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市場調查報告書
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1137874

功率半導體市場 - COVID-19 的增長、趨勢、影響、預測(2022-2027 年)

Power Semiconductor Market - Growth, Trends, and Forecasts (2022 - 2027)

出版日期: | 出版商: Mordor Intelligence | 英文 130 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計全球功率半導體市場在此期間的複合年增長率為 3.3%。

功率半導體的作用與普通半導體相同,但規模要大得多。功率半導體是具有與普通半導體相同功能的高性能元件,可以處理數千兆瓦的大電流、高電壓和高頻率。與其他半導體器件一樣,它們用於整流和放大電信號以及打開和關閉電流。常用於工業應用和遠距離輸配電。

主要亮點

  • 該材料主要由碳化矽(SiC)和氮化鎵(GaN)組成。與硅相比,GaN和SiC具有更寬的禁帶寬度(Si:1.1,SiC:3.3,GaN:3.4),因此也被稱為寬禁帶半導體。SiC MOSFET 和二極管具有高開關頻率和高功率密度,使其成為電動汽車車載充電器的理想器件。由於世界各國政府的努力,電動汽車行業繼續快速增長。
  • 2022 年 5 月,Infineon Technologies與全球現代驅動技術和電氣化解決方案提供商 Vitesco Technologies 簽署了開發碳化矽功率半導體的合作協議。碳化矽顯著提高了電動汽車驅動系統中高壓電力電子設備的效率。例如,Vitesco Technology 在管理電驅動電機的超緊湊型高壓逆變器中使用 SiC 組件。SiC 組件已經在當前一代的電子設備中使用,因為它們允許更小的尺寸和更高的效率。
  • 新成立的聯合研究實驗室配備了車載充電器(OBC)和DC/DC轉換器等車載設備評估和應用評估所需的主要設備。通過這種方式,兩家公司有望加強合作夥伴關係並加速使用 SiC 開發電源解決方案。
  • Power Delivery 為充電器帶來更多智能,從而能夠檢測連接的設備。這允許充電器在盡可能短的時間內提供充電所需的準確功率。基於 GaN(氮化鎵)的充電器可提高效率、減少熱量並減小每個產品的尺寸。
  • 此外,2021 年 5 月,日本政府在其一年增長戰略中宣布,該島國將增加支出以加強國內先進半導體設備的生產。政府已承諾提供 2000 億日元支持國內芯片製造業,目標是到 2030 年在下一代功率半導體中佔全球 40% 的份額。
  • 此外,預計到 2050 年,全球電力需求將從目前的 25,000 TWh 增長到 38,000 TWh,從而增加所有市場的電力需求。在行業層面,全球 800 萬個數據中心使用的能源佔全球能源使用量的 2-3%,預計這一比例將上升到 5% 以上。工業電機消耗 30% 並且還在增加。預計電動汽車將成為最大的消費者,到 2040 年將佔全球能源消耗的 5%(來源:GaN Systems)。GaN 降低了所有這些系統的損耗。
  • 由於 COVID-19 大流行和消費電子行業的銷售暴跌,消費電子行業對 SiC 功率半導體的市場需求一直低迷。根據 IPC International, Inc. 2020 年 3 月的調查數據,接受調查的全球電子製造商和供應商中有 40% 表示消費電子是受 COVID-19 疫情影響最嚴重的行業,他預計會有。

