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市場調查報告書

電源模組包裝的全球市場 - 成長,趨勢,預測(2019年∼2024年)

Power Module Packaging Market - Growth, Trends, and Forecast (2019 - 2024)

出版商 Mordor Intelligence LLP 商品編碼 850320
出版日期 內容資訊 英文 120 Pages
商品交期: 2-3個工作天內
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電源模組包裝的全球市場 - 成長,趨勢,預測(2019年∼2024年) Power Module Packaging Market - Growth, Trends, and Forecast (2019 - 2024)
出版日期: 2019年05月01日內容資訊: 英文 120 Pages
簡介

全球電源模組包裝市場在2018年估算為15億3,000萬美元,至2024年預計將以9.79%的年複合成長率發展成長到24億4,000萬美元的規模。現在,應該對應化石能源的課題利用永續的清潔能源。由於混合電動車(HEV)和電動車(EV)的普及,促進該市場成長。

本報告提供全球電源模組包裝市場調查,市場概要,各技術、地區的市場規模的變化與預測,市場成長要素及阻礙因素分析,競爭情形,主要企業的簡介等全面性資訊。

目錄

第1章 簡介

  • 調查成果
  • 調查的前提條件
  • 調查範圍

第2章 調查方法

第3章 摘要整理

第4章 市場動態

  • 市場概況
  • 成長要素及阻礙因素分析
  • 成長要素
    • 產業用及家用電子電器市場區隔的需求增加
    • 能源效率高的設備需求高漲
  • 阻礙因素
    • 新技術的採用晚
  • 波特的五力分析
    • 買方議價能力
    • 供給企業談判力
    • 新加入業者的威脅
    • 替代品的威脅
    • 競爭企業間的敵對關係
  • 技術概要

第5章 市場區隔

  • 各技術
    • 基板
    • 為基礎的板
    • 粘晶
    • 基板附著
    • 封裝
    • 互相連接
  • 各地區
    • 北美
    • 歐洲
    • 亞太地區
    • 其他地區

第6章 競爭情形

  • 企業簡介
    • 富士電機
    • Infineon Technologies AG
    • 三菱電機
    • SEMIKRON
    • Amkor Technology Inc.
    • 日立
    • STMicroelectronics N.V

第7章 投資分析

第8章 市場機會及未來趨勢

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目錄
Product Code: 65328

Market Overview

The power module packaging market was valued at USD 1.53 billion in 2018 and is expected to reach a value of USD 2.44 billion by 2024, at a CAGR of 9.79%. Currenlty people are exploiting sustainable and clean energy to mitigate the global crisis of fossil energy. Thus, the demand for sustainable energy is increasing. So with the global interests and efforts to popularize hybrid electric vehicle (HEV) and electric vehicle(EV), the automotive module has seen steep growth. In turn, driving the power module packaging market.

  • Moreover, more powerful electronic applications are deploying power modules instead of discrete components, in order to increase performance and reduce losses. Thus, mastering power module assembly is mandatory for manufacturers and is set to fuel innovation in the packaging design.
  • For instance, in January 2018, Mitsubishi Electric Corporation announced that it has developed a 6.5 kV full silicon carbide (SiC) power semiconductor module that is believed to offer the highest power density among other power semiconductors modules rated from 1.7 kV to 6.5 kV. It is expected that the module to lead to smaller and more energy-efficient power equipment for high-voltage railcars and electric power systems.
  • Also, the growing dependence on automation and power electronics across various industries has made the need for backup power protection more crucial, to ensure no disruptions in the business model, which is expected to boost the adoption of UPS systems at a healthy rate, further driving the demand for power modules.
  • However, common failure in a power module caused by thermal cycling and mismatch of coefficient of thermal expansion (CTE) results in layers to detach one from the other, thus restraining the market.

Scope of the Report

A power electronic module or power module acts as a physical container for the storage of several power components, usually power semiconductor devices. The market growth is driven by a reduction in wastage of energy, use of efficient distributed cooling schemes, reduction in footprint, and consequent increase in power density. Also, the growing demand for power modules in industrial and consumer electronics sector is set to drive the power module packaging market.

