市場調查報告書

汽車用電源模組包裝的全球市場 - 成長,趨勢,預測(2019年∼2024年)

Automotive Power Module Packaging Market - Growth, Trends, and Forecast (2020 - 2025)

出版商 Mordor Intelligence LLP 商品編碼 911922
出版日期 內容資訊 英文 120 Pages
商品交期: 2-3個工作天內
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汽車用電源模組包裝的全球市場 - 成長,趨勢,預測(2019年∼2024年) Automotive Power Module Packaging Market - Growth, Trends, and Forecast (2020 - 2025)
出版日期: 2020年01月01日內容資訊: 英文 120 Pages
簡介

全球汽車用電源模組包裝市場在2019年∼2024年間,預測將以7.5%的年複合成長率成長。由於混合電動車(HEV)及電動車(EV)的普及促進汽車用電源模組包裝市場成長。

本報告提供全球汽車用電源模組包裝市場調查,市場概要,各類型、各地區的市場規模的變化與預測,市場成長要素及阻礙因素分析,競爭情形,主要企業的簡介等全面性資訊。

目錄

第1章 簡介

  • 調查成果
  • 調查的前提條件
  • 調查範圍

第2章 調查方法

第3章 摘要整理

第4章 市場動態

  • 市場概況
  • 市場成長要素及阻礙因素概要
  • 市場成長的要素
    • 電動車(EV)及混合電動車(HEV)的普及
    • 能源效率高的電池驅動設備的需求增加
    • 排放標準的嚴格化
  • 市場阻礙因素
    • 缺乏電源模組開發的標準通訊協定
    • 新技術的普及低迷
  • 產業價值鏈分析
  • 波特的五力分析
    • 買方議價能力
    • 供給企業談判力
    • 新加入業者的威脅
    • 替代品的威脅
    • 競爭企業間的敵對關係
  • 技術概述

第5章 市場區隔

  • 各類型
    • 智慧型電源模組(IPM)
    • SiC模組
    • GaN模組
    • 其他(IGBT,FET)
  • 各地區
    • 北美
    • 歐洲
    • 亞太地區
    • 其他地區

第6章 競爭情形

  • Amkor Technology
  • Kulicke and Soffa Industries Inc.
  • PTI Technology Inc.
  • Infineon Technologies
  • STMicroelectronics
  • 富士電機
  • Toshiba Electronic Device & Storage Corporation
  • Semikron
  • STATS ChipPAC Ltd. (JCET)
  • Starpower Semiconductor Ltd.

第7章 投資分析

第8章 市場機會及未來趨勢

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目錄
Product Code: 66922

Market Overview

The automotive power module packaging market is expected to grow with a CAGR of 7.5%, over the forecast period (2020 - 2025). The demand for sustainable energy is increasing with people exploiting sustainable and clean energy to mitigate the global crisis of fossil energy. The automotive module has seen a steep growth with efforts to popularize hybrid electric vehicle (HEV) and electric vehicle (EV), thus driving the automotive power module packaging market.

  • A number of environmental, economic and social factors are influencing future vehicle designs and powertrain choices. Power semiconductors are the key components in the powertrain systems of electric vehicles (EVs), hybrid electric vehicles (HEVs) and plug-in hybrid vehicles (PHEVs). As the number of electric and electrified vehicles (HEV and PHEV) increases, demand for sophisticated power electronics solutions reducing electrical losses, system weight and total cost of ownership will increase.
  • For instance, in January 2018, Mitsubishi Electric Corporation announced that it has developed a 6.5 kV full silicon carbide (SiC) power semiconductor module that is believed to offer the highest power density among other power semiconductors modules rated from 1.7 kV to 6.5 kV. It is expected that the module to lead to smaller and more energy-efficient power equipment for high-voltage railcars and electric power systems.
  • Moreover, growing focus by consumers and OEMs on minimizing power losses, increasing power density, and maximizing power savings are driving the growth of this market.
  • A lack of standard protocols for the development of power modules and the rising complexity in the design and packaging results in the rise of the overall cost of the vehicle, which is considered as the key restraining factor for the growth of this market.

Scope of the Report

Packaging of automotive power modules needs to meet high-reliability standards like harsh operating environment (which includes high ambient temperature range, high operating temperature, temperature excursion, and thermal shock), mechanical vibration and shock, and frequent power surging. To ensure reliable operation of the power module, packaging of the power modules has been intensively modified in terms of packaging materials and processing as well as in terms of reliability design. The Electric Vehicle and Hybrid Electric Vehicle (EV/HEV) industry's demand for high power density and mechatronics integration is the main driver for automotive power module packaging market.