主要市場趨勢

汽車行業有望顯著增長

  • 由於價格更低、續航裡程更長,電動汽車現在變得越來越流行。此外,如今電動汽車變得越來越普遍,降低了價格並增加了行駛裡程。根據國際能源署(IEA)的數據,2021年全球插電式電動輕型汽車銷量將達到約660萬輛。
  • 在過去幾年中,許多原始設備製造商已宣布對電動汽車進行價值數十億美元的投資,部分原因在於二氧化碳排放法規的影響。預計未來幾年將採取重要步驟,以提高電動汽車上路的比例。半導體在電動汽車和內燃機中都發揮著重要作用。
  • 正在研究在汽車動力系統中使用 SiC(碳化矽)器件。最近的進展逐漸使 SiC 器件成為一種可行的解決方案。
  • 隨著政府鼓勵清潔能源和製造商繼續尋找使汽車更容易使用的方法,預計道路上的電動汽車數量將繼續增長。使這成為可能的是對更快、更持久、更小、更輕和更安全電池的需求推動的電池技術不斷創新。例如,採用快速充電系統的特斯拉今天已經將 SiC 整合到其車輛架構中。
  • SiC 半導體非常適合安裝在插電式混合動力汽車 (PHEV) 和電動汽車 (EV) 中的車載充電器和逆變器等應用。這是因為它比傳統的矽更節能。
  • 此外,電動汽車的長距離行駛和充電需要能夠承受高溫的電力電子設備。SiC 半導體的特點是能效超過 95%,這意味著在功率轉換過程中,例如在大功率快速充電器中充電,只有 5% 的能量以熱量的形式損失掉。
  • 此外,2021 年 5 月,Infineon Technologies宣布推出採用 CoolSiCMOSFET 技術的全新汽車電源模塊系列。使用碳化矽代替矽確保了安裝在電動汽車中的轉換器的高效率。Hyundai Motor Group報告稱,與基於矽的解決方案相比,基於Infineon CoolSiCpower 模塊的牽引逆變器能夠使車輛行駛裡程增加 5% 以上,因為這種 SiC 解決方案的損耗更低,從而提高了效率。

亞太地區預計將顯著增長

  • 亞太地區主導全球半導體市場,並在政府政策的進一步支持下,有望主導全球功率半導體市場。此外,該地區的半導體產業以中國大陸、日本、台灣和韓國為首,它們合計約佔全球分立半導體市場的 65%。越南、泰國、馬來西亞和新加坡等地區也對該市場的主導地位做出了重大貢獻。
  • 根據印度電子和半導體協會的數據,到 2025 年,該國的半導體元件市場預計將達到 323.5 億美元,複合年增長率為 10.1%(2018-2025 年)。該國已成為全球研發中心利潤豐厚的目的地。因此,由於政府正在推行“印度製造”計劃,預計對半導體市場的投資。
  • 此外,該地區是一個電子中心,每年在該地區消費數百萬台電子設備並出口到其他地方。如此高產量的電子設備和組件極大地促進了所研究的市場份額。例如,印度對消費電子產品的需求增加也推動了該地區市場的增長。據 IBEF 稱,預計 2024 年印度對電子硬件的需求將達到 4000 億美元,進一步推動市場增長。
  • 此外,Vivo 通過其印度官方推特宣布,該公司的旗艦智能手機 X80 Pro 將很快獲得 Android 13 Preview 版本。不只是這款機型,iQOO9 Pro 也已確認在本月底收到預覽版。兩款中國 OEM 智能手機都將在 2022 年 8 月 23 日之前接受 Android 13 Preview 版本。2022年8月,vivo在印度市場發布了智能手機“V25 Pro”。這是我們 V 系列中延遲時間最長的型號。該小工具配備了一個三重攝像頭設置,一個 64MP 主傳感器、一個 8MP 超廣角鏡頭和一個 2MP 微距拍攝器。
  • 此外,根據消費者技術協會的數據,中國和美國等國家是世界上最大的消費電子市場,總收入超過 3500 億美元。然而,印度和巴西等新興國家正在推動研究領域的需求和進步。例如,根據印度政府的數據,到 2024-2025 年,印度的消費電子和消費電子行業預計將翻一番,達到 14.8 億盧比。預計這將進一步增加對化合物半導體的需求。
  • 為了滿足市場需求,功率半導體製造商正在迅速採用碳化矽 (SiC) 等材料,這種材料可以在更高的電壓、溫度和頻率下工作,並提供更高的效率和可靠性。
  • 此外,2021 年 2 月,Silicon Power Corporation 將在印度 Halol(古吉拉特邦)開設子公司 SiC Fabrication Unit,為印度電子行業帶來許多機遇。這個新的 SiC 製造工廠的開業不僅將加速印度創建和發展“印度製造”電子產業的目標,而且還將減少其對進口的依賴,尤其是對來自中國的進口依賴。