Key Market Trends

Increasing Focus on Renewable Energy to Drive the Market Growth

  • The International Renewable Energy Agency stated that at the end of 2018, global renewable generation capacity amounted to 2351 GW. It showed an increase of 7.9% compared to last year. Wind and solar energy accounted with capacities of 564 GW and 486 GW respectively.
  • As power modules in renewables are used in wind turbine inverters, photovoltaic inverters, and micro-inverters, they are expected to witness an increased adoption. Power modules in PV enable the control systems to get power from the solar panels directly and ensure reliable operation. Thus, the growing adoption of solar power is likely to drive the demand for power modules. In turn, driving the power module packaging demand.
  • In 2018, Sierra Club and SunPower partnered to help create a sustainable future. This alliance between SunPower and the Sierra Club further helped the Sierra Club's overall efforts to advance climate solutions and move the U.S. toward 100 percent renewable energy.

Asia-Pacific is expected to Register Highest Growth Rate

  • According to IRENA," renewable capacity expansion continues to be driven mostly by new installations of solar and wind energy. These accounted for 84% of all new capacity installed in 2018. Asia accounted for 61% of new capacity installations in 2018.
  • Renewable capacity expansion continues to be driven mostly by new installations of solar and wind energy. These accounted for 84% of all new capacity installed in 2018. China continued to account for most expansion in wind energy with increases of 20 GW. While India expanded for more than 1 GW in 2018.
  • On the same time, the increasing industrialization and the booming urban population in the region are expected to boost car ownership. The governments of countries, like China and India, where the pollution is rampant, are taking actions to reduce the pollution issue thereby resulting in the rise in sales of the alternative fuel engines and green vehicles, such as the micro, mild, and full-hybrid vehicles.

Competitive Landscape

The power module packaging market is fragmented because of many major players are in this market. Some of the major players are Fuji Electric Co. Ltd., Infineon Technologies Ag, Mitsubishi Electric Corporation, among others. It is a very dynamic market, where continuous innovations and material enhancements and a lot of R&D investment are needed. Also, to remain competitive in an open market, power module makers must deliver high reliability while remaining cost-efficient.

  • February 2019 - Infineon Technologies Ag extends its portfolio of CoolSiC™ power modules for UPS and energy storage applications. Infineon claims that the CoolSiC 2B power modules enable engineers to reduce total system costs by increasing power density. The product is capable of 80% lower switching losses compared to silicon variants, maximizing the inverter efficiency levels to reach over 99%.

Reasons to Purchase this report:

  • The market estimate (ME) sheet in Excel format
  • Report customization as per the client's requirements
  • 3 months of analyst support

Table of Contents

1 INTRODUCTION

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Introduction to Market Drivers and Restraints
  • 4.3 Market Drivers
    • 4.3.1 Increasing Demand from Industrial and Consumer Electronics Segment
    • 4.3.2 Rising Demand for Energy-efficient Devices
  • 4.4 Market Restraints
    • 4.4.1 Slow Adoption of New Technologies Derailing Innovation
  • 4.5 Industry Attractiveness - Porter's Five Force Analysis
    • 4.5.1 Threat of New Entrants
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Bargaining Power of Suppliers
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry
  • 4.6 TECHNOLOGY SNAPSHOT

5 MARKET SEGMENTATION

  • 5.1 By Technology
    • 5.1.1 Substrate
    • 5.1.2 Baseplate
    • 5.1.3 Die Attach
    • 5.1.4 Substrate Attach
    • 5.1.5 Encapsulations
    • 5.1.6 Interconnections
  • 5.2 Geography
    • 5.2.1 North America
    • 5.2.2 Europe
    • 5.2.3 Asia-Pacific
    • 5.2.4 Rest of the World

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
  • 6.2 Fuji Electric Co. Ltd
  • 6.3 Infineon Technologies AG
  • 6.4 Mitsubishi Electric Corporation (Powerex Inc)
  • 6.5 SEMIKRON
  • 6.6 Amkor Technology Inc.
  • 6.7 Hitachi Ltd
  • 6.8 STMicroelectronics N.V

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS

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