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市場調查報告書

原子層沉積(ALD)的全球市場 - 成長,趨勢,預測(2019年∼2024年)

Atomic Layer Deposition Market - Growth, Trends, and Forecast (2019 - 2024)

出版商 Mordor Intelligence LLP 商品編碼 866620
出版日期 內容資訊 英文 100 Pages
商品交期: 2-3個工作天內
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原子層沉積(ALD)的全球市場 - 成長,趨勢,預測(2019年∼2024年) Atomic Layer Deposition Market - Growth, Trends, and Forecast (2019 - 2024)
出版日期: 2019年06月01日內容資訊: 英文 100 Pages
簡介

原子層沉積(ALD)除了在先進晶片的製造中使用,也可以用作新材料的生成,原子層沉積(ALD)解決方案的需求增加。主要根據對電子設備的小型化的持續性的配合措施,原子層沉積(ALD)現在急速發展。

本報告提供全球原子層沉積(ALD)市場調查,市場概要,各產品、用途、地區的市場規模的變化與預測,市場成長要素及阻礙因素分析,競爭情形,主要企業的簡介等全面性資訊。

目錄

第1章 簡介

  • 調查範圍
  • 調查的前提條件
  • 調查成果

第2章 調查方法

第3章 摘要整理

第4章 市場動態

  • 市場概況
  • 成長要素及阻礙因素分析
  • 市場成長要素
    • 微電子及消費者家電的需求增加
    • 現有及現在開發中的應用的廣範圍用途
  • 市場阻礙因素
    • 對更優秀產品的開發為目的之研究開發的高額投資
  • 產業價值鏈分析
  • 波特的五力分析
    • 買方議價能力
    • 供給企業談判力
    • 新加入業者的威脅
    • 替代品的威脅
    • 競爭企業間的敵對關係

第5章 市場區隔

  • 各產品類型
    • 氧化鋁ALD
    • 金屬ALD
    • 催化劑ALD
    • 等離子增強ALD
  • 各用途
    • 半導體、電子產品
    • 太陽能設備
    • 醫療設備
  • 各地區
    • 北美
    • 歐洲
    • 亞太地區
    • 中南美
    • 中東、非洲

第6章 競爭情形

  • 企業簡介
    • Applied Materials Inc
    • Lam Research Corporation
    • Entegris Inc
    • Veeco Instruments, Inc
    • Oxford Instruments plc
    • Tokyo Electron Glass
    • Beneq Oy
    • ASM International NV
    • Kurt J. Lesker Company
    • Picosun Oy

第7章 投資分析

第8章 市場機會及未來趨勢

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目錄
Product Code: 65283

Market Overview

The demand for atomic layer deposition (ALD) solutions is increasing, as it enables the use of new materials and designs for advanced chip manufacturing. ALD is considered as one of the superior deposition methods, for producing conformal and thin films. Moreover, it is a key procedure in the fabrication of the semiconductor devices based on the sequential use of gas phase chemical procedure.ALD is currently rapidly evolving, mostly driven by the continuous trend to miniaturize electronic devices

  • The growing use of ALD film coating techniques in the fabrication of a variety of electronic devices and components in the semiconductor industry is one of the significant factors driving the growth of the market. The growing use of component miniaturization is also contributing positively to the growth of the market.
  • The market is also witnessing an increase in the demand for ALD in photovoltaic (PV) cells, thereby leading to its growth. With the advancements in technology, the use of ALD as manipulation and fabrication tools in nanotechnology is anticipated to accelerate.

Scope of the Report

Atomic Layer Deposition, an advanced deposition technique allows ultra-thin films of a few nanometres to be deposited in a precisely controlled way. ALD provides excellent thickness control and uniformity, it also enables 3D structures to be covered with a conformal coating for high-aspect-ratio structures. The self-limiting nature of the process and the related capacity for conformal deposition are the basis for its importance as a scaling and 3D enabler.

Key Market Trends

Increase in Demand for Microelectronics and Consumer Electronics to Fuel the Demand

  • The rise in the sale of microelectronics and consumer electronics is expected to fuel the demand for semiconductor ICs, during the forecast period. The increase in demand for semiconductor ICs is projected to improve the production capacity of semiconductor device manufacturers, which, in turn, would augment the demand for the atomic layer deposition market.
  • Besides, governments and industry stakeholders are keenly following the advancements in the microelectronics industry, as these technologies might potentially disrupt and boost the Internet of Things. The industry has been investing in enhancing chip performance too. For e.g. in June 2018, Applied Materials Inc. announced a breakthrough in materials engineering, which accelerates chip performance in the AI and Big Data era. The company's unique integrated materials solution combines dry clean, ALD, PVD, and CVD on the Endura platform, enabling the customers to quicken the adoption of cobalt.
  • Many manufacturing companies prefer the atomic layer deposition technique to produce smaller components with comparatively low costs with the demand for miniaturization growing every day. As device requirements push towards smaller and more spatially demanding structures, ALD has demonstrated potential advantages over alternative deposition methods, such as chemical vapor deposition (CVD) and various physical vapor deposition (PVD) techniques, due to its conformality and control over materials thickness and composition. This broad adoption of ALD is expected to fuel the growth of the market studied.

