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1138009

全球 MEMS 封裝市場 - COVID-19 的增長、趨勢、影響和預測（2022-2027 年）

Global MEMS Packaging Market - Growth, Trends, and Forecasts (2022 - 2027)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球 MEMS 封裝市場預計在預測期內（2022-2027 年）將以 17.8% 的複合年增長率增長。

由於全球對智能汽車解決方案的需求不斷增加，預計 MEMS 封裝市場的需求將會上升。對連接設備和消費電子產品的需求不斷增長，預計將推動傳感器市場。此外，隨著傳感器的使用不斷增長，全球工業傳感器的使用量也在飆升，推動了對 MEMS 設備的需求。

主要亮點

  • 由於MEMS器件應用的顯著擴展，MEMS封裝已經從MEMS器件封裝發展到MEMS系統封裝。創新高效的包裝技術和新型包裝材料正變得越來越重要。
  • 最近，單芯片技術的發展，如低溫晶圓鍵合與 CMOS 兼容的 MEMS 製造工藝正在推動 MEMS 封裝市場的創新。另一個新興趨勢是將裸晶圓堆疊應用於低成本無鉛半導體封裝。這使得低成本、小引腳封裝的大規模生產成為可能。
  • MEMS 的日益普及也促進了嵌入式芯片封裝市場的新需求。雖然這項技術並非該市場獨有，但由於成本高、良率低，已多元化進入利基應用領域，但未來發展潛力巨大。藍牙、射頻模塊的進步以及 WiFi-6 的興起將進一步加速對該技術的投資。
  • 此外，MEMS 器件的日益普及正促使 MEMS 封裝供應商進一步開發創新封裝技術，以提高這些器件的效率和運行性能。例如，2021 年，半導體製造巨頭 T-SMART 宣布，正致力於開發一種基於熱電堆傳感器異構集成的新型 MEMS 封裝技術。
  • 此外，根據 IEEE 的說法，由於 MEMS 器件的多樣性以及需要同時暴露和保護許多器件免受環境影響，MEMS 封裝比 IC 封裝更具挑戰性。此外，在 MEMS 封裝中，還存在諸如芯片處理、芯片附著、界面張力和除氣等挑戰。這些新的 MEMS 封裝挑戰需要緊急研究和開發。
  • 隨著世界各地的科技公司加速創新以對抗 COVID-19 流行病，MEMS 在芯片行業的使用出現了巨大的增長。對更小設備的需求正在推動電子產品的進步，從更快的熱成像和床旁檢測到基於微流體的聚合□鏈反應 (PCR) 工具和 SARS-CoV-2 檢測技術。然而，大流行改變了製造業對全球供應鏈的看法，導致價值鏈更加區域化和區域化。

主要市場趨勢

智能手機和聯網設備的普及有望刺激需求

  • 全球智能手機用戶數量正在迅速增加。消費者正在轉向智能手機以利用它們提供的一系列功能，包括連接、支付、遊戲、攝影和 GPS。智能手機用戶的增加預計將對所研究市場的增長產生積極影響，因為智能手機硬件包含多個傳感器來實現此類功能。
  • 根據Ericsson Mobility Report，印度智能手機用戶數量預計將從 2020 年的 8.1 億增長到 2026 年的 12 億。農村地區正在推動支持互聯網的手機的銷售，隨著互聯網連接變得更加普遍，預計對智能手機的需求也將增加。
  • 此外，MEMS 器件正在徹底改變消費電子市場。通過結合所有智能手機和平板電腦中的 MEMS 麥克風和 CMOS 圖像傳感器，消費電子製造商正在將傳統設備轉變為可通過智能手機輕鬆遠程控制的連接設備。
  • 健康意識的提高，尤其是在 COVID-19 爆發之後，正在推動使用傳感器跟蹤用戶生物特徵數據的連接可穿戴設備市場。由於 MEMS 器件在這些器件中發揮著不可或缺的作用，預計不斷增長的需求將對研究市場產生積極影響。例如，根據 CISCO Systems 的數據，到 2022 年，全球可穿戴設備的總數預計將達到 11 億台。