Key Market Trends

Electric Vehicle and Hybrid Electric Vehicle to Drive the Automotive Power Module Packaging

  • Over the past decade, electric vehicle technologies have gained significant progress due to the added advancement in electric motor drives, power converters, on-board batteries and systems integration.
  • Advanced electric drive vehicles such as hybrid-electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), range-extended electric vehicle (REEV) and pure electric vehicles (EVs) employed advanced power electronics devices to control the flow of electrical energy from the on-board battery to the traction motors and other accessories.
  • In advanced power electronics systems, apart from control topology and components, packaging plays an important role to improve the overall efficiency and reliability.
  • Initially, the automotive power module packaging followed the standard of industrial drive module packaging, using the well-established wire bond technology. Such a basic packaging structure has gone through significant improvements in the pursuit of better electrical and thermal performance, reliability and cost-effectiveness.
  • Need for improving the present practice of packaging in power electronics modules is amplified due to the stringent requirements of electric vehicles. The pursuit for higher current density is expected to be continued, and it brings along with it a need for continued improvement of cooling. Advancement in power electronic packaging is essential to support these needs.
  • As the demand for Electric Vehicle will increase, the requirement of power module packaging will also increase to support the high power density and mechatronics integration.

Asia-Pacific is Expected to Register Highest Growith Rate

  • The Asia-Pacific region is estimated to hold the largest market share during the forecast period owing to growing automotive infrastructure and increases in sales of electric vehicles across the region.
  • Increasing uses of electrification in vehicles is expected to boost the demand for automotive power module packaging market in this region.
  • Furthermore, increasing investment by public and private players to develop automotive power modules such as power inverter, integrated dual charger, among others and the rise in demand for safety features in vehicles across the region are contributing in the growth of this market in this region.
  • Moreover, the governments of countries, like China and India, where the pollution is rampant, are taking actions to reduce the pollution issue, thereby resulting in the rise in sales of the alternative fuel engines and green vehicles, such as the electric vehicle, hybrid electric vehicle, among others.

Competitive Landscape

The automotive power module packaging market is very competitive in nature. The market is highly consolidated due to the presence of large players. The major players in the market are Amkor Technology, Kulicke & Soffa, PTI Technology Inc., Infineon Technologies, STMicroelectronics, Fuji Electric Co. Ltd., Toshiba Electronic Device & Storage Corporation, among others.

  • September 2019 - STMicroelectronics planned to supply advanced silicon-carbide power electronics to Renault-Nissan-Mitsubishi for high-speed battery charging in Next-Generation Electric Vehicles.
  • May 2019 - New Infineon HybridPACK power modules enable fast and flexible electrification of vehicles to support the automotive industry in building up a broad and cost-competitive portfolio of hybrid and electric vehicles. Furthermore, Infineon introduces the HybridPACK Double-Sided Cooling (DSC) S2, a technology upgrade to the existing HybridPACK DSC. This module targets main inverters up to 80 kW in hybrid and plug-in hybrid electric vehicles with high power density requirements.

Reasons to Purchase this report:

  • The market estimate (ME) sheet in Excel format
  • Report customization as per the client's requirements
  • 3 months of analyst support

Table of Contents

1 INTRODUCTION

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Introduction to Market Drivers and Restraints
  • 4.3 Market Drivers
    • 4.3.1 Electric Vehicle and Hybrid Electric Vehicle to Drive the Automotive Power Module Packaging
    • 4.3.2 Growing Demand Energy Efficient Battery Powered Devices.
    • 4.3.3 Increasing Stringency of Emission Standards
  • 4.4 Market Restraints
    • 4.4.1 Lack of Standard Protocols for the Development of Power Modules
    • 4.4.2 Slow Adoption of New Technologies Derailing Innovation
  • 4.5 Industry Value Chain Analysis
  • 4.6 Industry Attractiveness - Porter's Five Force Analysis
    • 4.6.1 Bargaining Power of Buyers/Consumers
    • 4.6.2 Bargaining Power of Suppliers
    • 4.6.3 Threat of New Entrants
    • 4.6.4 Threat of Substitute Products
    • 4.6.5 Intensity of Competitive Rivalry
  • 4.7 Technology Snapshot

5 MARKET SEGMENTATION

  • 5.1 By Type
    • 5.1.1 Intelligent Power Module (IPM)
    • 5.1.2 SiC Module
    • 5.1.3 GaN Module
    • 5.1.4 Others (IGBT,FET)
  • 5.2 Geography
    • 5.2.1 North America
    • 5.2.2 Europe
    • 5.2.3 Asia-Pacific
    • 5.2.4 Rest of the World

6 COMPETITIVE LANDSCAPE

  • 6.1 Amkor Technology
  • 6.2 Kulicke and Soffa Industries Inc.
  • 6.3 PTI Technology Inc.
  • 6.4 Infineon Technologies
  • 6.5 STMicroelectronics
  • 6.6 Fuji Electric Co. Ltd.
  • 6.7 Toshiba Electronic Device & Storage Corporation
  • 6.8 Semikron
  • 6.9 STATS ChipPAC Ltd. (JCET)
  • 6.10 Starpower Semiconductor Ltd.

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS

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