Asia-Pacific Expected to Witness the Highest Growth Rate

  • Asia-Pacific accounted for the most significant market share, in the atomic layer deposition equipment market. The growth of the regional market can be attributed to the progression of electronics and semiconductor industries, mainly in China. The deep-rooted electronics manufacturing base in China, South Korea, and Taiwan has led to an increased demand for deposition technologies.
  • Further, in a region which has a lot restrictive regulatory policies on FDI across industries, according to the Economic Outlook for Southeast Asia, China and India 2018: Fostering Growth through Digitalisation report by OECD 2018, the electronics-manufacturing sector is more open to FDI, compared with the national averages for all sectors combined. Government policies have aided the establishment of the dynamic electronics industry in the region.
  • The rise in industrialization and increase in the number of end-user industries in developing economies, such as China and India, have offered numerous untapped opportunities. Moreover, China, Indonesia, Japan, South Korea, and Taiwan have led the ALD growth, due to increasing solar panel manufacturing and installations.
  • Additionally, the rising demand for electronic components in the automotive industry is anticipated to increase the demand for semiconductors, in the region. This, in turn, directly impacts the growth of the market studied, in a positive manner.

Competitive Landscape

The Atomic Layer Deposition market has a number of significant players operating at the global and regional level. The major players include Applied Materials, Inc., Entegris, Inc., Oxford Instruments plc, Veeco Instruments, Inc., Lam Research Corporation, Tokyo Electron Limited, ASM International NV and a number of niche players completely dedicated to developing ALD technology-based tools and solutions. There has been a number of acquisitions, expansions, and strategic partnerships in this highly competitive market in the recent past.

  • January 2019 - Semiconductor equipment solution providers, Oxford Instruments Plasma Technology and ULVAC Inc., announced a key partnership to bring leading-edge deposition and etch technology solutions to GaN and SiC-based Wide Band Gap production customers in Japan. Oxford Instruments Plasma Technology's Atomic Layer Deposition (ALD) and Atomic Layer Etch (ALE) are critical process steps for GaN and SiC-based devices to enable functionality and reliable device manufacturing.
  • July 2018 - ASM International NV announced the expansion of its atomic layer deposition (ALD) portfolio with the Synergis 300 MM tool for advanced-node logic and memory high-volume production. The latest addition to ASM's industry-leading line of ALD tools addresses a wide range of thermal ALD applications.
  • May 2017 - Veeco Instruments Inc. announced the successful completion of its acquisition of Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and LEDs. With this acquisition, Veeco also gained control of Cambridge Nanotech(CNT), an Ultratech subsidiary.CNT, founded in 2003, grew directly out one of the foremost atomic layer deposition research groups in the world. The Gordon Lab at Harvard University.CNT acquisition helped Veeco to consolidate its position as the leading ALD supplier to academic and industrial institutions worldwide.

Reasons to Purchase this report:

  • The market estimate (ME) sheet in Excel format
  • Report customization as per the client's requirements
  • 3 months of analyst support

Table of Contents

1 INTRODUCTION

  • 1.1 Scope of the Study
  • 1.2 Study Assumptions
  • 1.3 Study Deliverables

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Introduction to Market Drivers and Restraints
  • 4.3 Market Drivers
    • 4.3.1 Increase in Demand for Microelectronics and Consumer Electronics to Fuel the Demand
    • 4.3.2 Extensive Use in Current and Developing Applications
  • 4.4 Market Restraints
    • 4.4.1 High Capital Investment in R&D for Developing Upgraded Products
  • 4.5 Industry Value Chain Analysis
  • 4.6 Industry Attractiveness - Porter's Five Force Analysis
    • 4.6.1 Bargaining Power of Suppliers
    • 4.6.2 Bargaining Power of Buyers/Consumers
    • 4.6.3 Threat of New Entrants
    • 4.6.4 Threat of Substitute Products
    • 4.6.5 Intensity of Competitive Rivalry

5 MARKET SEGMENTATION

  • 5.1 By Product Type
    • 5.1.1 Aluminum Oxide ALD
    • 5.1.2 Metal ALD
    • 5.1.3 Catalytic ALD
    • 5.1.4 Plasma Enhanced ALD
  • 5.2 By Application
    • 5.2.1 Semiconductor and Electronics
    • 5.2.2 Solar Devices
    • 5.2.3 Medical Equipment
  • 5.3 Geography
    • 5.3.1 North America
    • 5.3.2 Europe
    • 5.3.3 Asia-Pacific
    • 5.3.4 Latin America
    • 5.3.5 Middle East & Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Applied Materials Inc.
    • 6.1.2 Lam Research Corporation
    • 6.1.3 Entegris Inc.
    • 6.1.4 Veeco Instruments, Inc.
    • 6.1.5 Oxford Instruments plc
    • 6.1.6 Tokyo Electron Limited
    • 6.1.7 Beneq Oy
    • 6.1.8 ASM International NV
    • 6.1.9 Kurt J. Lesker Company
    • 6.1.10 Picosun Oy

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS

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