封面
市場調查報告書
商品編碼
1137962

矽外延片市場 - COVID-19 的增長、趨勢、影響和預測(2022-2027 年)

Silicon Epitaxial Wafer Market - Growth, Trends, and Forecasts (2022 - 2027)

出版日期: | 出版商: Mordor Intelligence | 英文 100 Pages | 商品交期: 2-3個工作天內

價格

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

在預測期內,矽外延片市場預計將以 4.42% 的複合年增長率增長。

對先進半導體不斷增長的需求和越來越多的創新最終用戶應用正在推動對該市場的研究。外延主要是為了增強晶片的功能。近年來,它已成為生產高度集成的半導體器件(IC)、圖像傳感器(CIS)和某些功率半導體必不可少的技術。

主要亮點

  • 作為許多微電子設備的核心組件,半導體矽晶圓仍然是電子行業的支柱。由於數字化和電動汽車是當前的技術趨勢,這些產品被應用於許多設備中。
  • 目前,矽片市場規模超過行業供應。因此,企業正在利用這一趨勢來增加產量,增加市場份額,從而創造出巨大的擴張空間。
  • 此外,小型化正在推動對單個設備中更多功能的需求。出於這個原因,IC芯片必須有更多的晶體管來支持更多的功能。這樣,智能手機和平板終端等無線通信設備的發展促進了半導體設計人員的積極設計活動。此外,由於對電子設備小型化的需求不斷增長(由於對更薄且功耗更低的晶圓的需求),預計矽外延片市場在預測期內將經歷一些演變。
  • 行業平均價格呈上漲趨勢。例如,在日本企業中,信越化學株式會社(以下簡稱信越化學)佔據了大部分市場份額。例如,佔據大部分市場份額的日本信越化學株式會社宣布,從 2021 年 4 月起,所有矽片產品的價格將上漲 10% 至 20%。所有公司都在應對不斷增長的需求,這對其利潤產生了重大影響。 GlobalWafer Co. 第二大矽片供應商 World Wafer Co. 宣布其矽片生產線滿負荷運轉,3 月份收入提振加上價格上漲,導致年增長率達到 12.99%。
  • 在消費電子等以消費者為中心的最終用戶行業,對矽晶圓的需求強勁,行業供應商在被迫擴大生產設施的同時,也在投資研究技術創新。
  • COVID-19 擾亂了中國國內的供應鍊和生產。隨著中國在過去幾十年中成為世界製造業中心,主要的半導體製造業受到了很大的影響。

主要市場趨勢

電力電子有望佔據很大份額

  • 對高能效產品的需求不斷增長是推動所有最終用戶行業對電力電子產品外延片需求的主要因素之一。因此,市場供應商瞄準了廣泛的行業,以降低風險並擴大其客戶群。
  • 未來 IGBT 和 MOSFET 的市場可能會擴大,但特別是在討論 EV/HEV 模塊時,預計其中一些將轉向 SiC。支持功率 MOSFET 需求的還有絕緣柵、雙極晶體管和晶閘管的持續更換。此外,使用功率 MOSFET 提高器件在低壓下的功率效率的顯著優勢,進一步推動了全球市場對功率 MOSFET 的需求。
  • 消費類設備中越來越多地使用電力電子產品也推動了需求。智能手機和智能設備的普及、物聯網設備的日益普及以及工業應用的增加也在推動電力電子市場的發展。電力電子器件的高需求也造成了 2018 年和 2019 年 200 毫米晶圓的短缺。由於大客戶仍有大量設備庫存,客戶需求正在下降。電力電子市場的長期增長也在推動基於 300mm 晶圓的生產。全球超過 7 家電力電子供應商已宣布投資新的製造能力,計劃於 2021 年投產。
  • Imec 和 Qromis 聯手在 Aixtron 的 G5+C 200 毫米 MOVCD 平台上生長外延層,並在 200 毫米 QST 基板上開發增強模式、p-GaN 分立器件和 IC 功率器件。我打來電話。兩家公司都致力於器件製造,並在先進的 CMOS 矽試制線上開發了 GaN 功率器件、混雜和單片集成 IC 形式以及 200mm QST 基板。 Imec 和 Qromis 正在與德國 GaN MOCVD 設備製造商 Aixtron 合作開發 GaN-on-QST 外延。許多行業專家認為,全球處理 300 毫米晶圓的集成電路 (IC) 半導體晶圓廠數量將從 2002 年的 15 家增加到 2023 年的 138 家。

