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市場調查報告書

全球覆晶技術市場趨勢與預測:各晶圓凸塊流程(銅柱,錫鉛共晶焊料,無鉛焊料,金柱形凸塊),包裝流程,產品,用途,地區(2017年∼2022年)

Global Flip Chip Technology Market - Segmented by Wafer Bumping Process, Packaging Technology, Product, Application, and Region - Growth, Trends, and Forecast

出版商 Mordor Intelligence LLP 商品編碼 547020
出版日期 內容資訊 英文 109 Pages
商品交期: 最快1-2個工作天內
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全球覆晶技術市場趨勢與預測:各晶圓凸塊流程(銅柱,錫鉛共晶焊料,無鉛焊料,金柱形凸塊),包裝流程,產品,用途,地區(2017年∼2022年) Global Flip Chip Technology Market - Segmented by Wafer Bumping Process, Packaging Technology, Product, Application, and Region - Growth, Trends, and Forecast
出版日期: 2018年05月14日 內容資訊: 英文 109 Pages
簡介

全球覆晶技術市場,2016年價值達到201億9000萬美元,預計從2017年到2022年以7.56%的年複合成長率成長到312億6000萬美元。覆晶的小型化和出色的性能,I/O彈性等特性對這個市場急速成長有所貢獻。

本報告提供全球覆晶技術市場相關調查,市場概要,各晶圓傾銷流程、包裝流程、產品、用途、地區的市場趨勢,市場規模的變化與預測,市場成長、阻礙因素分析,市場佔有率,競爭情形,主要企業的簡介等,全面的資訊。

目錄

第1章 簡介

  • 調查成果
  • 市場定義
  • 市場規模

第2章 調查方法

  • 簡介
  • 調查手法

第3章 摘要整理

第4章 市場概要

  • 目前市場方案
  • 市場成長要素
    • 高包裝密度
    • 整合的容易度
  • 市場阻礙因素
  • 產業魅力 - 波特的五力分析
    • 供應商談判力
    • 消費者談判力
    • 新加入廠商的威脅
    • 替代產品及服務的威脅
    • 產業內的競爭
  • 產業價值鏈分析

第5章 市場區隔

第6章 全球覆晶技術市場:各晶圓凸塊流程

  • 銅柱
  • 錫鉛共晶焊料(Sn-Pb共晶焊料)
  • 無鉛焊料
  • 焊接金凸塊

第7章 全球覆晶技術市場:各包裝流程

  • 2D IC
  • 2.5D IC
  • 3D IC

第8章 全球覆晶技術市場:各產品

  • 記憶體
  • 高亮度發光二極體(LED)
  • RFIC,電源IC,類比IC
  • 成像
  • 2D邏輯SoC(System on a Chip)

第9章 全球覆晶技術市場:各用途

  • 醫療設備
  • 產業
  • 汽車
  • 圖形 處理 單位 & 晶片組
  • 智慧科技
  • 機器人技術
  • 電子設備

第10章 全球覆晶技術市場:各地區

  • 北美
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 西班牙
    • 義大利
    • 其他
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 澳洲
    • 印尼
    • 馬來西亞
    • 新加坡
    • 韓國
    • 其他
  • 中東、非洲
  • 南美

第11章 競爭分析 - 企業簡介

  • Amkor Technology
  • IBM Corp.
  • Intel Corp.
  • Taiwan Semiconductor Manufacturing Co.
  • Samsung Electronics Co. Ltd.
  • Texas Instruments Inc.
  • Global Foundries U.S Inc.
  • Stats Chippac Ltd.
  • NEPES PTE. LTD
  • Powertech Technology

第12章 競爭情形

  • 市場佔有率分析
  • 開發趨勢分析
  • 投資機會

第13章 覆晶技術的未來展望

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目錄
Product Code: 55573

The flip chip technology market was valued at USD 22.683 billion in 2017, and is expected to reach a value of USD 32.178 billion by 2023 at a CAGR of 5.64%, over the forecast period (2018 - 2023). The regions considered in the scope of the report include North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa.

Introduced by IBM 30 years ago, flip chip is keeping up with the times and developing new bumping solutions to serve advanced technologies, such as 2.5D and 3D. Flip chip is used for traditional applications, such as laptops, desktops, CPU, GPU, chipsets, etc. The demand for flip chips is expected to rise in mobile and wireless consumer applications, and other high performance applications, such as networks, servers, and data centers. Flip chip market is mainly driven by the emerging internet of things: a network of physical devices, vehicles, buildings, and other items that include embedded electronics, software, sensors, actuators, and network connectivity along with its technological superiority over the traditional wire bond electrical connection makes it the exceptional alternative. The flip-chip market is highly technology-driven and manufacturers are mainly focusing on discovering new technologies for the bumping process, which, in turn, is increasing the demand for raw materials required for manufacturing. However, some of the major restraints associated with the flip chip industry include the huge initial investment required for setting up new manufacturing facility and less available options for customization.

Nevertheless, growth in demand for sensors in smartphone industry and increase in application in personal electronic devices, such as personal computers and mobiles, opens new opportunities in the flip chip market. The demand of flip chip is also expected to increase in the coming years due to heavy investments in the research and development by key players, such as TSMC, Ltd, Amkor Technology, Inc., and IBM, which has led to constant improvements in chip quality.

Ease of Integration in Electronic Devices Will Drive the Growth for Flip Chip Market

A swift increase in the number of electronic devices that use flip chip technology has been observed in the recent times. The flip chip technology is revolutionizing the market, where the expansion of the Internet, digital camcorders, PDAs, desktop computers and laptops, digital cameras, mobile phones, and other electronic-based consumer products is being witnessed. With smartphones consumption increasing worldwide and rising focus on their compaction is expected to offer flip chip market a significant growth potential. Smartphones and tablets make use of flip chips, that are also known as controlled collapse chip connection.

Product functionality is in very high demand, and volume production and time-to-market have become a matter of critical importance. This amplified use of flip chip technology is driving the need for the next generation of production equipment, which includes integration and innovation. The number of applications that use flip chip technology is expected to expand rapidly over the coming few years. This factor will drive the demand for next-generation flip chip specific underfill dispensers and die bonders. The combination of both flip-chip-technology and these new platforms will provide cost-effective semiconductor packaging solutions for prominent integrated device manufacturers and original, subcontract manufacturers. Thus, the ease of integration of flip chips is expected to drive the growth of the flip chip technology market lucratively during the forecast period.

3D IC Segment To Register Highest CAGR

3D IC is expected to record the highest growth rate as it is equipped with all the additional advantages to that of 2.5D IC, such as enhanced capacity, improved performance, and reduced system space requirements and low power consumption. The growing demand for reduced latency, increasing density, greater bandwidth, and lower power consumption are driving the adoptions of 3D-IC designs. Three-dimensional integrated circuits contain multiple layers of active devices, have the potential to dramatically enhance chip performance, functionality, and device packing density. They also provide for microchip architecture and may facilitate the integration of heterogeneous materials, devices, and signals and offer a promising solution for reducing both silicon footprint and interconnect length without shrinking the transistors. A complete 3D-IC implementation is usually envisioned as a stack of active chips using TSVs to connect through each chip down to a package substrate.

Asia Pacific is Expected to Grow With a Healthy CAGR

Growing economies in this region, such as India and China impact every industry, including semiconductors. The Asia-Pacific flip chip market is expected to grow at a rapid pace, due to rising proliferation of consumer electronics in this region. With the improving economic conditions, increasing disposable income, increasing number of youth population, and rising employment rate, the consumer electronic market is flourishing in this region. China's plans to focus on semiconductor sector as a part of 12th five-year plan and strong growth of Taiwan's semiconductor and electronics industry will augment the market for Flip chip in this region. With rising internet penetration and various government initiatives, such as smart cities, smart grids and smart transportation, the IoT market is set to explode in this region over the next decade. This will create sufficient demand for the flip chip market.

Key Developments in the Market:

  • December 2017 - Samsung Electronics Co. Ltd had developed the world's smallest DRAM chip, widening its technical lead on competitors as it tracks toward a record operating profit in 2017, driven by the semiconductor business. These newly developed DRAM chips with improved energy efficiency and data processing performance will be used to gear toward premium data-crunching electronics, such as cloud computing centers, mobile devices and high-speed graphic cards.
  • March 2017 - Texas Instruments launched an analog-to-digital converter (ADC) and phase-locked loop (PLL) with an integrated voltage-controlled oscillator (VCO) that could deliver the widest bandwidth, lowest phase noise and highest dynamic range in the industry. The wideband ADC12DJ3200 is a flip-chip ball-grid array and is the fastest 12-bit ADC, delivering speeds up to 6.4 GSPS.
  • Major Players: AMKOR TECHNOLOGY INC., IBM CORPORATION, INTEL CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, SAMSUNG ELECTRONICS CO. LTD, TEXAS INSTRUMENTS INC., GLOBALFOUNDRIES U.S. INC., STATS CHIPPAC LTD, NEPES PTE LTD, POWERTECH TECHNOLOGY, among others.

Reasons to Purchase the Report:

  • Impact of advanced electronic packaging on the market
  • Analyzing various perspectives of the market with the help of Porter's Five Forces analysis
  • Regional analysis of the market
  • Identify the latest developments, market shares, and strategies employed by the major market players
  • 3-month analyst support, along with the Market Estimate sheet (in excel)

Customization of the Report:

This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.

Table of Contents

1. Introduction

  • 1.1 Scope of the Study
  • 1.2 Executive Summary

2. Research Approach and Methodology

  • 2.1 Key Deliverables of the Study
  • 2.2 Study Assumptions
  • 2.3 Analysis Methodology
  • 2.4 Research Phases

3. Market Insights

  • 3.1 Market Overview
  • 3.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 3.2.1 Bargaining Power of Suppliers
    • 3.2.2 Bargaining Power of Consumers
    • 3.2.3 Threat of New Entrants
    • 3.2.4 Threat of Substitute Products or Services
    • 3.2.5 Competitive Rivalry Among Existing Competitors
  • 3.3 Industry Value Chain Analysis

4. Market Dynamics

  • 4.1 Market Drivers
    • 4.1.1 Advancements in Electronics Packaging
  • 4.2 Market Restraints
    • 4.2.1 High Costs associated with the Technology

5. Technology Snapshot

6. Global Flip Chip Technology Market Segmentation

  • 6.1 By Wafer Bumping Process
    • 6.1.1 Copper Pillar
    • 6.1.2 Tin-Lead Eutectic Solder
    • 6.1.3 Lead Free Solder
    • 6.1.4 Gold Stud Bumping
  • 6.2 By Packaging Technology
    • 6.2.1 2D IC
    • 6.2.2 2.5D IC
    • 6.2.3 3D IC
  • 6.3 By Product
    • 6.3.1 LEDs
    • 6.3.2 RF, Power and Analog Ics
    • 6.3.3 CMOS Image sensor
    • 6.3.4 Memory
    • 6.3.5 SoC
    • 6.3.6 CPU
    • 6.3.7 GPU
  • 6.4 By Application
    • 6.4.1 Military and Defense
    • 6.4.2 Medical and Healthcare
    • 6.4.3 Industrial Sector
    • 6.4.4 Automotive
    • 6.4.5 Consumer Electronics
    • 6.4.6 Telecommunications
    • 6.4.7 Others
  • 6.5 By Region
    • 6.5.1 North America
    • 6.5.2 Europe
    • 6.5.3 Asia-Pacific
    • 6.5.4 Latin America
    • 6.5.5 Middle East & Africa

7. Competitive Intelligence - Company Profiles

  • 7.1 Amkor Technology Inc.
  • 7.2 IBM Corporation
  • 7.3 Intel Corporation
  • 7.4 Taiwan Semiconductor Manufacturing Company Limited
  • 7.5 Samsung Electronics Co. Ltd
  • 7.6 Texas Instruments Inc.
  • 7.7 GlobalFoundries U.S. Inc.
  • 7.8 Stats ChipPAC Ltd
  • 7.9 Nepes Pte Ltd
  • 7.10 Powertech Technology

List is not Exhaustive

8. Investment Analysis

9. Future of Flip Chip Technology Market

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