北美有望佔據重要市場份額

  • 北美地區歷來是全球電子行業的主要股東，因為其強大的研發能力、Intel、Dell等一些最大的半導體和技術公司的存在，以及在電子、物聯網和先進的汽車。這是由於技術滲透率高等因素造成的。例如，該地區被認為是採用支持 ADAS 的車輛和自動交通解決方案的先驅之一。據Deutsche Bank稱，到 2021 年，美國 ADAS 汽車產量預計將增長到 1845 萬輛。
  • 汽車製造商越來越多地採用 MEMS 設備來為其車輛添加獨特的功能。例如，基於 MEMS 的激光雷達正在取代自動/無人駕駛車輛、工業機器人、無人機等。2021 年 9 月，General Motors選擇 Cepton 為 2023 年的生產提供基於 MEME 的激光雷達。General Motors預計將使用 Cepton LiDAR 來增強自動緊急制動和行人檢測等 ADAS 功能，並在未來推出 Ultra Cruise 系統。
  • 此外，每家公司都專注於最新傳感器的創新，並被評為創新產品。例如，2022 年 4 月，北美和世界各地的半導體封裝和測試服務提供商 UNICEM 在 MEMS 和 SENSORS 技術大會 (MSTC) 上展示了 MEMS 腔體封裝，贏得了封裝工藝攤牌。
  • 在全球芯片短缺的情況下，北美半導體產業近年來被迫增加政府對半導體及相關產業的投資。例如，通過在 2022 年初投資 2.4 億美元，加拿大政府致力於與當地研究人員和公司合作，進一步加強加拿大在工業領域的地位。預計此類案例將為所研究市場的增長創造有利的市場情景。
  • 此外，智能手機和消費電子產品是推動 MEMS 設備需求的關鍵行業之一，對該地區對封裝服務的需求產生了積極影響。例如，根據消費者技術協會（CTA）的數據，預計 2021 年美國 5G 智能手機出貨量將達到 1.06 億部。

競爭格局

MEMS封裝市場競爭溫和。作為一個資本密集型行業，市場上的主要供應商正在利用其多樣化的產品組合和產品開發來確保優勢。供應商的創新能力高度依賴於其在研發方面的投資。此外，作為資本密集型行業也是新進入者的障礙。在市場上運營的主要公司包括 ChipMos Technologies Inc.、AAC Technologies、Bosch Sensortec GmbH、Infineon Technologies AG 和 Analog Devices, Inc.。

  • 2022年8月——MEMS技術解決方案的領先公司美新發布首款MEMS 6軸慣性傳感器（IMU）MIC6100HG。該產品集成了3軸加速度計和3軸陀螺儀，可支持高靈敏度的智能遙控器、遊戲控制器等運動感應和交互系統。此外，MIC6100HG 6軸IMU傳感器具有超大FIFO容量，支持I2C/I3C/SPI通信模式。LGA封裝尺寸為2.5x3x0.83mm，數據輸出頻率為2200Hz。
  • 2022 年 2 月——意法半導體推出第三代 MEMS 傳感器。據該公司稱，新傳感器旨在實現智能行業、消費移動、醫療保健和零售領域的性能和功能的下一次飛躍。新推出的 LPS22DF 和防水 LPS28DFW 氣壓傳感器的工作電流為 1.7μA，在最小的佔地面積 (2.0 x 2.0 x 0.74mm) 內具有 0.5hPa 的絕對壓力精度。

其他福利

  • Excel 格式的市場預測 (ME) 表
  • 3 個月的分析師支持

目錄

第 1 章 簡介

  • 研究假設和市場定義
  • 調查範圍

第二章研究方法論

第三章執行摘要

第四章市場洞察

  • 市場概況
  • 產業吸引力——波特五力分析
    • 供應商的議價能力
    • 買方議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭對手之間的競爭
  • 技術快照
  • 評估 COVID-19 對市場的影響

第五章市場動態

  • 市場驅動力
    • 智能汽車市場的增長
    • 智能手機普及率和連接設備的增加
    • 傳感器在工業中的應用
  • 市場製約因素
    • 複雜的製造過程

第六章市場細分

  • 按傳感器類型
    • 慣性傳感器
    • 光學傳感器
    • 環境傳感器
    • 超聲波傳感器
    • 射頻微機電系統
    • 其他
  • 按最終用戶
    • 汽車
    • 手機
    • 消費類電子產品
    • 醫療器材
    • 工業設備
    • 其他
  • 區域信息
    • 北美
    • 歐洲
    • 亞太地區
    • 世界其他地區

第 7 章 競爭格局

  • 公司簡介
    • ChipMos Technologies Inc.
    • AAC Technologies Holdings Inc.
    • Bosch Sensortec GmbH
    • Infineon Technologies AG
    • Analog Devices, Inc.
    • Texas Instruments Incorporated.
    • Taiwan Semiconductor Manufacturing Company Limited
    • MEMSCAP S.A.
    • Orbotech Ltd.
    • TDK Corporation
    • MEMSIC Semiconductor Co., Ltd
    • STMicroelectronics

第八章投資分析

第九章市場展望

簡介目錄
Product Code: 66887

The global MEMS packaging market is projected to grow at a CAGR of 17.8% during the forecast period (2022- 2027). Owing to the increase in global demand for smart automotive solutions, the need for the MEMS packaging market is expected to go up. The increasing demand for connected devices and consumer electronics is expected to drive the market for sensors. Additionally, the global industrial sensor usage is soaring due to the ever-increasing applications of sensors, driving the demand for MEMs devices.