預計亞太地區將佔據主要份額

  • 預計從 2021 年到 2022 年,半導體晶圓市場的 200 毫米晶圓產量將增加。到 2025 年,對 300 毫米晶圓的需求預計將增長,所研究的市場也可能見證進步和創新。由於其在半導體製造領域的主導地位,亞太地區也主導著鋸片市場。 SiC襯底的高市場價格和對LED的不斷增長的需求迫使許多亞洲製造商轉向GaN晶圓。然而,在2019-2020年,許多中國LED製造商過量生產了GaN晶圓。同樣在 MOCVD(Metalorganic Chemical Vapor Deposition)市場,GaN LED 的產量遠大於產量。
  • 過去十年,中國的半導體產業呈現上升趨勢。據中國工信部統計,2018年中國廠商半導體銷售額達973億美元,約占同年全球半導體銷售額的20%。該國的目標是到 2020 年生產 40% 的半導體,到 2025 年生產 70% 的半導體。
  • 中國政府的“中國製造 2025”國家戰略規劃也對出版物的增長做出了重大貢獻。該計劃的核心目標是發展半導體產業。此外,中國國家知識產權局 (CNIP) 的 2021 年預算預計到 2023 年每年將有 200 萬份申請,這有望推動研究市場的增長。
  • 此外,台積電錶示有興趣並最終確定了在亞利桑那州建立先進的 5 納米晶圓廠的計劃。該公司董事會還批准了對位於亞利桑那州的一家全資鑄造廠的 35 億美元投資。此外,它還表示,將在2021年至2029年共投資120億美元,建設12英寸晶圓廠,並採用最先進的5nm工藝生產芯片。

競爭格局

矽外延片市場競爭適度,由許多主要參與者組成,例如 SweGaN、GlobalWafers Japan、Siltronic AG、II-VI Incorporated、Sumco Corporation 等。就市場份額而言,目前沒有一家主要參與者在市場上佔據主導地位。隨著對產品創新的日益關注,公司也在進行併購以保持競爭力。

  • August 2022-II-VI Incorporated 投資了 1 億美元的合同,為電力電子設備供應碳化矽襯底,以滿足天宇長期客戶的供應需求。
  • 2022 年 6 月-SK Siltron Corporation. Ltd. 宣布計劃投資 8.1 億美元,到 2024 年上半年擴大其國內產能,並從那裡增加產量。

其他福利。

  • Excel 格式的市場預測 (ME) 表
  • 三個月的分析師支持

內容

第1章介紹

  • 研究假設和市場定義
  • 調查範圍

第2章研究方法

第 3 章執行摘要

第 4 章市場洞察

  • 市場概覽
  • 工業吸引力 - 波特五力分析
    • 供應商的議價能力
    • 供應商的議價能力
    • 新進入者的威脅
    • 競爭公司之間的敵對關係
    • 替代品的威脅
  • 工業價值鏈分析
  • COVID-19 對市場的影響

第5章市場動態

  • 市場驅動力
    • 技術小型化
    • 對高性能照明的需求增加
  • 市場製約因素
    • 設計複雜性

第 6 章市場細分

  • 按應用
    • 電力電子
    • MEMS
    • 射頻電子
    • 光子學
  • 按地區列出
    • 中國
    • 台灣
    • 韓國
    • 北美
    • 歐洲
    • 世界其他地區

第 7 章外延晶圓的詳細映射和優選應用

第 8 章外延生長應用和機會

第9章外延片的主要特性

第10章其他類型詳細分析

詳細的晶圓分析(GaAS、GaN/襯底、InP 等)

第 11 章競爭格局

  • 公司簡介
    • SweGaN AB
    • Sumco Corporation
    • GlobalWafers Japan CO. Ltd
    • Siltronic AG
    • MOSPEC Semiconductor Corporation
    • IQE PLC
    • II-VI Incorporated
    • SHOWA DENKO K.K.