競爭格局

功率半導體市場是一個由少數大玩家主導的整合市場。就市場份額而言,少數大公司主導市場。預計很快就會對專注於創新的大公司進行各種收購和合作。市場上的主要參與者包括Infineon Technologies和Texas Instruments。

  • 2021 年 3 月 - MagnaChip 宣布推出新的低壓差 (LDO) 線性穩壓器,該穩壓器具有超快瞬態響應,適用於基於通用閃存 (UFS) 的多芯片封裝 (MCP)。它是 eMMC(嵌入式多媒體控制器)的高級版本,旨在實現高速同時讀取和寫入。
  • 2021 年 3 月 - Alpha Omega Semiconductor 推出符合 AEC-Q101 標準的新型 1200V 碳化矽 (SiC) αSiC MOSFET。它非常適合滿足高效率和高可靠性要求,例如電動汽車 (EV) 車載充電器、電機驅動逆變器和非車載充電站。
  • 2021 年 2 月 - Nexperia 擴展其 LFPAK56D MOSFET 產品線,採用符合 AEC-Q101 標準的半橋封裝。動力總成、電機控制和 DC/DC 應用的寄生電感降低 60%,熱性能得到改善。

其他福利

  • Excel 格式的市場預測 (ME) 表
  • 3 個月的分析師支持

目錄

第 1 章 簡介

  • 研究假設和市場定義
  • 調查範圍

第二章研究方法論

第三章執行摘要

第四章市場洞察

  • 市場概況
  • 行業價值鏈分析
  • 行業吸引力——波特五力分析
    • 供應商的議價能力
    • 消費者議價能力
    • 新進入者的威脅
    • 競爭對手之間的競爭
    • 替代品的威脅
  • 評估 COVID-19 對市場的影響
  • 技術快照

第五章市場動態

  • 市場驅動力
    • 對消費電子產品和無線通信的需求不斷增長
    • 對節能、電池供電的便攜式設備的需求不斷增長
  • 市場製約因素
    • 矽片短缺,驅動需求波動

第六章市場細分

  • 按組件
    • 離散的
    • 模塊
    • 電源集成電路
  • 按材質
    • 矽/鍺
    • 碳化矽 (SiC)
    • 氮化鎵(江恩)
  • 按終端用戶行業
    • 汽車
    • 消費類電子產品
    • IT/通訊領域
    • 軍事/航空航天
    • 電力
    • 工業設備
    • 其他最終用戶
  • 區域信息
    • 北美
    • 歐洲
    • 亞太地區
    • 拉丁美洲
    • 中東/非洲

第 7 章 競爭格局

  • 公司簡介
    • Infineon technologies AG
    • Texas instruments Inc.
    • United Silicon Carbide Inc.
    • ST Microelectronics NV
    • NXP semiconductor Inc.
    • ON Semiconductor Corporation
    • Renesas Electronic Corporation
    • Broadcom Inc.
    • Toshiba Corporation
    • Mitsubishi Electric Corporation
    • Fuji Electric Co. Ltd
    • Semikron International
    • Cree Inc.
    • ROHM□Co Ltd
    • Vishay Intertechnology Inc.□
    • Nexperia BV□
    • Alpha & Omega Semiconductor
    • Magnachip□Semiconductor Corp
    • Microchip□Technology Inc
    • Littlefuse Inc

第八章投資分析

第九章 市場潛力

簡介目錄
Product Code: 63819

The global power semiconductor market is anticipated to register a CAGR of 3.3% during the period. Power semiconductors perform the same tasks as regular semiconductors, only on a much larger scale. These high-performance components are capable of handling extremely high electrical currents, voltages, and frequencies up to several gigawatts. Like all semiconductor devices, power semiconductors are used to rectify and amplify electrical signals or turn the flow of electricity on and off. These are typically used for industrial applications and the long-distance transmission and distribution of electricity.