Key Highlights

  • MEMS packaging has evolved from packaging MEMS devices to packaging MEMS systems as the application of MEMS devices has expanded significantly. Innovative and efficient packaging technology is becoming increasingly important, as are new packaging materials.
  • The recent technological development of CMOS-compatible MEMS manufacturing processes for low-temperature wafer bonding and other single-chip integration are among the driving innovations in the MEMS packaging market. Another emerging trend is the application of bare wafer stacks for low-cost lead-free semiconductor packages. This enables a low-cost, small-pin package for high-volume production.
  • The increasing adoption of MEMS is also contributing to new demand in the embedded die packaging market. The technology is not unique to the market, but its high cost and low yields have diversified it into niche applications, but the potential for future development is immense. Advancements in Bluetooth and RF modules and the rise of WiFi-6 will likely accelerate investment in this technology further.
  • The growing adoption of MEMS devices is also encouraging the MEMS packaging vendors to develop innovative packaging techniques further to enhance these devices' efficiency and operational performances. For instance, in 2021, T-SMART, a leading semiconductor manufacturing company, announced that it is working towards a new MEMS packaging technology based on Heterogeneous Integration for the thermopile sensor.
  • Furthermore, according to IEEE, MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the need for many devices to be in contact with and protected from the environment simultaneously. In addition, there are also challenges within MEMS packaging, such as die handling, die attachment, interfacial tension, and outgassing. These new MEMS packaging challenges require urgent R&D efforts.
  • The usage of MEMS in the chip industry has witnessed immense growth as technology companies around the world accelerated innovation in the fight against the COVID-19 pandemic. The need for tiny devices drives advances in electronics, ranging from thermal imaging and faster point-of-care testing to microfluidics-based polymerase chain reaction (PCR) tools and techniques to detect SARS-CoV-2. However, the pandemic has changed the perception of the global supply chain in manufacturing, where more localized value chains and regionalization have come into the picture.

Key Market Trends

Growing Adoption of Smartphones and Connected Devices is Expected to Drive the Demand

  • The number of smartphone users is rising enormously worldwide. Consumers are switching to smartphones to access various functionality they offer, including connectivity, payment, gaming, photography, and GPS. As multiple sensors are integrated into the smartphone's hardware to enable such functionality, the growing number of smartphone users is expected to positively impact the studied market growth.
  • According to Ericsson Mobility Report, smartphone subscription in India is expected to grow from 810 million in 2020 to 1.2 billion in 2026. With rural areas driving the sale of internet-enabled phones, demand for smartphones is expected to increase as Internet connectivity spreads further.
  • Moreover, MEMS devices are also revolutionizing the consumer electronics market. Combining the MEMS microphones and CMOS image sensors found in all smartphones and tablets, the consumer electronic device manufacturing companies are turning the traditional devices into connected ones that can easily be remotely controlled through smartphones.
  • The increasing health consciousness, especially after the outbreak of COVID-19, drives the market for connected wearable devices that use sensors to track users' biological data. As MEMS devices play an integral role in these devices, the increasing demand is expected to impact the studied market positively. For instance, according to CISCO Systems, the total number of wearable devices is expected to reach 1.1 billion globally by 2022.