第 12 章供應商市場份額分析供應商晶圓市場的市場份額分析

第13章投資分析

第 14 章投資分析市場的未來

簡介目錄
Product Code: 66423

The Silicon Epitaxial Wafer Market is expected to register a CAGR of 4.42% during the forecast period. The growing demand for advanced semiconductors and increasing innovative end-user applications drive the market studied. Epitaxial is mainly done to enhance the functionality of wafers. In recent years, technology has become essential for manufacturing highly integrated semiconductor elements (ICs), image sensors (CIS), and specific power semiconductors.

Key Highlights

  • Semiconductor silicon wafer remains the core component of many microelectronic devices and forms the cornerstone of the electronics industry. With digitization and electronic mobility being the current trends in technology, these products are finding applications in many devices.
  • Currently, the demand for silicon wafers in the market exceeds the supply in the industry. This factor creates considerable scope for expansion, as the companies utilize this trend to expand their market shares by ramping up production.
  • In addition, the demand for small-sized gadgets has increased the requirement for more functionalities from a single device. This means that an IC chip should now house more transistors to support more functionalities. Thus, the advancements in wireless computing devices, such as smartphones and tablets, have helped increase semiconductor designers' design activities. Further, the growing need for miniaturization in electronics (due to the demand for thinner wafers that consume low power) is expected to drive some advancements in the silicon epitaxial wafer market over the forecast period.
  • The average prices in the industry are increasing. For instance, the Japanese company, Shin -Etsu Chemical Co . , which holds most of the market share, announced a price hike on all silicon wafer products to rise from 10 % -20 % from April 2021 onwards. The companies are taking advantage of the growing demand, further impacting the revenue accrued. GlobalWafer Co . , the second largest silicon wafer supplier, said that their silicon wafer production lines are fully loaded, coupled with the price hike, which led to an increase in revenue in March, which reached a 12 .99 % yearly increase.
  • Consumer-centric end-user industries, such as consumer electronics, have robust demand for silicon wafers, forcing vendors in the industry to expand production facilities while investing in research to innovate.
  • Due to COVID-19, China disrupted the country's supply chain and production. Major semiconductor manufacturing industries have been significantly affected due to China becoming a world production center over the past two to three decades.

Key Market Trends

Power Electronics is Expected to Significant Share

  • The growing need for power-efficient products is one of the major factors driving the demand for the epitaxial wafer for power electronics products across all the end-user industries. Therefore, the market vendors are targeting a wide range of industries to mitigate risk and expand their customer base.
  • The IGBT and MOSFET markets may continue to increase, but a part of the market is expected to go to SiC, especially when discussing modules for EV/ HEV. Moreover, the demand for power MOSFET is supported by its growing use in replacing insulated-gate, bipolar transistors, and thyristors. Additionally, the significant advantage of using power MOSFET in reinforcing the power efficiency of devices at low voltages further drives the demand for the global power MOSFET market.
  • The increasing usage of power electronics in consumer devices also fuels the demand. The growing penetration of smartphones and smart devices, increasing the adoption of IoT devices, and increasing industrial usage are also developing markets for power electronics. The high demand for power electronics devices has also resulted in a shortage of 200 mm wafers in 2018 and 2019. The customer demand is falling because major customers still have vast equipment inventory. The long-term growth in the power electronics market is also driving 300 mm wafer-based production. More than seven global power electronics vendors have announced an investment in new fabrication capabilities to be in production from 2021.
  • Imec and Qromis have collaborated for the developed enhancement-mode, p-GaN discrete, and IC power devices on 200 mm QST substrates, with epitaxy layers grown in Aixtron's G5+ C 200 mm MOVCD platform. Both companies have been working on device fabrication, developing GaN power devices, indiscreet and monolithically-integrated ICs forms, and 200 mm QST substrates in an advanced CMOS silicon pilot line. Imec and Qromis have collaborated with Germany-based GaN MOCVD equipment manufacturer, Aixtron on GaN-on-QST epitaxy development. Many industrial experts claim that the number of integrated circuits (IC) semiconductor fabrication plants processing 300 mm wafers worldwide are expected to grow from 15 in 2002 to 138 by 2023.