Key Highlights

  • The material is majorly comprised of Silicon Carbide (SiC) and Gallium Nitride (GaN). Compared to silicon, GaN and SiC have a wider bandgap (Si:1.1, SiC:3.3, and GaN:3.4), and, therefore, it is also called Wide Band Gap Semiconductors. SiC MOSFETs and diodes offer high switching frequency and high power density and are ideally suited for electric vehicle onboard chargers. The electric vehicles industry is catering to rapid growth owing to initiatives from several governments across the world.
  • In May 2022, Infineon Technology AG and Vitesco Technologies, a global provider of the latest drive technologies and electrification solutions, signed a partnership agreement to develop silicon carbide power semiconductors. The efficiency of high-voltage power electronics in the drive systems of electrified cars is significantly improved by silicon carbide. For instance, SiC components are used by Vitesco Technologies in extremely small high-voltage inverters that manage electric drive motors. SiC components are already being used in the present generation of electronics since they allow for compact sizes and high efficiency.
  • The new joint laboratory contains major equipment required for device and application evaluation in automotive applications, such as onboard chargers (OBCs) and DC/DC converters. The firms expect that this will allow them to strengthen their partnership and accelerate the development of SiC-based power solutions.
  • Power delivery brings more intelligence to the charger and enables the detection of the device connected to it. This allows the charger to deliver the precise amount of power needed to charge it in the shortest possible time. A charger with GaN (Gallium Nitride) increases efficiency, lowers the heat, and decreases each product's size.
  • Moreover, In May 2021, the Japanese government announced under their yearly growth agenda that the island country planned to increase spending to ramp up the local production of advanced semiconductor devices. The government pledged JPY 200 billion to support the domestic chipmaking industry and aims to hold a 40% global share in next-generation power semiconductors by 2030.
  • Furthermore, power requirements are increasing in every market, as global requirements for electricity are anticipated to increase from 25,000 TWh currently to 38,000 TWh in the year 2050. At the sector level, 8 million data centers in the world use 2-3% of the world's energy use, and that share is expected to rise to more than 5%. Industrial motors consume 30% and growing; electric vehicles will become large consumers of 5% of global energy consumption by 2040 (source: GaN Systems). GaN reduces losses in all these systems.
  • With the onset of the COVID-19 pandemic and the steep nosedive sales in the consumer electronics segment, the market demand for SiC power semiconductors from the consumer electronics industry witnessed impeded growth rates. As per data from the March 2020 survey by IPC International, Inc., 40% of the global electronics manufacturers and suppliers surveyed stated that consumer electronics were expected to be the most impacted industry due to the COVID-19 outbreak.

