced manufacturing for optical interconnect cables.

However, as the ability to work from home has become an absolute necessity, market players such as Nexcom (Taiwan) plans to help telecom providers and data centers across the world to virtualize and expand capacity. For meeting current network demands for faster speeds, the NC 220FMS3 module provides a PCIe3.0 x16 interface and two QSFP28 ports, each supporting 100Gb/s Ethernet connectivity. The module provides high-speed connectivity without any packet loss. The 100 G optical transceivers (providing 100Gb/s ethernet), their form factor type, and standard are developed according to the cost and power consumption, which are regarded as the main drive in the development for interconnect market, which potentially drives the demand of optical interconnect.

Key Highlights

  • Moreover, directly modulated VCSEL arrays, parallel fiber ribbons, along with detector arrays, are highly being applied to optical backplane capacity issues. In the future, additional higher functionality is highly expected as an emerging trend for optical interconnects, which includes features such as cross-connect switches and data packet routing in the optical domain.
  • The increasing demand for communication bandwidth is expected to drive the market. Due to the emergence of a large number of new services in different types of communications and their value-added entities, the demand for bandwidth has gone up more than ever before. Optical interconnect drive it possible in providing more bandwidth and bring great advantage to computing performance, compared to electrical interconnects.
  • With optics, over the next decade, it is believed that the energy-requiring for cross-chip communication would approach less than 0.5 pJ b1 and to 0.1 pJ b1 for communication, such as off-chip communication technology. By utilizing the ability to move data affordably, both the power consumption and the total cost for such future multicore processor systems are expected to be reduced with improving bandwidth.
  • Since the beginning of 2020, vendors, like Ciena, Infinera, Huawei, and Nokia, have been pushing the limits of modern optics. Huawei CloudFabric EVN Layer 2 DCI solution provides highly permits scalable, efficient layer 2 interconnection that allows expansion of up to 32 data centers across IP WANs. Like Huawei, competing vendors, like Ciena or Infinera, are also working on their 800G-capable coherent solutions, which may power next-generation optical DCI platforms.
  • By the second quarter of 2020, millions of people switched to work from home, and video consumption (which amounts to 60% of the global data traffic) was at an all-time high. Critical services were being impacted, and Wi-Fi access points were facing congestion; FWA witnessed limitations, and interconnect points were burdened.
  • These scenarios also surge the cloud computing activities, along with significantly increasing investments from the industrial and enterprises segment. All these factors made a massive boom in the data center market along with technologies incorporated to expand the capabilities of data centers. Such trends are expected to further stimulate the growth of the market studied.

Optical Interconnect Market Trends

Data Communication is Expected to Spur the Demand for Optical Interconnects

  • One of the major applications of optical interconnectivity is within data communication networks which include datacenter networks, wireless access networks, and wired access networks. Current data center networks, which are based on electronic packet switches, experiences an exponential increase in network traffic due to cloud computing development. Optical interconnects emerged as a promising alternative that offers high throughput, low latency, and reduced power consumption.
  • According to IEEE Communications, all-optical networks could provide up to 75% energy savings in the data centers. Especially in large data centers used in enterprises, the use of power efficient, high bandwidth, and low latency interconnects is of paramount importance, and there is signi?cant interest in the deployment of optical interconnects in these data centers.
  • Currently, optical technology is utilized in data centers is only for point-to-point links, which is in the same way as point-to-point optical links that were used in older telecommunication networks (opaque networks). However, optically switched interconnects are still in the research phase.