North America to Hold Significant Market Share

  • The North American region traditionally has been a major shareholder of the global electronics industry owing to factors such as higher R&D capabilities, the presence of some of the biggest semiconductor and tech companies such as Intel, Dell, etc., along with higher penetration of electronic devices, IoT, and advanced automotive technologies. For instance, the region is considered one of the pioneers in adopting ADAS-enabled vehicles and autonomous transportation solutions. According to Deutsche Bank, ADAS vehicle production in the US is expected to grow to 18.45 million by 2021.
  • Automotive companies are increasingly adopting MEMS devices to add unique functionality to their vehicles. For instance, MEMS-based LiDARs were an alternative to autonomous/driverless cars, industrial robots, UAVs, etc.; in September 2021, General Motors selected Cepton for the supply of MEME-based LiDAR for 2023 production. General Motor is expected to use the Cepton LiDAR to enhance ADAS capabilities for automatic emergency braking and pedestrian detection and to enable its upcoming Ultra Cruise system.​
  • Companies are also focused on innovating the latest sensors and are receiving recognition for their innovative products. For instance, in April 2022, Unisem, a North American and global semiconductor assembly and test services provider, won the Packaging Process Showdown at MEMS and SENSORS Technical Congress (MSTC) for its presentation, MEMS Cavity Packages.
  • The recent push to the local semiconductor industry amid the global chip shortage has forced the governments in the North American region to increase their investment in the semiconductor and related industries. For instance, through a USD 240 million investment in early 2022, the government Canadian government has committed to work with local researchers and companies to strengthen Canada's position in the industryfurther. Such instances are expected to create a favorable market scenario for the growth of the studied market.
  • Furthermore, the smartphone and consumer electronics also are among the leading industries driving the demand for MEMS devices which n turn is positively impacting the demand for packaging services in the region. For instance, according to the Consumer Technology Association (CTA), the 5G smartphone shipments in the United States was expected to reach 106 million in 2021.

Competitive Landscape

The MEMS packaging market is moderately competitive. As the industry is capital intensive, major vendors in the market are banking on diverse product portfolios and product development to gain an edge. The innovation capabilities of the vendors are highly dependent on their R&D investments. Additionally, the industry's capital-intensive nature poses an entry barrier to new entrants. Some key players operating in the market are ChipMos Technologies Inc., AAC Technologies, Bosch Sensortec GmbH, Infineon Technologies AG, and Analog Devices, Inc., among others.

  • August 2022 - MEMSIC, a leading MEMS technology solution provider, releases the first MEMS 6-axis inertial sensor (IMU) MIC6100HG. The product integrates a 3-axis accelerometer and a 3-axis gyroscope, which can support motion-sensing interactive systems such as smart remote controls and game controllers with sensitive sensing. Additionally, the MIC6100HG 6-axis IMU sensor has a large FIFO and supports I2C/I3C/SPI communication mode. The LGA package size is 2.5x3x0.83mm, and the data output frequency is 2200Hz.
  • February 2022 - STMicroelectronics introduced its third generation of MEMS sensors. According to the company, the new sensors are designed to enable the next leap in performance and features for smart industries, consumer mobiles, healthcare, and retail sectors. The newly launched LPS22DF and waterproof LPS28DFW barometric pressure sensors, which operate from 1.7µA and have absolute pressure accuracy of 0.5hPa and are packed in one of the smallest footprints (2.0 x 2.0 x 0.74mm).

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Force Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Technology Snapshot
  • 4.4 Assessment of the Impact of COVID-19 on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Growing Smart Automotive Market
    • 5.1.2 Increasing Smart Phone Adoption Rate & Connected Devices
    • 5.1.3 Sensor Usage in Industries
  • 5.2 Market Restraints
    • 5.2.1 Complex Manufacturing Process

6 MARKET SEGMENTATION

  • 6.1 By Sensor Type
    • 6.1.1 Inertial Sensors
    • 6.1.2 Optical Sensors
    • 6.1.3 Environmental Sensors
    • 6.1.4 Ultrasonic Sensors
    • 6.1.5 RF MEMS
    • 6.1.6 Others
  • 6.2 By End User
    • 6.2.1 Automotive
    • 6.2.2 Mobile Phones
    • 6.2.3 Consumer Electronics
    • 6.2.4 Medical Systems
    • 6.2.5 Industrial
    • 6.2.6 Others
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia Pacific
    • 6.3.4 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 ChipMos Technologies Inc.
    • 7.1.2 AAC Technologies Holdings Inc.
    • 7.1.3 Bosch Sensortec GmbH
    • 7.1.4 Infineon Technologies AG
    • 7.1.5 Analog Devices, Inc.
    • 7.1.6 Texas Instruments Incorporated.
    • 7.1.7 Taiwan Semiconductor Manufacturing Company Limited
    • 7.1.8 MEMSCAP S.A.
    • 7.1.9 Orbotech Ltd.
    • 7.1.10 TDK Corporation
    • 7.1.11 MEMSIC Semiconductor Co., Ltd
    • 7.1.12 STMicroelectronics

8 INVESTMENT ANALYSIS

9 FUTURE OUTLOOK OF THE MARKET