Key Market Trends

Automotive Industry Expected to Have Significant Growth

  • Electric cars are becoming common on the road nowadays with prices coming down and range going up. In addition, electric vehicles are becoming common on the road nowadays, with prices coming down and range going up. According to the International Energy Agency, plug-in electric light vehicle sales globally reached around 6.6 million in 2021.
  • In the past few years, many OEMs have announced billions of dollars worth of investment in EVs, which is also strong due to the restrictions on CO2 emissions. Key steps will be taken in the coming years, and a higher percentage of EVs on the road will be seen. Semiconductors play a key role in both electric vehicles and those with internal combustion engines.
  • Research has been undergoing when it comes to the use of silicon carbide (SiC) devices within the automotive powertrain. Due to recent advancements, it is gradually becoming a feasible solution.
  • The number of electric vehicles out on the streets is expected to keep multiplying as governments continue to incentivize clean energy and manufacturers find ways to make their cars more accessible. A big part of making that possible is the ongoing innovation in battery technology, driven by the demand for smaller, lighter, and safer batteries that charge faster and last longer. For instance, Tesla, which uses a rapid charging solution, is already using SiC within its vehicle architectures today.
  • SiC semiconductors are ideal for applications, such as onboard chargers and inverters used within plug-in hybrid (PHEV) and fully electric vehicles (EVs). This is because their energy efficiency is significantly higher compared to traditional silicon.
  • To ensure that EVs can operate over long distances and charge within a reasonable timeframe, the vehicle's power electronics must be capable of handling high temperatures. SiC semiconductors benefit from more than 95% energy efficiency, i.e., only 5% of the energy is lost as heat during power conversion instances, such as recharging the vehicle at a high-power rapid-charger.
  • Further, in May 2021, Infineon Technologies launched a new power module with CoolSiCMOSFET technology for automotive applications. The use of silicon carbide instead of silicon ensured higher efficiency in converters in electric vehicles. Hyundai Motor Group reported that it was able to increase the range of its vehicles by more than 5% because of efficiency gains resulting from the lower losses of this SiC solution compared to the Si-based solution with the help of the traction inverters based on Infineon's CoolSiCpower module.

Asia Pacific Expected to Have Significant Growth

  • The Asia Pacific region is expected to dominate the global power semiconductor market, as the region dominates the global semiconductor market, which is further supported by government policies. Moreover, the region's semiconductor industry is driven by China, Japan, Taiwan, and South Korea, which together constitute around 65% of the global discrete semiconductor market, while others like Vietnam, Thailand, Malaysia, and Singapore also contribute significantly to the region's dominance in the market.
  • According to the Indian Electronics and Semiconductor Association, the country's semiconductor component market is expected to be worth USD 32.35 billion by 2025, registering a CAGR of 10.1% (2018-2025). The country is a lucrative destination for global R&D centers. Thus, the government's ongoing 'Make In India' initiative is expected to result in investments in the semiconductor market.​
  • Moreover, the region is an electronics hub with millions of electronic devices made annually for consumption in the region and exported to other places. This high production of electronic devices and components significantly contributes to the market share of the market studied.​ For instance, the increasing demand for consumer electronics in India has also facilitated the regional market's growth. According to IBEF, Demand for electronics hardware in India is expected to reach USD 400 billion by FY2024. which will further drive the market growth.
  • Moreover, Vivo announced from its official Indian Twitter handle that its flagship X80 Pro smartphone will soon receive the Android 13 Preview build. Although it's not the only model, the iQOO9 Pro is confirmed to receive the Preview later this month. Both smartphones from the Chinese OEMs are set to accept the Android 13 Preview build by August 23, 2022. In addition, in August 2022, Vivo announced the V25 Pro smartphone in the Indian market. It is the most delinquent V series model from the Company. The gadget packs a triple camera setup with a 64-megapixel primary sensor, an 8-megapixel ultra-wide-angle lens, and a 2-megapixel macro shooter.
  • Furthermore, countries like China and the United States are the world's largest consumer electronic markets, with combined revenues of over USD 350 billion, according to the Consumer Technology Association. However, emerging countries like India and Brazil fuel the demand and advancements in the studied segment. For instance, according to the government's data, the Indian appliances and consumer electronics industry is projected to double to INR 1.48 lakh crore by 2024 - 2025. This is further anticipated to boost the need for compound semiconductors.
  • To address market needs, power semiconductor manufacturers are quickly adopting materials such as silicon carbide (SiC), which can operate at higher voltages, temperatures, and frequencies, while delivering improved efficiency and reliability.
  • Furthermore, in February 2021, Silicon Power Corporation opened its subsidiary, the SiCfabrication unit, in Halol(Gujarat), India, bringing many opportunities for the Indian Electronics sector. The opening of this new SiCfabrication will not only accelerate India's objective to create and develop a "Make in India" Electronic devices Industry but also reduce dependence on imports, especially from China.

Competitive Landscape

The power semiconductor market is a consolidated market dominated by a few major players. In terms of market share, few of the major players dominate the market. Various acquisitions and collaborations of large companies are expected to take place shortly, which focus on innovation. Some of the key players in the market are Infineon Technologies and Texas Instruments.

  • March 2021 - Magnachip launched a new Low-dropout (LDO) linear regulator featuring an ultra-fast transient response for a Universal Flash Storage (UFS)-based Multi-Chip Package (MCP). It is an advanced version of an Embedded Multi-Media Controller (eMMC), which was developed for concurrent read and write performance at higher speeds.
  • March 2021 - Alpha and Omega Semiconductor announced the new AEC-Q101 qualified 1200V silicon carbide (SiC) αSiC MOSFETs. This is ideal for the high efficiency and reliability requirements of electric vehicles (EV) onboard chargers, motor drive inverters, and off-board charging stations.
  • February 2021 - Nexperia extended the LFPAK56D MOSFET line-up with the AEC-Q101-qualified half-bridge package. It offers 60% lower parasitic inductance and improved thermal performance for power trains, motor control, and DC/DC application.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions​ and Market Definition​
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview​
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis​
    • 4.3.1 Bargaining Power of Suppliers​
    • 4.3.2 Bargaining Power of Consumers​
    • 4.3.3 Threat of New Entrants​
    • 4.3.4 Intensity of Competitive Rivalry​
    • 4.3.5 Threat of Substitutes​
  • 4.4 Assessment of the Impact of COVID-19 on the Market
  • 4.5 Technology Snapshot

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Demand for Consumer Electronics and Wireless Communications
    • 5.1.2 Growing Demand for Energy-efficient Battery-powered Portable Devices
  • 5.2 Market Restraints
    • 5.2.1 Shortage of Silicon Wafers and Variable Driving Requirements

6 MARKET SEGMENTATION

  • 6.1 By Component
    • 6.1.1 Discrete
    • 6.1.2 Module
    • 6.1.3 Power Integrated Circuits
  • 6.2 By Material
    • 6.2.1 Silicon/Germanium
    • 6.2.2 Silicon Carbide (Sic)
    • 6.2.3 Gallium Nitride (Gann)
  • 6.3 By End-user Industry
    • 6.3.1 Automotive
    • 6.3.2 Consumer Electronics
    • 6.3.3 IT and Telecommunication
    • 6.3.4 Military and Aerospace
    • 6.3.5 Power
    • 6.3.6 Industrial
    • 6.3.7 Other End-user Industries
  • 6.4 By Geography
    • 6.4.1 North America
    • 6.4.2 Europe
    • 6.4.3 Asia Pacific
    • 6.4.4 Latin America
    • 6.4.5 Middle East and Africa

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Infineon technologies AG
    • 7.1.2 Texas instruments Inc.
    • 7.1.3 United Silicon Carbide Inc.
    • 7.1.4 ST Microelectronics NV
    • 7.1.5 NXP semiconductor Inc.
    • 7.1.6 ON Semiconductor Corporation
    • 7.1.7 Renesas Electronic Corporation
    • 7.1.8 Broadcom Inc.
    • 7.1.9 Toshiba Corporation
    • 7.1.10 Mitsubishi Electric Corporation
    • 7.1.11 Fuji Electric Co. Ltd
    • 7.1.12 Semikron International
    • 7.1.13 Cree Inc.
    • 7.1.14 ROHM​ Co Ltd
    • 7.1.15 Vishay Intertechnology Inc.​
    • 7.1.16 Nexperia BV​
    • 7.1.17 Alpha & Omega Semiconductor
    • 7.1.18 Magnachip​ Semiconductor Corp
    • 7.1.19 Microchip​ Technology Inc
    • 7.1.20 Littlefuse Inc

8 INVESTMENT ANALYSIS​​​

9 FUTURE OF THE MARKET​