Asia Pacific is Expected to Hold Major Share

  • The semiconductor wafer market is expected to ramp up 200 mm manufacturing between 2021-2022. The demand for 300 mm wafers is expected to grow by 2025; the market studied may also witness advancement and innovation. Due to their dominance in semiconductor manufacturing, Asia-Pacific is also dominating the market looked. The high market price of the SiC substrate and the growing LED demand forced many Asian manufacturers to GaN wafers. However, in 2019-2020, many Chinese LED manufacturers overproduced GaN wafers. The Metalorganic Chemical Vapour Deposition (MOCVD) market is also witnessing a significant overcapacity for GaN LED production compared to what is produced.
  • The semiconductor industry of China has been showing an upward trend for the past ten years. According to China's Ministry of Industry and Information Technology, semiconductor sales by Chinese manufacturers reached USD 97.3 billion in 2018, which is around 20% of the global semiconductor revenue for the year. The country aims to produce 40% of the semiconductors it uses by 2020 and 70% by 2025.
  • The Chinese government's Made in China 2025 national strategic plan has also been a significant factor in the publications' rise. The central aim of the plan is the growth of the semiconductor industry. Further, China's National Intellectual Property Administration (CNIP) 2021 budget anticipates 2 million filings per year till 2023, which is expected to drive the growth of the studied market.
  • Moreover, TSMC cited its interest and finalized its plan to build an advanced 5-nanometer wafer plant in Arizona. The company's board of directors had also approved investing USD 3.5 billion in a wholly-owned foundry in Arizona. It also stated to spend a total of USD 12 billion from 2021 to 2029 to build a 12-inch wafer plant to produce chips using the advanced 5nm process.

Competitive Landscape

The Silicon Epitaxial Wafer Market is moderately competitive and consists of many significant players SweGaN, GlobalWafers Japan CO. Ltd, Siltronic AG, II-VI Incorporated, and Sumco Corporation. None of the major players currently dominate the market in terms of market share. Along with an increased focus on product innovation, the companies also engage in mergers and acquisitions to stay competitive.

  • August 2022 - II-VI Incorporated has invested in a USD 100 Million Contract to Supply Tianyu with Silicon Carbide Substrates for Power Electronics to meet the requirements of Tianyu's supply with long-term customers.
  • June 2022 - SK Siltron Corporation. Ltd. announced a plan to spend USD 810 million on expanding its domestic capacity by the first half of 2024, from which it plans to ramp up output.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Suppliers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Intensity of Competitive Rivalry
    • 4.2.5 Threat of Substitutes
  • 4.3 Industry Value Chain Analysis
  • 4.4 Impact of COVID-19 on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Miniaturization of Technology
    • 5.1.2 Rise in Demand of High Performance Lighting
  • 5.2 Market Restraints
    • 5.2.1 Complexities Associated with the Design

6 MARKET SEGMENTATION

  • 6.1 By Applications
    • 6.1.1 Power Electronics
    • 6.1.2 MEMS
    • 6.1.3 RF Electronics
    • 6.1.4 Photonics
  • 6.2 By Geography
    • 6.2.1 China
    • 6.2.2 Taiwan
    • 6.2.3 Korea
    • 6.2.4 North America
    • 6.2.5 Europe
    • 6.2.6 Rest of the World

7 DETAILED MAPPING OF EPITAXIAL WAFER TYPE WITH PREFERRED APPLICATION

8 EPITAXIAL GROWTH APPLICATIONS AND OPPORTUNITIES

9 KEY ATTRIBUTES OF AN EPITAXIAL WAFER

10 DETAILED ANALYSIS ON OTHER TYPES

OF WAFERS (GaAS ,GaN/Substrate, InP, etc.)

11 COMPETITIVE LANDSCAPE

  • 11.1 Company Profiles
    • 11.1.1 SweGaN AB
    • 11.1.2 Sumco Corporation
    • 11.1.3 GlobalWafers Japan CO. Ltd
    • 11.1.4 Siltronic AG
    • 11.1.5 MOSPEC Semiconductor Corporation
    • 11.1.6 IQE PLC
    • 11.1.7 II-VI Incorporated
    • 11.1.8 SHOWA DENKO K.K.

12 VENDOR MARKET SHARE ANALYSIS WAFER MARKET

13 INVESTMENT ANALYSIS

14 FUTURE OF THE MARKET