North America To Witness High Market Growth

  • The rapid penetration of the internet is expected to raise the growth of the market in this region. Moreover, according to Cisco Systems, the cloud traffic in 2021 is estimated to be around 6844 exabytes per year in North America, which is highest in comparison to other regions. According to the November 2020 edition of the Ericsson Mobility Report, North America was expected to end 2020 with about 4% of its mobile subscriptions being 5G. Hence, such trends create scope for the market, as a powerful interconnect is required to enable cell towers and other applications to handle 5G transmissions.
  • Also, North America has various players that provide optical interconnect products and solutions, along with players who are also keen to innovate new solutions for the improvement in interconnect bandwidth density at around 10x lower power. For instance, in March 2020, Ayar Labs announced that it had received a strategic investment from Lockheed Martin Ventures, where the funds will be used to accelerate the commercialization of Ayar Labs' patented monolithic in-package optical I/O (MIPO) solution for applications that require high bandwidth, low latency, and power-efficient short-reach interconnects.
  • Moreover, data movement within the data center is becoming a critical feature, and the rise in the ample of new businesses leveraging data center services in the United States, and Canada will leverage more machine-to-machine (M2M) traffic. To overcome this problem, IBM focuses on providing optical switches in the data center as a key to resolve the problem. IBM is undertaking to build reconfigurable optical switches using silicon-photonic technology. If implemented, this optical solution becomes a new trend in the optical interconnect market.
  • In June 2020, Equinix Inc., the global interconnection and data center company, announced its agreement to purchase a portfolio of 13 data centers across Canada from BCE Inc for USD 750 million in an all-cash transaction. The 13 data center sites representing 25 Bell data center facilities are likely to generate approximately USD 105 million annualized revenue.

Optical Interconnect Industry Overview

The Optical Interconnect Market is fragmented in nature and is characterized by the presence of several key vendors and other prominent vendors. The key vendors are increasingly focusing on creating awareness about the optical Interconnect development courses and their benefits, along with new innovation and acquisitions. Further, global vendors are trying to stabilize themselves in the market, through strategic collaborations and investements. Key players are 3M, Sumitomo Electric Industries, etc.

  • December 2020 - Corning Inc. spent USD 450 million to expand its Cabarrus County fiber optic cable plant in Concord, N.C., generating 475 new jobs and making it the largest such facility in the world.
  • November 2020 - Ayar Labs, which makes chip solutions based on optical networking principal's architecture raised USD 35 million in a Series B round of funding. According to the company's CEO, the funding will be used to continue developing its product and working on further commercialization. The main application area for the company's technology is next-generation computing, anywhere that there is a massive movement of data, including aerospace and government applications, artificial intelligence and high-performance computing, telecoms and cloud applications, and lidar for self-driving car and other autonomous systems.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Increasing Demand for Communication Bandwidth Owing to Demand for Cloud Computing, AI, and HPC
    • 4.2.2 Increasing Investment in Data Centers Interconnect and Fiber Optic Communication
  • 4.3 Market Restraints
    • 4.3.1 Slow Commercialization of Optical Interconnection Related Technologies
  • 4.4 Industry Value Chain Analysis
  • 4.5 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.5.1 Threat of New Entrants
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Bargaining Power of Suppliers
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry
  • 4.6 Assessment of Impact of Covid-19 on the Market

5 MARKET SEGMENTATION

  • 5.1 Type
    • 5.1.1 Optical Transceivers
    • 5.1.2 Active Optical Cables (AOCs)
    • 5.1.3 Embedded Optical Modules (EOMs)
  • 5.2 Application
    • 5.2.1 Telecommunication
    • 5.2.2 Data Communication
  • 5.3 Geography
    • 5.3.1 North America
      • 5.3.1.1 United States
      • 5.3.1.2 Canada
    • 5.3.2 Europe
      • 5.3.2.1 Germany
      • 5.3.2.2 United Kingdom
      • 5.3.2.3 France
      • 5.3.2.4 Rest of Europe
    • 5.3.3 Asia Pacific
      • 5.3.3.1 India
      • 5.3.3.2 China
      • 5.3.3.3 Japan
      • 5.3.3.4 Rest of Asia Pacific
    • 5.3.4 Latin America
    • 5.3.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles*
    • 6.1.1 3M Company
    • 6.1.2 Sumitomo Electric Industries Ltd
    • 6.1.3 Molex LLC
    • 6.1.4 Amphenol Corporation
    • 6.1.5 TE Connectivity Ltd.
    • 6.1.6 Go!Foton Inc.
    • 6.1.7 II-VI Incorporated
    • 6.1.8 Corning Incorporated
    • 6.1.9 Cisco Systems Inc.
    • 6.1.10 Huawei Technologies Co. Ltd

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS